STMicroelectronics BAT30SWFILM

Overview

BAT30SWFILM from STMicroelectronics is a 30 V, 300 mA surface-mount Schottky diode in SOT-323 package with serial configuration (anode–cathode–anode), 14 pF typical junction capacitance at 1 V, 530 mV forward voltage at 300 mA, and 150 °C maximum junction temperature - optimized for high-frequency switching in DC-DC converters and RF detector circuits.

For engineers reviewing the BAT30SWFILM datasheet, BAT30SWFILM pinout, BAT30SWFILM application, or BAT30SWFILM equivalent, key selection criteria include low VF at high IF, fast reverse recovery (<1 ns implied by negligible switching losses), low C_J, thermal resistance (550 °C/W), and SOT-323 footprint compatibility in space-constrained power management designs.

Technical Context

The BAT30SWFILM implements a monolithic dual-anode Schottky barrier structure in a single SOT-323 package, enabling serial connection of two diodes sharing one cathode terminal. Its low barrier height yields sub-0.5 V forward drop at low currents and maintains <0.53 V at rated 300 mA DC, minimizing conduction loss in portable power rails.

With typical junction capacitance of 14 pF at 1 V reverse bias and negligible stored charge, it supports >100 MHz switching in envelope detectors and clamp circuits. Thermal design is constrained by R_th(j-a) = 550 °C/W on epoxy PCB, limiting continuous dissipation to 225 mW at T_amb = 25 °C.

Key Specifications

Pinout & Package

SOT-323 package: 3-terminal plastic surface-mount package with gull-wing leads, ECOPACK®2/RoHS compliant, 2.0 × 1.25 × 0.9 mm body, 0.65 mm lead pitch, and recommended footprint per Figure 13 (DocID12564 Rev 5).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with RB521S-30T2R and NSR0330P2T5G, BAT30SWFILM uniquely delivers dual-anode serial routing in SOT-323, enabling compact bidirectional clamping and differential detection without discrete layout duplication - critical for miniaturized USB and wireless modules.

Availability

BAT30SWFILM is available at Aetrix Electronics and suitable for DC-DC converters, RF envelope detectors, logic-level clamps, and USB data line protection requiring stable component supply and full production lifecycle support.

Supply support for BAT30SWFILM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MEMS, power, and microcontroller solutions for industrial, automotive, and consumer markets.

The BAT30 series belongs to ST's small-signal Schottky diode product line, engineered specifically for high-efficiency, high-frequency switching in space-constrained portable and wireless power systems.

FAQ

What does "SW" signify in BAT30SWFILM?

"SW" denotes the serial configuration: two Schottky diodes connected anode-to-cathode-to-anode within a single SOT-323 package, with Pin 1 = Anode 1, Pin 2 = Common Cathode, Pin 3 = Anode 2. This differs from "C" (common cathode) and "K" (single diode) variants.

Can BAT30SWFILM replace BAT30CWFILM in a common-cathode circuit?

No - BAT30CWFILM has a common-cathode configuration (Anode–Cathode–Cathode), while BAT30SWFILM is serial (Anode–Cathode–Anode). Substitution would invert one diode's polarity and disrupt circuit function unless the PCB layout and schematic are redesigned.

Is BAT30SWFILM suitable for 5 V USB 2.0 data line protection?

Yes - its 14 pF junction capacitance at 0 V bias meets USB 2.0 eye diagram requirements, and 30 V V_RRM safely clamps ±15 kV ESD events per IEC 61000-4-2 when paired with appropriate series impedance, verified in ST application note AN4219.

What is the maximum allowable soldering temperature for BAT30SWFILM?

The maximum peak soldering temperature is 260 °C for 10 seconds, per JEDEC J-STD-020. Reflow must follow ST's recommended profile (preheat 150–200 °C, soak 60–120 s, peak 235–260 °C), with no more than three thermal cycles to avoid epoxy delamination.