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Nexperia USA Inc. BAT760,115

Part No.:
BAT760,115
Manufacturer:
Nexperia USA Inc.
Category:
Single Diodes
Package:
SC-76, SOD-323
Datasheet:
AetrixBAT760,115.pdf
Description:
DIODE SCHOTTKY 20V 1A SOD323
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:74,415

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Product details

Overview

BAT760 from Nexperia is a medium-power Schottky barrier single diode in SOD323 (SC-76) package, featuring ultra-high-speed switching, 480–550 mV forward voltage at 1 A pulsed, 20 V reverse voltage rating, and guard-ring protection for stress immunity. It serves as a clamping or protection diode in DC-DC converter output stages and low-voltage rail protection circuits.

For engineers reviewing the BAT760 datasheet, BAT760 pinout, BAT760 application, or BAT760 equivalent, key selection criteria include its low VF at high IF, 5 µA typical reverse leakage at 5 V, 19–25 pF junction capacitance, thermal resistance of 220 K/W on small PCB pads, and SOD323 footprint compatibility with space-constrained portable power designs.

Technical Context

The BAT760 employs a planar Schottky structure with integrated guard ring to suppress edge breakdown under transient stress, enabling reliable operation in fast-switching DC-DC flyback and synchronous rectifier clamp paths. Its low VF minimizes conduction loss in 3.3 V/5 V rail protection, while its 1 A continuous forward current supports moderate-power load dump suppression.

Thermal performance is defined by two Rth(j-a) values: 220 K/W on 10 mm² cathode pad and 180 K/W on 40 mm² pad - confirming thermal design sensitivity to PCB copper area. Junction temperature is limited to 125 °C, with storage up to 150 °C, aligning with industrial-grade non-automotive qualification per revision v.4.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Voltage (VR) 20 V maximum - sets upper limit for clamping voltage in 12 V or lower systems without avalanche risk.
Forward Current (IF) 1 A continuous - supports sustained current in power rail protection and low-duty-cycle switching applications.
Forward Voltage (VF) 480–550 mV at 1 A pulsed - reduces power loss and self-heating in high-efficiency 3.3 V/5 V clamping paths.
Reverse Leakage (IR) 5–50 µA at 5–15 V reverse bias - ensures minimal standby current drain in battery-backed or always-on circuits.
Junction Capacitance (Cd) 19–25 pF at 5 V - enables use in <100 MHz signal clamping without excessive capacitive loading.
Thermal Resistance (Rth(j-a)) 220 K/W on 10×10 mm² FR4 pad - defines minimum PCB copper area needed to maintain Tj ≤ 125 °C at full IF.

Pinout & Package

Encapsulated in SOD323 (SC-76), a surface-mount plastic package measuring 1.7 mm × 1.25 mm × 0.95 mm with 1.3 mm lead pitch and tin-plated terminations.

Pin/Terminal Circuit Role Design Meaning
1 (K) Cathode Connected to higher-potential node during clamping; requires dedicated thermal pad on PCB for heat dissipation.
2 (A) Anode Connected to lower-potential node (e.g., ground or return path); polarity-sensitive for correct ESD/transient directionality.

Key Features

Feature Design Value
Ultra high-speed switching Sub-nanosecond recovery time inherent to Schottky architecture - eliminates minority-carrier delay in >1 MHz switching nodes.
Guard-ring protected junction Integrated guard ring suppresses edge electric field concentration - improves robustness against ESD and repetitive transients.
Very low forward voltage VF ≤ 550 mV at 1 A enables ≥95% efficiency in 3.3 V rail clamping with <0.55 W conduction loss.
Small SMD footprint SOD323 outline fits 1.7 mm × 1.25 mm board area - suitable for wearables, IoT sensors, and compact power modules.

Applications

DC-DC Converter Output Clamping USB Port ESD Protection

Use Scenario: Suppresses inductive kickback from synchronous buck converter high-side switch during turn-off.

IC Role / Device Role / Timing Role: Fast-recovery clamping diode placed between SW node and VOUT to limit voltage overshoot.

Use Value: 480 mV VF minimizes conduction loss during clamping pulses; 25 pF Cd avoids resonance with µH-level inductors.

Use Scenario: Protects USB 2.0 data lines (D+/D−) from ±8 kV contact ESD per IEC 61000-4-2.

IC Role / Device Role / Timing Role: Low-capacitance shunt diode connected between data line and ground to divert ESD current.

Use Value: 19 pF Cd preserves signal integrity up to 480 Mbps; guard ring ensures consistent clamping voltage across repeated strikes.

Low-Voltage Rail Protection Load Dump Suppression

Use Scenario: Prevents reverse current flow and overvoltage on 3.3 V logic rails during hot-swap or backup battery switchover.

IC Role / Device Role / Timing Role: Forward-biased isolation diode in series with supply path or reverse-biased clamp to ground.

Use Value: 1 A IF rating handles peak inrush; 5 µA IR at 3.3 V ensures negligible standby leakage.

Use Scenario: Limits voltage spikes on 5 V microcontroller supply during automotive-style load dump events (ISO 7637-2 Pulse 5a).

IC Role / Device Role / Timing Role: Transient voltage clamp connected between rail and ground, activated above 5.5 V.

Use Value: 20 V VR withstands 12 V system surges; 5 A IFSM peak rating absorbs short-duration energy without failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode clamping applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor NSR0230HT1G Lower VF (270 mV typ. @ 0.1 A), but only 30 V VR; SOD-123 package (larger footprint, 2.7 mm × 1.6 mm). Better for low-current (<100 mA) signal clamping; less suitable for 1 A power rail protection due to smaller thermal mass. Select when prioritizing lowest possible VF at sub-100 mA and board space is not constrained.
Vishay VS-2EDH01HM3/85A Higher IF (2 A), same VR (20 V), but larger SOD-128 package (3.5 mm × 1.7 mm); no guard ring specified. Better for sustained 1.5 A loads; lacks documented guard-ring protection for transient robustness. Select when thermal margin is critical and transient immunity is secondary to current handling.

Compared with NSR0230HT1G and VS-2EDH01HM3/85A, BAT760 uniquely balances 1 A current capability, 20 V rating, guard-ring reliability, and minimal 1.7 mm × 1.25 mm footprint - making it optimal for space-limited industrial power rails where both efficiency and transient resilience matter.

Availability

BAT760 is available at Aetrix Electronics and suitable for DC-DC converter output clamping, USB port ESD protection, and low-voltage rail protection requiring stable component supply and consistent SOD323 packaging.

Supply support for BAT760 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in Schottky diodes, MOSFETs, and ESD protection components.

BAT760 belongs to Nexperia's medium-power Schottky diode product line, engineered for industrial-grade power management and interface protection where compact size, low VF, and transient robustness are jointly required.

FAQ

Is BAT760 qualified for automotive applications?

No. Per revision v.4 (October 2022), BAT760 is explicitly designated as non-automotive qualified. It lacks AEC-Q101 certification and has not undergone automotive-grade stress testing. For automotive use, Nexperia offers Q-qualified alternatives such as PNE30030EP or PMEG3010CEH, which meet AEC-Q101 requirements including extended temperature range and enhanced reliability validation.

What is the maximum allowable soldering temperature profile for BAT760?

BAT760 follows JEDEC J-STD-020D.2 reflow guidelines for SOD323 packages: peak temperature must not exceed 260 °C for ≤ 30 seconds, with ramp-up rate ≤ 3 °C/s and ramp-down rate ≤ 6 °C/s. The device is rated for moisture sensitivity level (MSL) 1 - unlimited floor life at ≤ 30 °C/60% RH, eliminating bake requirements before assembly.

Can BAT760 be used in reverse-biased Zener-like clamping mode?

No. BAT760 is a Schottky diode with no controlled reverse breakdown characteristic. Its reverse voltage rating (20 V) is an absolute maximum stress limit - operation near or above this value risks irreversible junction damage. It functions only in forward conduction or reverse blocking modes, not as a voltage reference or avalanche clamp.

How does the guard ring affect layout recommendations?

The integrated guard ring requires unbroken copper clearance around the cathode pad to prevent field crowding at the die edge. Nexperia recommends ≥ 0.2 mm solder mask opening beyond the SOD323 outline and no traces or vias within 0.3 mm of the cathode pad perimeter. This maintains uniform electric field distribution and preserves the specified 20 V VR rating under transient conditions.

BAT760,115 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SC-76, SOD-323
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
20 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
550 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
50 µA @ 15 V
Capacitance @ Vr, F:
25pF @ 5V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOD-323
Operating Temperature - Junction:
125°C (Max)

BAT760,115 FAQ

1.How can I place an order for BAT760,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for BAT760,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BAT760,115 reliable?

The price and inventory of BAT760,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAT760,115 is usually 5 days.

3.What payment methods are accepted for BAT760,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAT760,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BAT760,115?

BAT760,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BAT760,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BAT760,115?

For technical support, including BAT760,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAT760,115 requirements.

6.How does Aetrix verify that BAT760,115 is sourced from the original manufacturer or authorized distributors?

All BAT760,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAT760,115 meets industry standards.

7.What is the process for return or replacement of BAT760,115?

All BAT760,115 units undergo pre-shipment inspection (PSI). If there is an issue with BAT760,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BAT760,115 part is unused and in its original packaging.

Return procedure for BAT760,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BAT760,115 Tags

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