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STMicroelectronics BAT30-07P6FILM

Part No.:
BAT30-07P6FILM
Manufacturer:
STMicroelectronics
Category:
Diode Arrays
Package:
SOT-563, SOT-666
Datasheet:
AetrixBAT30-07P6FILM.pdf
Description:
DIODE ARR SCHOT 30V 300MA SOT666
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,664

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Product details

Overview

BAT30-07P6FILM from STMicroelectronics is a dual parallel-configured Schottky barrier diode in SOT-666 package, rated for 30 V repetitive peak reverse voltage and 300 mA continuous forward current per diode, with typical junction capacitance of 14 pF at 1 V and ultra-low forward voltage drop (530 mV at 300 mA, Tj = 25 °C), optimized for high-frequency switching in DC-DC converters and OR-ing circuits.

For engineers reviewing the BAT30-07P6FILM datasheet, BAT30-07P6FILM pinout, BAT30-07P6FILM application, or BAT30-07P6FILM equivalent, key selection criteria include low conduction loss, negligible reverse recovery, parallel diode configuration for current sharing, thermal resistance of 600 °C/W (junction-to-ambient, epoxy PCB), and compatibility with automated SMT assembly on space-constrained boards.

Technical Context

The BAT30-07P6FILM integrates two identical Schottky diodes in parallel within a single SOT-666 leadframe, enabling redundant current paths without external paralleling. Its low 0.53 V forward voltage at 300 mA reduces power dissipation versus silicon PN diodes, while sub-10 ns reverse recovery time eliminates switching tail currents in buck converter freewheeling paths.

Thermal performance is defined by Rth(j-a) = 600 °C/W on FR4 PCB with 35 µm copper, and maximum junction temperature is rated to 150 °C. The device operates with reverse leakage ≤0.5 µA at 5 V and ≤3 µA at 25 V (Tj = 25 °C), supporting stable biasing in low-power signal routing applications.

Key Specifications

Parameter Value and Actual Design Meaning
VRRM 30 V - Maximum reverse blocking capability for use in 24 V rail OR-ing and flyback clamp circuits
IF (per diode) 300 mA - Continuous forward current rating per parallel element, enabling 600 mA aggregate path with matched thermal sharing
VF @ 300 mA 530 mV typ. - Low conduction loss ensures <158 mW power dissipation per diode at full load, critical for thermally constrained layouts
Cj @ 1 V 14 pF typ. - Minimal junction capacitance preserves high-frequency efficiency in >1 MHz switching regulators
Tj(max) 150 °C - Enables operation in automotive under-hood and industrial ambient environments up to 85 °C with derating
Rth(j-a) 600 °C/W - Thermal resistance measured on standard FR4 PCB defines safe operating area for 0.125 W total dissipation
IR @ 25 V 0.65–3 µA - Low leakage supports stable voltage hold in battery backup and low-current sensing nodes

Pinout & Package

SOT-666 is a 6-pin surface-mount package with exposed thermal pad, measuring 1.50–1.70 mm × 1.50–1.70 mm × 0.45–0.60 mm height. It features three anode-cathode pairs arranged for compact dual-diode integration; pins 1/2/3 form one diode, pins 4/5/6 form the second, with shared cathode connection in parallel configuration.

Pin/Terminal Circuit Role Design Meaning
1, 4 Anode (Diode 1 & Diode 2) Independent input terminals accepting forward current into each diode; electrically isolated but thermally coupled
2, 5 Cathode (Diode 1 & Diode 2) Internally shorted output node - forms common cathode for parallel configuration, reducing effective forward resistance
3, 6 Exposed thermal pad (GND / heatsink) Non-electrical thermal interface; must be soldered to PCB copper pour to achieve specified Rth(j-a) = 600 °C/W

Key Features

Feature Design Value
Dual parallel Schottky structure Enables 600 mA aggregate forward current with matched VF drift and thermal coupling, eliminating external current-sharing resistors
Ultra-low VF (530 mV @ 300 mA) Reduces conduction loss by >40% vs. comparable 30 V silicon diodes, directly improving converter efficiency at light-to-moderate loads
14 pF junction capacitance @ 1 V Minimizes capacitive switching loss and EMI generation in >1 MHz DC-DC topologies, especially critical in point-of-load regulators
150 °C max junction temperature Supports reliable operation in sealed enclosures and high-ambient industrial control modules without forced air cooling
ECOPACK® compliant, lead-free Meets RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 1 (MSL1), suitable for no-clean reflow

Applications

Power OR-ing Circuit High-Frequency Buck Converter Freewheeling

Use Scenario: Dual-input redundant power supply where two 12 V sources feed a single load with automatic failover.

IC Role / Device Role / Timing Role: Passive OR-ing diode providing unidirectional current flow and reverse isolation between inputs.

Use Value: Parallel configuration halves effective forward resistance versus single diode, reducing voltage drop and heat rise during simultaneous sourcing.

Use Scenario: 2 MHz synchronous buck converter for FPGA core voltage, requiring fast-recovery freewheeling path.

IC Role / Device Role / Timing Role: Schottky freewheeling diode replacing body diode of low-side MOSFET during dead-time.

Use Value: 14 pF capacitance and sub-10 ns recovery minimize shoot-through risk and ringing, preserving gate driver timing margins.

Low-Power Signal Clamping USB Port ESD Protection Interface

Use Scenario: Protecting analog sensor outputs (e.g., thermistor divider) from overvoltage transients in battery-powered IoT nodes.

IC Role / Device Role / Timing Role: Clamp diode limiting signal swing to VDD + 0.5 V and GND − 0.3 V.

Use Value: 0.5 µA leakage at 5 V ensures minimal loading on high-impedance sensor nodes (<0.1% error at 10 MΩ source impedance).

Use Scenario: Secondary-level ESD protection on USB 2.0 D+/D− lines before TVS array, handling low-energy coupling events.

IC Role / Device Role / Timing Role: Fast-turn-on shunt path diverting transient current away from sensitive PHY circuitry.

Use Value: 300 mA IF rating supports sustained 100 mA fault current during system-level surge tests (IEC 61000-4-5 Level 2).

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative Part Technical Difference Application Difference Selection Advice
SS32 (Diodes Inc.) Single SOD-323 Schottky, 30 V/300 mA, VF = 500 mV @ 300 mA, Cj = 110 pF @ 0 V Larger capacitance limits use above 500 kHz; requires external paralleling for 600 mA paths Select when board layout allows discrete placement and higher Cj is acceptable for lower-frequency designs
RB520S-30 (Rohm) Single SOD-523 Schottky, 30 V/200 mA, VF = 450 mV @ 200 mA, Cj = 12 pF @ 1 V Lower current rating and no integrated parallel structure; smaller footprint but no redundancy Prefer for ultra-compact 200 mA applications where space is more critical than current headroom

Compared with SS32 and RB520S-30, BAT30-07P6FILM uniquely delivers integrated dual-diode parallel operation in SOT-666, combining 600 mA aggregate current, 14 pF capacitance, and matched thermal behavior-enabling simpler layout, better reliability, and higher frequency suitability than discrete alternatives.

Availability

BAT30-07P6FILM is available at Aetrix Electronics and suitable for DC-DC converter design, redundant power OR-ing, low-leakage signal clamping, and USB interface protection requiring stable component supply and consistent SMT assembly performance.

Supply support for BAT30-07P6FILM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

The BAT30 series belongs to ST's small-signal Schottky diode product line, engineered specifically for high-efficiency, high-frequency switching applications where low forward voltage, fast recovery, and miniature packaging are essential.

FAQ

What is the electrical configuration of BAT30-07P6FILM?

BAT30-07P6FILM contains two identical Schottky diodes connected in parallel within a single SOT-666 package: pins 1 and 4 are independent anodes, pins 2 and 5 are internally shorted cathodes, and pins 3 and 6 connect to the exposed thermal pad. This configuration provides matched VF and thermal coupling without external wiring.

Can BAT30-07P6FILM replace a single SOT-23 Schottky diode in existing designs?

Yes, provided the PCB footprint is updated to SOT-666 and the circuit benefits from parallel diode operation. Pin mapping differs significantly: BAT30-07P6FILM has six terminals (two anodes, one shared cathode, thermal pad), unlike 3-pin SOT-23. Layout redesign and thermal pad soldering are mandatory for functional replacement.

What is the maximum allowable continuous forward current for the entire device?

The device supports 300 mA per diode continuously, with both diodes operating in parallel. Total forward current capability is 600 mA only if thermal design maintains Tj ≤ 150 °C - requiring proper copper pour under the thermal pad and ambient ≤ 85 °C. Derating applies per Figure 1 in the datasheet.

Is BAT30-07P6FILM suitable for automotive applications?

BAT30-07P6FILM is not qualified to AEC-Q101 and lacks automotive-specific qualification data. While its 150 °C Tj(max) and robust construction support under-hood ambient temperatures, ST does not specify it for automotive safety-critical systems. Use only in non-safety automotive subsystems with full user responsibility for validation.

BAT30-07P6FILM Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
SOT-563, SOT-666
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Diode Configuration:
2 Independent
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io) (per Diode):
300mA (DC)
Voltage - Forward (Vf) (Max) @ If:
530 mV @ 300 mA
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
5 µA @ 30 V
Operating Temperature - Junction:
150°C (Max)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-666

BAT30-07P6FILM FAQ

1.How can I place an order for BAT30-07P6FILM through Aetrix?

Please submit a Request for Quotation (RFQ) for BAT30-07P6FILM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BAT30-07P6FILM reliable?

The price and inventory of BAT30-07P6FILM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAT30-07P6FILM is usually 5 days.

3.What payment methods are accepted for BAT30-07P6FILM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAT30-07P6FILM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BAT30-07P6FILM?

BAT30-07P6FILM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BAT30-07P6FILM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BAT30-07P6FILM?

For technical support, including BAT30-07P6FILM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAT30-07P6FILM requirements.

6.How does Aetrix verify that BAT30-07P6FILM is sourced from the original manufacturer or authorized distributors?

All BAT30-07P6FILM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAT30-07P6FILM meets industry standards.

7.What is the process for return or replacement of BAT30-07P6FILM?

All BAT30-07P6FILM units undergo pre-shipment inspection (PSI). If there is an issue with BAT30-07P6FILM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BAT30-07P6FILM part is unused and in its original packaging.

Return procedure for BAT30-07P6FILM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BAT30-07P6FILM Tags

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