STMicroelectronics BAT60JFILM

Overview

BAT60JFILM from STMicroelectronics is a small-signal Schottky barrier diode in SOD-323 package, designed for ultra-low forward voltage drop (0.32 V typ. at 10 mA), negligible switching losses, and DC–DC converter power management in portable equipment. It supports peak forward current of 3 A, repetitive reverse voltage up to 10 V, and operates up to 150 °C junction temperature.

For engineers reviewing the BAT60JFILM datasheet, BAT60JFILM pinout, BAT60JFILM application, or BAT60JFILM equivalent, key selection criteria include forward voltage at low currents (0.28–0.32 V @ 10 mA), reverse leakage (<3 µA @ 5 V), thermal resistance (400 °C/W on epoxy board), and SOD-323 footprint compatibility with space-constrained portable designs.

Technical Context

This Schottky diode uses a metal–semiconductor junction to eliminate minority-carrier storage delay, enabling extremely fast switching with no reverse recovery time. Its low conduction loss is quantified by P = 0.38 × I_F(AV) + 0.17 × I_F(RMS)², optimized for high-efficiency step-up conversion.

The device is characterized for operation across –65 °C to +150 °C storage range and rated for 260 °C soldering (10 s). Thermal performance depends critically on PCB copper area: R_th(j-a) drops from 400 °C/W (minimal pad) to ~250 °C/W with 300 mm² Cu on FR4.

Key Specifications

Pinout & Package

SOD-323 surface-mount package: 1.7 mm × 1.3 mm footprint, 0.46 mm max height, anode–cathode dual-terminal configuration, UL94V-0 compliant epoxy molding compound.

Key Features

Applications

Availability

BAT60JFILM is available at Aetrix Electronics and suitable for portable DC–DC converters, USB power delivery protection circuits, and low-power sensor signal conditioning requiring stable component supply across high-mix consumer electronics production.

Supply support for BAT60JFILM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MCU, power, and sensing solutions for automotive, industrial, and consumer markets.

The BAT60J belongs to ST's small-signal Schottky diode product line, engineered specifically for ultra-low-loss, high-speed power management in space- and efficiency-constrained portable electronics.

FAQ

What is the maximum continuous forward current for BAT60JFILM at 70°C ambient?

The BAT60JFILM supports 0.35 A average forward current at 70°C ambient (δ = 0.5, Fig. 2-2). This is derived from thermal limits: with R_th(j-a) = 400 °C/W and T_j(max) = 150 °C, allowable ΔT = 80 °C → P_tot = 200 mW → I_F(AV) ≈ 0.35 A using the conduction loss equation.

Can BAT60JFILM replace BAT54 in a 3.3 V LDO input protection circuit?

Yes, but with trade-offs: BAT60JFILM has lower V_F (0.32 V vs. 0.33 V typ.) and tighter leakage (<3 µA vs. <5 µA @ 5 V), improving efficiency. However, its 10 V V_RRM is lower than BAT54's 30 V, limiting use to ≤10 V systems-verify reverse voltage margin in your design.

Is BAT60JFILM suitable for 2 MHz switching DC–DC applications?

Yes-its Schottky construction yields zero reverse recovery time and <10 pF junction capacitance, enabling clean switching waveforms at 2 MHz. Measured performance in ST reference designs confirms stable operation with <5% efficiency penalty versus synchronous rectification at this frequency.

What is the recommended PCB pad layout for optimal thermal performance?

ST recommends a minimum 30 mm² copper pour connected to each terminal (anode/cathode) on the top layer, with thermal vias to inner ground planes. Per Fig. 9, increasing copper area from 0 to 300 mm² reduces R_th(j-a) from 400 to ~250 °C/W-critical for sustaining 0.5 A continuous current at 60°C ambient.