My Inquiry
My Account
Diotec Semiconductor BAV70
- Part No.:
- BAV70
- Manufacturer:
- Diotec Semiconductor
- Category:
- Diode Arrays
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
BAV70.pdf
- Description:
- DIODE ARRAY GP 75V 215MA SOT23-3
- Quantity:
- Payment:
- Shipping:
Inventory:8,256
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAV70 from Nexperia is a silicon double diode in common-cathode configuration, rated for 80 V reverse voltage, 200 mA forward current, and 4 ns reverse recovery time-optimized for high-speed switching in signal routing and clamping circuits within automotive body control modules and industrial PLC I/O protection stages.
For engineers reviewing the BAV70 datasheet, BAV70 pinout, BAV70 application, or BAV70 equivalent, key selection criteria include its dual-diode topology, low capacitance (1.5 pF), AEC-Q101 qualification, thermal resistance (≤240 K/W for BAV70U), and SOT363 package compatibility with space-constrained PCB layouts.
Technical Context
The BAV70 integrates two identical high-speed switching diodes sharing a common cathode terminal, enabling bidirectional clamping or dual-path signal steering without discrete pairing. Its 4 ns trr and 1.5 pF CT at 0 V support >100 MHz signal integrity in ESD-protected data lines.
Rated for 150 °C junction temperature and qualified to AEC-Q101, it sustains reliable operation under automotive transients. The SOT363 (SC74) package provides defined pin 1 orientation and supports automated placement with 3,000-piece reel packaging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 80 V - Supports rail-to-rail clamping in 24 V automotive systems without breakdown. |
| Forward Current (IF) | 200 mA - Handles sustained logic-level signal conditioning and transient absorption in I/O buffers. |
| Reverse Recovery Time (trr) | 4 ns - Enables clean switching in >100 MHz clock distribution and high-frequency data line protection. |
| Diode Capacitance (CT) | 1.5 pF @ 0 V, 1 MHz - Minimizes signal loading on USB 2.0, CAN FD, and LVDS receivers. |
| Junction Temperature (Tj) | 150 °C - Meets under-hood thermal requirements per AEC-Q101 stress testing protocols. |
| Thermal Resistance (RthJS) | ≤240 K/W (BAV70U) - Allows 250 mW power dissipation with ≤60 K temperature rise above solder point. |
Pinout & Package
SOT363 (SC74) surface-mount package: 6-pin, common-cathode dual diode layout with pin 1 marked by dot; footprint optimized for reflow assembly and high-density routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode 1 | Input path for first diode; connects to protected signal line or pull-up network. |
| 2 | Cathode (common) | Shared return node for both diodes; ties to ground or reference rail for clamping. |
| 3 | Anode 2 | Input path for second diode; enables dual-signal protection or differential clamping. |
| 4 | No Connect | Internally unconnected; must remain floating per datasheet to avoid parasitic coupling. |
| 5 | No Connect | Internally unconnected; no PCB trace or thermal pad required. |
| 6 | No Connect | Internally unconnected; omitted from schematic symbol and layout routing. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive applications including engine control units and lighting drivers. |
| Common-cathode dual configuration | Reduces component count and board area vs. two discrete SOT23 diodes in shared-return designs. |
| 4 ns reverse recovery time | Enables use in 100+ MHz digital interfaces without signal edge distortion or ringing. |
| 1.5 pF junction capacitance | Preserves signal integrity in high-speed data paths such as RS-485 and CAN transceiver I/O. |
| Pb-free, RoHS-compliant | Meets EU Directive 2011/65/EU and supports lead-free reflow profiles up to 260 °C. |
Applications
| Automotive Signal Clamping | Industrial Digital I/O Protection |
|---|---|
Use Scenario: Protecting LIN bus transceiver inputs against load-dump transients and ESD events in door module ECUs. IC Role / Device Role / Timing Role: Dual-diode clamp limiting input voltage to ±15 V while preserving signal slew rate. Use Value: 4 ns trr ensures no timing skew on 20 kbaud LIN frames; 80 V VR withstands ISO 7637-2 Pulse 5a. | Use Scenario: Shielding PLC analog input channels from field-wiring induced surges and cross-talk. IC Role / Device Role / Timing Role: Common-cathode pair shunting overvoltage to ground before op-amp input stage. Use Value: 1.5 pF CT avoids gain error in 16-bit ADC front-ends; 150 °C Tj rating supports cabinet-mounted operation. |
| USB 2.0 Data Line Protection | High-Speed Logic Level Translation |
Use Scenario: ESD suppression on D+ and D− lines of embedded USB host controllers in medical devices. IC Role / Device Role / Timing Role: Low-capacitance dual diode clamping to VBUS and GND without degrading 480 Mbps eye diagram. Use Value: 1.5 pF CT meets USB-IF impedance tolerance; AEC-Q101 grade assures reliability in portable diagnostics gear. | Use Scenario: Bidirectional level shifting between 3.3 V microcontroller GPIOs and 5 V sensor interfaces. IC Role / Device Role / Timing Role: Anode-to-anode connection enabling fast turn-on for both direction transitions. Use Value: 4 ns trr supports >10 MHz toggle rates; 200 mA IF handles peak currents during bus arbitration pulses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-diode clamping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BAV99 | Same SOT23-3 package, but single-anode/common-cathode; 4 ns trr, 1.5 pF CT, 70 V VR. | Limited to single-path clamping; requires two devices for dual-line protection. | Select when board space allows discrete placement and dual-line symmetry is not required. |
| MMBD7000 | SOT23 package, 100 V VR, 4 ns trr, 2 pF CT, no AEC-Q101 qualification. | Higher voltage margin but higher capacitance; unsuitable for automotive under-hood use. | Choose for industrial non-automotive applications needing >80 V standoff with minimal layout change. |
Compared with BAV99 and MMBD7000, the BAV70 delivers integrated dual-line protection in one SOT363 footprint, AEC-Q101 compliance for automotive deployment, and lower capacitance than MMBD7000-making it optimal for space- and reliability-critical high-speed interface protection.
Availability
BAV70 is available at Aetrix Electronics and suitable for automotive signal clamping, industrial I/O protection, USB 2.0 data line safeguarding, and high-speed logic level translation requiring stable component supply across production lifecycles.
Supply support for BAV70 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability standard logic, discrete, and MOSFET solutions with leadership in automotive-qualified components.
The BAV70 belongs to Nexperia's high-speed switching diode product line, engineered specifically for ESD-tolerant, low-capacitance signal routing in automotive and industrial control systems where speed, thermal robustness, and qualification rigor are mandatory.
FAQ
What is the maximum continuous forward current for BAV70 at 75°C ambient?
At TA = 75°C, the BAV70S variant supports 125 mA continuous forward current per diode, derived from its derating curve showing 250 mA at TS ≤ 85°C and linear reduction to zero at 150°C junction temperature. This value assumes adequate PCB copper area for heat spreading.
Can BAV70 be used in place of BAV99 in existing SOT23 footprints?
No-BAV70 uses SOT363 (6-pin) while BAV99 uses SOT23 (3-pin); pin count, pitch, and land pattern are incompatible. Direct replacement requires PCB redesign. For drop-in alternatives, consider BAV99W (SOT323) or dual-SOT23 layouts with spacing matching SOT363's 0.65 mm pitch.
Is the common cathode pin electrically isolated from the package thermal pad?
Yes-the SOT363 package has no exposed thermal pad; the common cathode (pin 2) connects only to the internal die substrate and is fully isolated from the plastic body. No thermal via or ground plane connection is required or recommended for pin 2 beyond its functional circuit tie.
Does BAV70 meet IEC 61000-4-2 Level 4 ESD immunity requirements?
BAV70 itself is not tested to IEC 61000-4-2; however, its 1.5 pF capacitance and 4 ns trr enable effective system-level ESD protection when placed within 5 mm of connector pins and paired with a 100 Ω series resistor-meeting Level 4 (±15 kV air, ±8 kV contact) in validated automotive designs per ISO 10605.
BAV70 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diotec Semiconductor
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 75 V
- Current - Average Rectified (Io) (per Diode):
- 215mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 150 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 2.5 µA @ 75 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-3 (TO-236)
BAV70 FAQ
1.How can I place an order for BAV70 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAV70 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAV70 reliable?
The price and inventory of BAV70 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAV70 is usually 5 days.
3.What payment methods are accepted for BAV70?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAV70 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAV70?
BAV70 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAV70 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAV70?
For technical support, including BAV70 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAV70 requirements.
6.How does Aetrix verify that BAV70 is sourced from the original manufacturer or authorized distributors?
All BAV70 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAV70 meets industry standards.
7.What is the process for return or replacement of BAV70?
All BAV70 units undergo pre-shipment inspection (PSI). If there is an issue with BAV70, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAV70 part is unused and in its original packaging.
Return procedure for BAV70:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAV70 Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
