STMicroelectronics BAT30F4

Overview

BAT30F4 from STMicroelectronics is a 30 V, 300 mA Schottky barrier diode in a 0201 surface-mount package, designed for rail-to-rail reverse polarity protection in space-constrained mobile applications. It delivers a typical forward voltage of 0.55 V at 300 mA and exhibits low junction capacitance (10–14 pF) and minimal reverse leakage (2.2 µA at 10 V, 25 °C), enabling efficient IC-level protection in fingerprint modules and Bluetooth earbuds.

For engineers reviewing the BAT30F4 datasheet, BAT30F4 pinout, BAT30F4 application, or BAT30F4 equivalent, key selection criteria include its 0201 footprint compatibility, low VF under high-current DC operation, thermal derating behavior up to +105 °C ambient, and ECOPACK2/RoHS-compliant packaging for high-density consumer PCBs.

Technical Context

The BAT30F4 implements a planar Schottky barrier structure optimized for low conduction loss and negligible switching losses in DC protection paths. Its junction-to-ambient thermal resistance is 450 °C/W on an epoxy PCB with minimum footprint, and it supports continuous forward current up to 300 mA with derating above 25 °C ambient.

Dynamic performance is defined by a typical junction capacitance of 10–14 pF at 1 V reverse bias and 1 MHz, and reverse leakage remains below 6.0 µA at 10 V/25 °C - critical for signal integrity in biometric sensor interfaces and camera module power rails.

Key Specifications

Pinout & Package

The BAT30F4 is a two-terminal Schottky diode housed in a 0201 flat CSPS package. Pin 1 (anode) and Pin 2 (cathode) are marked on the top side with a rotational marking code "4"; orientation must be verified using the pin 1 mark-not rotation-during placement.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode protection applications.

Compared with AP7173-W5-7 and VS-30BQ015-M3/84, the BAT30F4 uniquely balances 300 mA DC capability, 0201 size, and sub-0.6 V forward drop - making it the only option validated for simultaneous use in fingerprint, camera, and earbud platforms without layout compromise.

Availability

BAT30F4 is available at Aetrix Electronics and suitable for fingerprint module protection, Bluetooth wireless earbud power path isolation, and camera module rail protection requiring stable component supply across high-volume consumer electronics programs.

Supply support for BAT30F4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

The BAT30F4 belongs to ST's ECOPACK2-qualified Schottky diode product line, engineered specifically for ultra-compact, low-loss DC protection in next-generation mobile and wearable electronics.

FAQ

What is the maximum continuous forward current for BAT30F4 at 85 °C ambient?

At 85 °C ambient temperature, the BAT30F4 supports approximately 220 mA continuous forward current, based on its derating curve (Figure 5). This value assumes mounting on an epoxy PCB with minimum recommended footprint and natural convection cooling. Exceeding this current risks junction temperature exceeding 150 °C, triggering thermal degradation.

Can BAT30F4 be used in place of a standard silicon diode for reverse polarity protection?

Yes - the BAT30F4 replaces standard PN diodes in low-voltage, high-efficiency protection roles. Its 0.55 V forward drop at 300 mA is ~50% lower than typical silicon diodes (~1.1 V), reducing power loss and heat generation. However, its higher reverse leakage (µA range vs. nA for silicon) makes it unsuitable for ultra-low-power sleep modes unless leakage is actively managed.

Is the BAT30F4 compatible with lead-free reflow profiles?

Yes - ST specifies a peak reflow temperature of 240–245 °C for 2–3 seconds, fully compliant with IPC-J-STD-020 Class 3 lead-free processes. The device withstands a maximum soldering temperature of 260 °C for 10 seconds. Reflow profile must limit ramp rates to ≤3 °C/s and hold time above 217 °C to 60–90 seconds.

Does the BAT30F4 have polarity marking on both top and bottom sides?

No - polarity marking ("4") appears only on the top side, and rotation (90° or 180°) is permitted solely to indicate assembly location. Pin 1 (anode) identification relies exclusively on the presence and position of this mark; the bottom side has no functional marking. Optical placement systems must use top-side mark recognition, not centroid alignment.