Nexperia USA Inc. BAV23A-QR

Overview

BAV23A-Q from Nexperia is a dual high-voltage switching diode in SOT23 package, featuring common-anode configuration, 250 V repetitive peak reverse voltage (VRRM), ≤50 ns reverse recovery time (trr), and 2 pF capacitance - designed for automotive-grade high-speed switching at up to 200 V reverse bias.

For engineers reviewing the BAV23A-Q datasheet, BAV23A-Q pinout, BAV23A-Q application, or BAV23A-Q equivalent, key selection criteria include common-anode dual-diode topology, AEC-Q101 qualification, thermal resistance (Rth(j-a) = 500 K/W), and derated forward current handling under double-diode load conditions.

Technical Context

The BAV23A-Q integrates two independent silicon switching diodes sharing a common anode terminal (Pin 3), enabling compact high-voltage OR-ing, polarity protection, and clamp circuits where matched trr and low IR are critical. Its VRRM of 250 V and IF(RMS) capability support operation in 24 V and 48 V automotive power domains with surge immunity.

Thermal performance is defined for FR4 PCB mounting: Rth(j-a) = 500 K/W and Rth(j-sp) = 360 K/W, with junction temperature rated to 150 °C and storage range from −65 °C to +150 °C - confirming suitability for under-hood environments with transient thermal stress.

Key Specifications

Pinout & Package

Package: SOT23 (TO-236AB), 3-terminal surface-mount plastic package, 2.9 mm × 1.3 mm × 1.0 mm body, 1.9 mm lead pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual high-voltage switching diode applications.

Compared with BAV23S-Q and MMBD231C, the BAV23A-Q uniquely combines AEC-Q101 qualification, 250 V VRRM, and common-anode topology - making it the only option validated for automotive supply OR-ing and load-dump protection where both reliability and topology alignment are mandatory.

Availability

BAV23A-Q is available at Aetrix Electronics and suitable for automotive body control modules, industrial 48 V power distribution systems, and ADAS camera power supplies requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for BAV23A-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging.

The BAV23A-Q belongs to Nexperia's AEC-Q101-qualified high-voltage switching diode product line, engineered specifically for robustness in automotive power management, clamping, and protection circuits operating up to 250 V.

FAQ

What is the maximum continuous forward current rating per diode?

The BAV23A-Q supports 225 mA per diode under single-diode loaded conditions at Tamb ≤ 25 °C. When both diodes conduct simultaneously, the total forward current must be limited to 125 mA to maintain safe junction temperature within the 250 mW total power dissipation limit on standard FR4 PCB.

Is the BAV23A-Q suitable for load-dump protection in 12 V automotive systems?

Yes - its 250 V VRRM exceeds the ISO 7637-2 Pulse 5a load-dump specification (up to 120 V for 12 V systems), and its ≤50 ns trr ensures rapid clamping response. The AEC-Q101 qualification confirms robustness against thermal cycling and mechanical stress typical in under-hood environments.

How does the common-anode configuration affect PCB layout compared to common-cathode alternatives?

The common-anode (CA) pin (Pin 3) serves as the shared positive input node, allowing both cathodes (Pins 1 and 2) to drive independent loads or clamping paths to ground. This simplifies routing in OR-ing applications where multiple sources feed one rail, unlike common-cathode layouts that require separate anode connections and more complex ground referencing.

What is the thermal resistance from junction to solder point (Rth(j-sp)) and why does it matter?

Rth(j-sp) is 360 K/W, measured from die junction to PCB solder joint. This value is critical for predicting local temperature rise at the device attachment point during pulsed operation or in thermally constrained areas - enabling accurate thermal modeling when designing heatsinking or airflow for densely packed automotive ECUs.