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Nexperia USA Inc. BAT760/6F
- Part No.:
- BAT760/6F
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
BAT760/6F.pdf
- Description:
- DIODE SCHOTTKY 20V 1A SOD323
- Quantity:
- Payment:
- Shipping:
Inventory:5,000
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Product details
Overview
BAT760 from Nexperia is a medium-power Schottky barrier single diode in SOD323 (SC-76) package, featuring ultra-high-speed switching, 480–550 mV forward voltage at 1 A, 20 V reverse voltage rating, and guard-ring protection for stress immunity. It serves as a low-loss clamping or protection diode in DC-DC converter output stages and I/O line transient suppression circuits.
For engineers reviewing the BAT760 datasheet, BAT760 pinout, BAT760 application, or BAT760 equivalent, key selection criteria include pulsed forward voltage at 1 A, reverse leakage at 15 V, junction-to-ambient thermal resistance on FR4 PCB, and SOD323 footprint compatibility with high-density layouts.
Technical Context
The BAT760 employs a planar Schottky structure with integrated guard ring to suppress edge breakdown under transient overvoltage, enabling reliable operation in fast-switching power and signal paths. Its low VF and low Cd (19–25 pF at 5 V) support efficient high-frequency rectification and minimal capacitive loading.
Thermal performance is defined for two PCB mounting conditions: Rth(j-a) = 220 K/W on 10 mm² cathode pad and 180 K/W on 40 mm² pad - critical for derating in compact industrial power supplies and USB port protection designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 20 V maximum - sets absolute upper limit for clamping or blocking applications without avalanche breakdown. |
| Forward Current (IF) | 1 A continuous - supports medium-power rail clamping in 5 V/3.3 V systems with sustained conduction. |
| Forward Voltage (VF) | 480–550 mV at 1 A, pulsed - enables <1.1 W conduction loss at full rated current, reducing thermal load. |
| Reverse Leakage (IR) | 10–50 µA at 15 V - ensures minimal standby power loss in battery-backed protection circuits. |
| Diode Capacitance (Cd) | 19–25 pF at 5 V, 1 MHz - limits high-frequency signal distortion in ESD clamp paths and RF detector inputs. |
| Junction Temperature (Tj) | 125 °C maximum - defines safe operating envelope for ambient temperatures up to 125 °C with appropriate PCB copper area. |
Pinout & Package
The BAT760 is housed in a SOD323 (SC-76) surface-mount plastic package measuring 1.7 mm × 1.25 mm × 0.95 mm with 1.3 mm lead pitch. The package features a single-sided cathode pad optimized for thermal dissipation on FR4 PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (K) | Cathode | Connected to ground or lower-potential node; primary heat-sinking terminal via large copper pad. |
| 2 (A) | Anode | Connected to input/rail side; carries forward current during clamping or rectification events. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra high-speed switching | Sub-nanosecond recovery time inherent to Schottky architecture - eliminates minority-carrier delay in >1 MHz DC-DC feedback loops. |
| Very low forward voltage | 480–550 mV at 1 A - reduces forward conduction loss by ~40% versus standard silicon diodes in 3.3 V rail clamps. |
| Guard-ring protected | Integrated edge termination - prevents premature breakdown at cathode periphery under ESD or surge stress. |
| Very small SMD package | SOD323 footprint (1.7 × 1.25 mm) - enables placement adjacent to IC pins in space-constrained USB-C or HDMI port protectors. |
Applications
| USB Port Protection | DC-DC Converter Output Clamp |
|---|---|
|
Use Scenario: Suppresses ±15 kV HBM ESD transients on USB 2.0 D+ and D− lines before reaching PHY IC. IC Role / Device Role / Timing Role: Low-capacitance shunt clamp diode placed between data line and VBUS or GND. Use Value: 19–25 pF capacitance avoids signal integrity degradation at 480 Mbps; 20 V VR withstands VBUS coupling during hot-plug events. |
Use Scenario: Clamps inductive kickback from synchronous buck converter output during light-load discontinuous conduction mode. IC Role / Device Role / Timing Role: Freewheeling path for inductor current when high-side FET turns off. Use Value: 480–550 mV VF minimizes conduction loss during freewheeling; 1 A IF rating handles peak currents in 3 A converters. |
| I/O Line Voltage Clamping | Low-Voltage Rail Protection |
|
Use Scenario: Limits voltage excursions on microcontroller GPIO lines exposed to external sensors or connectors. IC Role / Device Role / Timing Role: Bidirectional clamp (anode to rail, cathode to signal) limiting swing to within ±0.5 V of supply. Use Value: Guard ring ensures stable clamping threshold across temperature; 10–50 µA IR prevents measurable leakage into 3.3 V logic rails. |
Use Scenario: Protects 1.8 V or 2.5 V FPGA core rails from overvoltage due to regulator fault or hot-swap sequencing errors. IC Role / Device Role / Timing Role: Cathode tied to rail, anode to higher-potential fault source - conducts only during overvoltage. Use Value: 20 V VR provides 8× margin above 2.5 V rail; SOD323 size allows placement directly at BGA power balls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky clamping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NSR0230HT1G | Lower VF (270 mV typ. @ 0.1 A), but only 30 V VR and 200 mA IF rating. | Not suitable for 1 A clamping; limited to signal-level protection below 100 mA. | Select when ultra-low VF at sub-100 mA is prioritized over power handling. |
| Vishay SS12 | Higher IF (2 A), larger SMA package (4.5 × 2.7 mm), VF = 500 mV @ 1 A. | Requires 3.5× more board area; better thermal mass but incompatible with ultra-dense layouts. | Select when higher surge current (5 A IFSM) and long-term thermal stability outweigh size constraints. |
Compared with NSR0230HT1G and SS12, the BAT760 uniquely balances 1 A continuous current, 20 V VR, sub-550 mV VF, and SOD323 size - making it optimal for space-constrained, medium-power clamping where both efficiency and footprint matter.
Availability
BAT760 is available at Aetrix Electronics and suitable for USB port protection, DC-DC converter output clamping, and low-voltage rail protection requiring stable component supply across industrial and consumer production programs.
Supply support for BAT760 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade components.
The BAT760 belongs to Nexperia's medium-power Schottky diode product line, engineered specifically for high-efficiency, high-density protection and clamping in portable and embedded power systems.
FAQ
Is BAT760 suitable for automotive applications?
No. Per Nexperia's revision history (v.4, October 2022), BAT760 is explicitly non-automotive qualified. It lacks AEC-Q101 qualification and has not undergone automotive-grade stress testing. For automotive use, Nexperia recommends its BAT760-Q series or equivalent Q-qualified Schottky diodes.
What is the maximum allowable soldering temperature for BAT760?
The BAT760 supports standard reflow soldering per JEDEC J-STD-020. Peak temperature must not exceed 260 °C for ≤30 seconds, with ramp-up rate ≤3 °C/s and ramp-down rate ≤6 °C/s. Wave soldering is also supported using the footprint in Figure 6 of the datasheet.
How does the guard ring affect BAT760's ESD robustness?
The integrated guard ring suppresses edge breakdown under electrostatic discharge, raising the effective ESD withstand level beyond typical Schottky structures. While not rated to IEC 61000-4-2 levels in isolation, it enables reliable system-level ESD protection when combined with TVS diodes in multi-stage designs.
Can BAT760 replace BAT54 in existing designs?
Only with layout and thermal review. BAT760 offers higher IF (1 A vs. 200 mA) and VR (20 V vs. 30 V), but its VF is higher than BAT54's (480–550 mV vs. ~330 mV @ 100 mA). SOD323 footprints match, but thermal design must accommodate 5× higher current capability and associated power dissipation.
BAT760/6F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-76, SOD-323
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 20 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 50 µA @ 15 V
- Capacitance @ Vr, F:
- 19pF @ 5V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323
- Operating Temperature - Junction:
- 125°C
BAT760/6F FAQ
1.How can I place an order for BAT760/6F through Aetrix?
Please submit a Request for Quotation (RFQ) for BAT760/6F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAT760/6F reliable?
The price and inventory of BAT760/6F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAT760/6F is usually 5 days.
3.What payment methods are accepted for BAT760/6F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAT760/6F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAT760/6F?
BAT760/6F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAT760/6F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAT760/6F?
For technical support, including BAT760/6F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAT760/6F requirements.
6.How does Aetrix verify that BAT760/6F is sourced from the original manufacturer or authorized distributors?
All BAT760/6F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAT760/6F meets industry standards.
7.What is the process for return or replacement of BAT760/6F?
All BAT760/6F units undergo pre-shipment inspection (PSI). If there is an issue with BAT760/6F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAT760/6F part is unused and in its original packaging.
Return procedure for BAT760/6F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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