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Nexperia USA Inc. BAT760F

Part No.:
BAT760F
Manufacturer:
Nexperia USA Inc.
Category:
Single Diodes
Package:
SC-76, SOD-323
Datasheet:
AetrixBAT760F.pdf
Description:
DIODE SCHOTTKY 20V 1A SOD323
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,329

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Product details

Overview

BAT760 from Nexperia is a medium-power Schottky barrier single diode in SOD323 (SC-76) package, featuring 20 V reverse voltage rating, 1 A continuous forward current, 480–550 mV forward voltage at 1 A, guard-ring stress protection, and 19–25 pF junction capacitance at 5 V. It serves as a high-speed clamping and protection diode in DC-DC converter output stages and I/O line transient suppression.

For engineers reviewing the BAT760 datasheet, BAT760 pinout, BAT760 application, or BAT760 equivalent, key selection criteria include ultra-low VF for efficiency-critical rectification, low Cd for high-frequency signal integrity, thermal resistance of 220 K/W on minimal PCB copper, and SOD323 footprint compatibility with space-constrained portable power designs.

Technical Context

The BAT760 employs a planar Schottky structure with integrated guard ring to suppress edge breakdown under repetitive surge stress, enabling reliable operation up to 125 °C junction temperature. Its pulsed forward voltage is specified at 300 µs pulse width and 2% duty cycle, reflecting real-world switching regulator conduction conditions.

Thermal performance is defined for two PCB mounting configurations: 220 K/W (10 mm × 10 mm cathode pad) and 180 K/W (40 mm × 40 mm pad), directly informing thermal design margin in compact layouts. Reverse leakage remains below 50 µA at 15 V and 25 °C, supporting stable biasing in precision clamp circuits.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Voltage (VR) 20 V - Maximum blocking capability without avalanche breakdown; suitable for 12 V rail clamping and 5 V logic-level protection.
Forward Current (IF) 1 A continuous - Supports sustained conduction in medium-power DC-DC freewheel paths and load-dump protection circuits.
Forward Voltage (VF) 480–550 mV @ 1 A - Enables <1.1 W conduction loss at full load, critical for thermally constrained battery-powered systems.
Junction Capacitance (Cd) 19–25 pF @ 5 V - Limits high-frequency signal distortion in RF detector and fast-switching gate-drive clamp applications.
Reverse Leakage (IR) 10–50 µA @ 15 V - Ensures minimal standby current in always-on protection circuits across industrial temperature range.
Thermal Resistance (Rth(j-a)) 220 K/W - Defines worst-case junction-to-ambient rise on minimal FR4 copper; requires thermal relief planning in dense layouts.

Pinout & Package

Encapsulated in SOD323 (SC-76) surface-mount plastic package: 1.7 mm × 1.25 mm × 0.95 mm body, 1.3 mm lead pitch, cathode-side marking (A4), optimized for reflow soldering per IPC-7095 guidelines.

Pin/Terminal Circuit Role Design Meaning
1 (K) Cathode Connected to higher-potential node during forward conduction; marked side on package; primary heat path to PCB via cathode pad.
2 (A) Anode Connected to lower-potential node; electrically isolated from cathode by Schottky junction; no internal connection to package.

Key Features

Feature Design Value
Ultra high-speed switching Sub-nanosecond reverse recovery (trr not specified but inherent to Schottky architecture); eliminates switching tail current in >1 MHz DC-DC topologies.
Very low forward voltage 480–550 mV @ 1 A - Reduces forward conduction loss by ≥35% versus standard silicon diodes, improving system efficiency in portable devices.
Guard-ring protected Integrated planar guard ring suppresses edge-field concentration, enabling stable 20 V VR rating without premature breakdown under ESD or surge stress.
Very small SMD package SOD323 footprint (1.7 × 1.25 mm) saves >60% board area versus SMA/SMB packages, enabling miniaturized USB-C PD and wearables designs.

Applications

DC-DC Converter Output Clamp I/O Line Transient Protection

Use Scenario: Clamping flyback voltage spikes at synchronous buck converter output during MOSFET turn-off.

IC Role / Device Role / Timing Role: Schottky clamp diode providing low-VF path to limit overshoot and reduce EMI generation.

Use Value: 480 mV VF minimizes energy dissipation during clamping; 25 pF Cd avoids resonance with trace inductance above 100 MHz.

Use Scenario: Protecting microcontroller GPIO pins from ESD and inductive kickback in industrial sensor interfaces.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between I/O line and ground.

Use Value: Guard ring ensures consistent 20 V standoff across temperature; 50 µA IR at 15 V prevents false triggering in high-impedance sensing nodes.

Low-Voltage Rectification Power Rail OR-ing

Use Scenario: Rectifying 3.3 V or 5 V auxiliary supply rails where silicon diode VF would cause unacceptable voltage drop.

IC Role / Device Role / Timing Role: Unidirectional conduction element delivering regulated output with minimal forward loss.

Use Value: 300–350 mV VF at 100 mA enables >98% voltage delivery efficiency; 125 °C Tj rating supports operation near hot ICs.

Use Scenario: Implementing redundant power path selection in dual-battery or AC/DC + battery backup systems.

IC Role / Device Role / Timing Role: Discrete OR-ing diode preventing backfeed between independent sources.

Use Value: Low 1 A IF rating matches typical backup rail currents; SOD323 size allows placement adjacent to connectors without layout congestion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor NSR0230HT1G Lower IF (200 mA), lower VF (270 mV @ 100 mA), same SOD-323 package, no guard ring. Not rated for 1 A continuous use; unsuitable for DC-DC clamp or OR-ing at >200 mA. Select only for low-current (<200 mA) signal-level clamping where ultra-low VF dominates over surge robustness.
Vishay VS-2EDH01HM3/85A Higher IF (2 A), higher VF (590 mV @ 1 A), SOD-123 package (larger footprint), guard ring included. Requires 30% more PCB area; better suited for higher-current industrial supplies than portable electronics. Choose when 2 A forward current or enhanced thermal derating (Rth(j-a) = 150 K/W) is required, accepting larger footprint.

Compared with NSR0230HT1G and VS-2EDH01HM3/85A, the BAT760 uniquely balances 1 A current handling, sub-550 mV VF, SOD323 miniaturization, and guard-ring reliability-making it optimal for space-constrained, medium-power clamping where both efficiency and surge immunity matter.

Availability

BAT760 is available at Aetrix Electronics and suitable for DC-DC converter output clamping, I/O line transient protection, and low-voltage rectification requiring stable component supply across consumer, industrial, and medical electronics programs.

Supply support for BAT760 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, headquartered in Nijmegen, Netherlands, with manufacturing in Asia and Europe.

The BAT760 belongs to Nexperia's Schottky diode product line designed specifically for efficiency-critical, space-constrained power management and protection functions in portable and industrial electronics.

FAQ

Is BAT760 automotive-qualified?

No. Per Nexperia's revision history (v.4, October 2022), BAT760 is explicitly non-automotive qualified. It lacks AEC-Q101 qualification and automotive-specific testing. For automotive applications, Nexperia recommends its BAT760-Q series or equivalent Q-grade Schottky diodes with full automotive qualification documentation.

What is the maximum allowable peak forward current for BAT760?

The non-repetitive peak forward current (IFSM) is 5 A for a half-sine-wave pulse of ≤8.3 ms duration, per JEDEC test method. This rating applies to short-duration surge events such as inrush or load dump, not continuous operation. Exceeding this value risks permanent junction damage.

How does the guard ring improve BAT760 reliability?

The integrated planar guard ring redistributes electric field at the die edge, suppressing premature avalanche breakdown under high dv/dt or ESD stress. This enables stable 20 V reverse voltage operation across temperature and extends lifetime in transient-prone environments like industrial I/O and power supply outputs.

Can BAT760 be used in place of BAT54S in SOD-323 designs?

No. BAT54S is a dual-series Schottky diode (two anodes, common cathode) in SOT-323, while BAT760 is a single diode in SOD-323. Pinout, internal configuration, and electrical characteristics differ fundamentally. Substitution requires schematic and layout revision-not drop-in replacement.

BAT760F Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SC-76, SOD-323
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
20 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
550 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
50 µA @ 15 V
Capacitance @ Vr, F:
25pF @ 5V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOD-323
Operating Temperature - Junction:
125°C (Max)

BAT760F FAQ

1.How can I place an order for BAT760F through Aetrix?

Please submit a Request for Quotation (RFQ) for BAT760F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BAT760F reliable?

The price and inventory of BAT760F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAT760F is usually 5 days.

3.What payment methods are accepted for BAT760F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAT760F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BAT760F?

BAT760F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BAT760F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BAT760F?

For technical support, including BAT760F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAT760F requirements.

6.How does Aetrix verify that BAT760F is sourced from the original manufacturer or authorized distributors?

All BAT760F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAT760F meets industry standards.

7.What is the process for return or replacement of BAT760F?

All BAT760F units undergo pre-shipment inspection (PSI). If there is an issue with BAT760F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BAT760F part is unused and in its original packaging.

Return procedure for BAT760F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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