Nexperia USA Inc. BAT54C,215

Overview

BAT54C,215 from Nexperia is a dual common-cathode Schottky barrier diode in SOT23 package, designed for ultra-high-speed switching and reverse polarity protection with 30 V reverse voltage rating, 800 mV forward voltage at 100 mA, and 5 ns reverse recovery time. It integrates a guard ring for stress protection and operates across –55 °C to 150 °C ambient range.

For engineers reviewing the BAT54C,215 datasheet, BAT54C,215 pinout, BAT54C,215 application, or BAT54C,215 equivalent, key selection criteria include low VF for power-sensitive clamping, sub-10 pF capacitance for high-frequency line termination, and dual-diode configuration enabling compact dual-rail protection without discrete duplication.

Technical Context

The BAT54C,215 implements two independent Schottky junctions sharing a single cathode terminal, enabling simultaneous bidirectional clamping or independent anode routing in space-constrained layouts. Its planar die structure with integrated guard ring improves ESD robustness and thermal stability under repetitive pulse stress.

It operates with zero minority-carrier storage, delivering 5 ns trr and negligible reverse recovery charge-critical for >100 MHz digital signal integrity and flyback snubbing. Thermal resistance of 500 K/W (junction-to-ambient, FR4 PCB) defines its derating envelope up to 250 mW total dissipation at 25 °C ambient.

Key Specifications

Pinout & Package

Encapsulated in SOT23 (TO-236AB) plastic surface-mount package: 2.9 mm × 1.3 mm × 1.0 mm body, 1.9 mm lead pitch, FR4-compatible footprint per Fig. 6 (reflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky diode applications.

Compared with NSR20F30HT1G and SMBJ5.0A-E3/52, BAT54C,215 uniquely delivers dual-anode functionality in SOT23 with optimized trade-off between VF, trr, and Cd-enabling compact, high-fidelity clamping where timing and layout density are constrained.

Availability

BAT54C,215 is available at Aetrix Electronics and suitable for USB interface protection, LVDS line termination, industrial sensor power input, and automotive body control module designs requiring stable component supply and consistent SOT23 form factor.

Supply support for BAT54C,215 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The BAT54C,215 belongs to Nexperia's Schottky diode portfolio engineered for high-speed signal integrity and robust power rail protection-targeting applications where fast switching, low leakage, and small-footprint dual-diode integration are mandatory.

FAQ

Is BAT54C,215 suitable for automotive applications?

No-BAT54C,215 is explicitly non-automotive qualified per Nexperia's revision history (v.6, July 2022). It lacks AEC-Q101 qualification, automotive-grade screening, and extended temperature validation beyond 150 °C junction. For automotive use, Nexperia offers BAT54C-Q series variants with full qualification and enhanced reliability testing.

Can BAT54C,215 replace BAT54A or BAT54S in existing designs?

Only with layout and functional verification: BAT54A has anode-cathode-anode pinout (1–2–3), BAT54S is series-connected (anode–cathode–anode), while BAT54C uses dual-anode/common-cathode (1–2–3). Swapping requires PCB trace modification and may alter clamping behavior-no pin-compatible substitution exists across the BAT54 family.

What is the maximum continuous forward current for BAT54C,215?

The absolute maximum continuous forward current is 200 mA per diode at Tamb = 25 °C, limited by thermal dissipation (250 mW Ptot). Derating is required above 25 °C ambient: Rth(j-a) = 500 K/W implies ~1.2 mA/°C reduction above 25 °C, reaching zero allowable current at ~150 °C ambient.

Does BAT54C,215 require external thermal relief on PCB pads?

No-its SOT23 footprint (per Fig. 6) is optimized for standard reflow profiles on FR4 with single-sided 1 oz copper. Thermal relief is unnecessary for solderability; however, minimizing copper pour under the package improves thermal isolation during reflow and avoids uneven heating that could cause tombstoning.