Infineon Technologies BAV 99 B6327
- Part No.:
- BAV 99 B6327
- Manufacturer:
- Infineon Technologies
- Category:
- Diode Arrays
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
BAV 99 B6327.pdf
- Description:
- DIODE ARRAY GP 80V 200MA PGSOT23
- Quantity:
- Payment:

- Shipping:

Inventory:5,403
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Product details
Overview
BAV99 B6327 from Infineon Technologies is a dual-series silicon switching diode in SOT-363 (SC74) package, rated for 80 V reverse voltage, 200 mA forward current, and 4 ns reverse recovery time-designed for high-speed signal routing and ESD protection in automotive infotainment data lines.
For engineers reviewing the BAV99 B6327 datasheet, BAV99 B6327 pinout, BAV99 B6327 application, or BAV99 B6327 equivalent, key selection criteria include its AEC-Q101 qualification, low 1.5 pF junction capacitance at 0 V, and dual-series configuration enabling common-cathode clamping in bidirectional I/O protection circuits.
Technical Context
This dual-diode array integrates two identical high-speed switching diodes in series configuration within a single SC74 package-enabling symmetrical clamping to VCC and GND on a shared signal line. Its 4 ns trr and 1.5 pF CT support >100 MHz digital signal integrity in USB 2.0 and CAN FD transceiver interfaces.
The device operates across –65 °C to +150 °C with 250 mW total power dissipation (at TS ≤ 85 °C), and achieves RthJS ≤ 260 K/W-optimized for thermally constrained PCB layouts in engine control modules and ADAS sensor hubs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 80 V - supports 24 V automotive supply rail transient suppression without breakdown |
| Reverse Recovery Time (trr) | 4 ns - enables clean switching in 100+ MHz clock distribution and high-speed data lines |
| Junction Capacitance (CT) | 1.5 pF @ 0 V - minimizes signal loading on USB 2.0 differential pairs and LIN bus nodes |
| Forward Voltage (VF) | 855 mV @ 10 mA - ensures low conduction loss in low-power ESD clamp paths |
| Thermal Resistance (RthJS) | ≤260 K/W - allows direct mounting on small copper pads in space-constrained ECUs |
| AEC-Q101 Qualified | Yes - validated for automotive-grade reliability under temperature cycling, humidity, and mechanical shock |
Pinout & Package
SOT-363 (SC74) surface-mount package with 6-pin lead frame, 1.9 mm × 2.9 mm footprint, and exposed thermal pad (pin 4). Pin 1 marked by dot; pin 3 and pin 6 are anodes, pin 2 and pin 5 are cathodes, forming two independent series diodes (D1: pins 1–2; D2: pins 5–6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode of Diode 1 | Input node for first diode in series pair; connects to protected signal line |
| Pin 2 | Cathode of Diode 1 / Anode of Diode 2 | Internal series junction-no external connection; enables common-cathode topology |
| Pin 3 | No Connection (NC) | Unused terminal; electrically isolated per datasheet layout |
| Pin 4 | Thermal Pad / GND | Primary heat path to PCB; must be soldered to solid copper pour for thermal compliance |
| Pin 5 | Cathode of Diode 2 | Output node tied to VCC or GND for clamping; defines polarity of second diode |
| Pin 6 | Anode of Diode 2 | Second input node; used when configuring dual-directional clamping with external bias |
Key Features
| Feature | Design Value |
|---|---|
| Dual-series diode configuration | Enables single-package bidirectional ESD clamping between signal and both rails without external components |
| AEC-Q101 qualification | Validated for automotive underhood applications including powertrain and body control modules |
| Low 1.5 pF junction capacitance | Maintains signal integrity on 480 Mbps USB 2.0 traces with <0.5% rise-time degradation |
| 4 ns reverse recovery time | Supports clean edge transitions in 25 MHz+ clock trees and SPI/UART interface lines |
| Pb-free RoHS-compliant packaging | Meets EU Directive 2011/65/EU; compatible with lead-free reflow profiles (peak 260 °C) |
Applications
| Automotive CAN FD Transceivers | USB 2.0 Port Protection |
|---|---|
Use Scenario: Bidirectional signal line protection in CAN FD physical layer interfaces operating up to 5 Mbps. IC Role / Device Role / Timing Role: Dual-series diode provides symmetric clamping to VCC and GND during ESD events while preserving signal swing. Use Value: Eliminates need for discrete TVS + resistor network; maintains <±100 mV offset on recessive-dominant CAN bus. | Use Scenario: ESD protection on D+ and D− lines of automotive infotainment USB 2.0 ports. IC Role / Device Role / Timing Role: Low-capacitance clamping diode array placed directly at connector to shunt ±8 kV contact discharge. Use Value: 1.5 pF CT avoids eye diagram closure; passes USB-IF compliance testing at 480 Mbps. |
| Engine Control Unit (ECU) Sensor Inputs | LIN Bus Node Protection |
Use Scenario: Protection of analog sensor inputs (e.g., MAP, O2 sensors) exposed to load dump transients. IC Role / Device Role / Timing Role: Series-connected diodes limit fault current into ADC front-end while blocking reverse leakage. Use Value: 80 V VR withstands ISO 7637-2 Pulse 5a (120 V/100 ms); 150 °C Tj rating suits under-hood placement. | Use Scenario: Clamping of LIN bus master/slave nodes against battery reversal and jump-start surges. IC Role / Device Role / Timing Role: Dual-diode structure routes reverse current through internal series path to prevent latch-up. Use Value: 200 mA IF rating sustains continuous 12 V reverse bias; qualified per AEC-Q101 stress test conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-series switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BAV99W,115 (Nexperia) | Same SOT-323 package; 250 mW Ptot at TS ≤ 110 °C; RthJS ≤ 160 K/W | Better thermal performance but smaller 1.35 mm × 1.75 mm footprint; less board area for heatsinking | Select when PCB space is critical and thermal pad attachment is impractical |
| MMBD99ALT1G (ON Semiconductor) | SOT-23 package; single-diode pair; 330 mW Ptot at TS ≤ 28 °C; RthJS ≤ 360 K/W | Higher power rating at low ambient but de-rates sharply above 40 °C; no AEC-Q101 certification | Select for non-automotive industrial control where cost and availability outweigh qualification needs |
Compared with BAV99 B6327, the BAV99W offers superior thermal resistance in a smaller footprint but lacks the SC74's standardized pin 1 orientation for automated placement; the MMBD99ALT1G delivers higher DC power handling but requires derating above 40 °C and omits automotive qualification.
Availability
BAV99 B6327 is available at Aetrix Electronics and suitable for automotive ECU design, infotainment system integration, and ADAS sensor interface protection requiring stable component supply across extended temperature and lifecycle requirements.
Supply support for BAV99 B6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability discrete devices.
The BAV99 family belongs to Infineon's automotive-qualified discrete diode product line, engineered specifically for robust signal-line protection in harsh-environment vehicle networks including CAN, LIN, and USB.
FAQ
What is the maximum allowable junction temperature for BAV99 B6327?
The absolute maximum junction temperature (Tj) is 150 °C, verified per Infineon's AEC-Q101 qualification test plan. Operation beyond this limit risks permanent parametric shift in VF and increased IR leakage, especially above 125 °C ambient with insufficient PCB copper area.
Does BAV99 B6327 support bidirectional ESD protection without external biasing?
Yes-the dual-series configuration allows direct connection between signal line and VCC/GND rails, enabling passive clamping of ±8 kV IEC 61000-4-2 ESD pulses in both directions without external voltage sources or resistors.
How does the SC74 package thermal pad (Pin 4) affect PCB layout?
Pin 4 is an exposed thermal pad that must be soldered to ≥100 mm² of inner-layer copper pour with ≥4 thermal vias (0.3 mm diameter) to achieve the rated RthJS ≤ 260 K/W. Omitting this reduces power handling by ~40% at 85 °C ambient.
Is BAV99 B6327 compatible with lead-free reflow processes?
Yes-it is Pb-free and RoHS-compliant, qualified for peak reflow temperatures up to 260 °C per JEDEC J-STD-020. The SOT-363 package passes 3× reflow cycles without delamination or marking degradation.
BAV 99 B6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Diode Configuration:
- 1 Pair Series Connection
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 80 V
- Current - Average Rectified (Io) (per Diode):
- 200mA (DC)
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 150 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 150 nA @ 70 V
- Operating Temperature - Junction:
- 150°C (Max)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT23
BAV 99 B6327 FAQ
1.How can I place an order for BAV 99 B6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAV 99 B6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAV 99 B6327 reliable?
The price and inventory of BAV 99 B6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAV 99 B6327 is usually 5 days.
3.What payment methods are accepted for BAV 99 B6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAV 99 B6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAV 99 B6327?
BAV 99 B6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAV 99 B6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAV 99 B6327?
For technical support, including BAV 99 B6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAV 99 B6327 requirements.
6.How does Aetrix verify that BAV 99 B6327 is sourced from the original manufacturer or authorized distributors?
All BAV 99 B6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAV 99 B6327 meets industry standards.
7.What is the process for return or replacement of BAV 99 B6327?
All BAV 99 B6327 units undergo pre-shipment inspection (PSI). If there is an issue with BAV 99 B6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAV 99 B6327 part is unused and in its original packaging.
Return procedure for BAV 99 B6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAV 99 B6327 Tags

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BAV99-7-F
Diodes Incorporated

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BAT54C-7-F
Diodes Incorporated

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BAV99,215
Nexperia USA Inc.

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BAV70LT1G
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BAT54CLT1G
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BAT54S-7-F
Diodes Incorporated

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BAV99LT1G
onsemi

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BAT54S,215
Nexperia USA Inc.

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BAS40-04LT1G
onsemi

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MMBD1503-TP
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