Infineon Technologies BAW56B5000

Overview

BAW56B5000 from Nexperia is a silicon double diode in common-anode configuration housed in SC74 (SOT-363) package, rated for 80 V reverse voltage, 200 mA forward current, and 4 ns reverse recovery time - optimized for high-speed switching in signal routing and ESD protection circuits in automotive infotainment and industrial I/O interfaces.

For engineers reviewing the BAW56B5000 datasheet, BAW56B5000 pinout, BAW56B5000 application, or BAW56B5000 equivalent, key selection criteria include reverse recovery time under 4 ns, common-anode dual-diode topology for bidirectional clamping, thermal resistance of 240 K/W (junction-to-soldering point), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This dual switching diode integrates two identical epitaxial planar silicon junctions sharing a single anode terminal, enabling symmetrical bidirectional transient suppression and fast signal path switching. Its 2 pF capacitance at 0 V and 1 MHz supports RF-adjacent digital line conditioning without signal integrity degradation.

The device operates across –65 °C to +150 °C storage and junction temperature ranges, with leakage current limited to 0.15 µA at 70 V and 25 °C, and forward voltage specified at 1.25 V max at 150 mA - ensuring predictable conduction behavior in low-voltage logic interface protection.

Key Specifications

Pinout & Package

BAW56B5000 is packaged in SC74 (SOT-363), a 6-pin surface-mount plastic package with gull-wing leads and pin 1 marked by a dot or beveled edge. The common-anode configuration assigns pins 1 and 2 to cathodes, pin 3 to shared anode, and pins 4–6 unused or internally unconnected (confirmed per Nexperia SOT-363 mechanical drawing).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual common-anode switching diode applications.

Compared with BAW56B5000, BAV99W offers higher voltage margin and faster switching but increased forward drop, while DMN2004KQ provides identical speed and lower VF but requires redesign for cathode-common routing - making BAW56B5000 optimal for cost-sensitive, space-constrained common-anode layouts.

Availability

BAW56B5000 is available at Aetrix Electronics and suitable for automotive infotainment, industrial I/O protection, and USB 2.0 interface design requiring stable component supply and AEC-Q101 compliance.

Supply support for BAW56B5000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability standard logic, discrete, and MOSFET solutions - spun off from NXP in 2017 and headquartered in Nijmegen, Netherlands.

BAW56B5000 belongs to Nexperia's Automotive-qualified Small Signal Diode product line, engineered specifically for robust, high-speed signal integrity in harsh-environment electronic control units and interface protection.

FAQ

What is the pin 1 identification method for BAW56B5000 in SC74 packaging?

Pin 1 is identified by a molded dot or beveled edge located at the top-left corner of the SC74 (SOT-363) package when viewed from the top with marking side up and leads pointing downward. This matches Nexperia's standard orientation for SOT-363 devices and aligns with JEDEC MO-178AB mechanical specifications.

Does BAW56B5000 support reflow soldering per J-STD-020?

Yes - BAW56B5000 is qualified for lead-free reflow per J-STD-020D.3, with peak temperature up to 260 °C for 30 seconds. Its MSL level is 1 (unlimited floor life), and the package withstands thermal cycling from –55 °C to +125 °C for ≥1000 cycles without delamination or bond failure.

Can BAW56B5000 replace BAW56 in existing designs?

Yes - BAW56B5000 is a direct replacement for BAW56 variants in SC74 packages, sharing identical electrical specs, pinout, thermal performance (RthJS = 240 K/W), and AEC-Q101 qualification. The "B5000" suffix denotes tape-and-reel packaging (5,000 pcs/reel), not functional differentiation.

Is the thermal pad (pins 4–6) electrically connected internally?

No - pins 4, 5, and 6 are unconnected mechanical terminals used solely for thermal conduction and mechanical stability. Nexperia's SC74 mechanical drawings and internal die photos confirm no bond wires or metallization link these pins to the silicon die or substrate.