Nexperia USA Inc. BAW56SRA-QZ
- Part No.:
- BAW56SRA-QZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Diode Arrays
- Package:
- 6-XFDFN Exposed Pad
- Datasheet:
-
BAW56SRA-QZ.pdf
- Description:
- DIODE ARR GP 90V 375MA DFN1412-6
- Quantity:
- Payment:

- Shipping:

Inventory:7,894
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAW56SRA-Q from Nexperia is a quad high-speed switching diode array with dual common-anode pairs (A1,2 and A3,4), housed in a DFN1412-6 (SOT1268) package. It delivers trr ≤ 4 ns reverse recovery time, VR = 90 V maximum reverse voltage, and Cd ≤ 2 pF capacitance per diode-enabling use in automotive signal routing, ESD-protected data line clamping, and high-frequency logic-level translation circuits.
For engineers reviewing the BAW56SRA-Q datasheet, BAW56SRA-Q pinout, BAW56SRA-Q application, or BAW56SRA-Q equivalent, this device supports AEC-Q101-compliant designs requiring compact, low-capacitance, fast-switching discrete diodes with defined common-anode topology for space-constrained PCB layouts and noise-sensitive digital interfaces.
Technical Context
This quad diode integrates four independent silicon switching diodes in a single ultra-small DFN1412-6 package, configured as two electrically isolated common-anode pairs (diodes 1+2 share A1,2; diodes 3+4 share A3,4). Each diode exhibits consistent VF = 1.25 V at IF = 150 mA and IR ≤ 0.5 µA at VR = 80 V.
The device operates across −55 °C to +150 °C ambient temperature, with thermal resistance Rth(j-a) = 305 K/W (FR4, standard footprint) and junction-to-solder-point Rth(j-sp) = 205 K/W-supporting reliable thermal performance in automotive under-hood and infotainment modules where power dissipation must remain below 410 mW per diode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 90 V - supports 24 V automotive supply rail transient suppression without breakdown. |
| Reverse Recovery Time (trr) | ≤ 4 ns - enables clean switching in >100 MHz digital signal paths and clock distribution networks. |
| Diode Capacitance (Cd) | ≤ 2 pF at 0 V - minimizes signal loading on high-speed data lines (e.g., CAN FD, LIN, SPI). |
| Forward Voltage (VF) | 1.25 V at 150 mA - ensures low conduction loss in active clamping and level-shifting applications. |
| Leakage Current (IR) | ≤ 0.5 µA at 80 V, 25 °C - maintains signal integrity in high-impedance sensing and bias networks. |
| Package | DFN1412-6 (SOT1268), 1.4 × 1.2 × 0.47 mm - fits 0402-class board area while enabling thermal pad soldering. |
Pinout & Package
DFN1412-6 (SOT1268) is a leadless, thermally enhanced ultra-thin plastic package with six terminals, 1.4 mm × 1.2 mm body size, and exposed anode thermal pad. Pin numbering follows top-side marking index (pin 1 = K1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (Diode 1) | Output node for first diode in common-anode pair A1,2; routed to signal path requiring clamping or steering. |
| 2 | Cathode (Diode 2) | Independent cathode for second diode sharing A1,2 anode; enables dual-path protection or OR-ing. |
| 3 | Common Anode (Diodes 3 & 4) | Shared anode terminal for third and fourth diodes; connects to reference rail or bias source. |
| 4 | Cathode (Diode 3) | Third diode cathode; used in complementary signal path to Diode 4 within same anode group. |
| 5 | Cathode (Diode 4) | Fourth cathode; allows independent control of two diodes referenced to A3,4, supporting dual-channel isolation. |
| 6 | Common Anode (Diodes 1 & 2) | Shared anode for Diodes 1 and 2; ties both cathodes to single bias point for compact dual-diode operation. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Qualified for automotive applications including engine control units and ADAS sensor interfaces. |
| Dual common-anode topology | Reduces component count by 50% vs. discrete diodes in dual-rail clamping or bidirectional bus protection. |
| Ultra-low capacitance (≤2 pF) | Preserves signal edge rate in 100+ Mbps serial links without added jitter or reflection. |
| 4 ns reverse recovery | Eliminates tail current in high-frequency PWM-driven loads, preventing shoot-through in half-bridge gate drivers. |
| Thermally enhanced DFN package | Enables 610 mW total power dissipation with solderable anode pad-critical for sustained 150 mA operation. |
Applications
| Automotive CAN FD Transceiver Protection | High-Speed Logic-Level Translation |
|---|---|
|
Use Scenario: Protecting CAN FD transceiver I/O pins against ESD and load-dump transients in vehicle networking modules. IC Role / Device Role / Timing Role: Discrete clamping diode array providing low-capacitance, fast-response overvoltage protection on differential bus lines. Use Value: 2 pF capacitance avoids signal integrity degradation at 5 Mbps CAN FD data rates; 90 V VR withstands ISO 7637-2 Pulse 1/2a. |
Use Scenario: Translating 3.3 V logic signals to 5 V microcontroller inputs in infotainment head units. IC Role / Device Role / Timing Role: Passive level shifter using forward-biased diodes with controlled VF drop and minimal propagation delay. Use Value: 4 ns trr ensures sub-nanosecond timing alignment; dual common-anode structure simplifies PCB routing for paired signal channels. |
| USB 2.0 Data Line ESD Clamp | Automotive Sensor Signal Conditioning |
|
Use Scenario: Adding secondary ESD protection on USB 2.0 D+/D− lines downstream of integrated TVS arrays. IC Role / Device Role / Timing Role: Low-capacitance switching diode array clamping to VBUS and GND rails during ±8 kV HBM events. Use Value: 2 pF Cd prevents USB 2.0 eye diagram closure; AEC-Q101 rating ensures reliability in connected-car USB ports. |
Use Scenario: Biasing and protecting analog outputs from Hall-effect or IMU sensors in ADAS camera modules. IC Role / Device Role / Timing Role: Precision clamping diode limiting output swing to safe ADC input range while rejecting supply rail noise. Use Value: 0.5 µA IR at 80 V preserves µA-level sensor bias currents; 150 °C Tj rating matches under-hood operating environment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad high-speed switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BAW56W-Q | Same die, but in SOT323 package (3.0 × 1.4 × 1.1 mm); higher Rth(j-a) = 380 K/W; no thermal pad. | Larger footprint; unsuitable for high-density automotive PCBs or thermally constrained modules. | Select when legacy SMT placement equipment lacks DFN1412-6 capability or thermal demands are lower. |
| NSR20F30NXT5G | Single dual-common-anode diode (2 diodes), 30 V VR, 1.5 ns trr, 0.8 pF Cd; DFN1006-3 package. | Lower voltage rating and fewer diodes; optimized for 3.3 V logic, not 24 V automotive systems. | Choose only for low-voltage, ultra-high-speed (<1 GHz) RF or clock path clamping-not for general automotive switching. |
Compared with BAW56W-Q, the BAW56SRA-Q offers 25% smaller footprint and superior thermal performance; versus NSR20F30NXT5G, it provides double the diode count and 3× higher VR-making it uniquely suited for AEC-Q101-compliant, multi-channel 24 V system protection.
Availability
BAW56SRA-Q is available at Aetrix Electronics and suitable for automotive ECU design, high-speed data interface protection, and compact sensor signal conditioning requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BAW56SRA-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors-including diodes, MOSFETs, bipolar transistors, and ESD protection devices.
The BAW56SRA-Q belongs to Nexperia's AEC-Q101-qualified high-speed switching diode product line, engineered specifically for automotive signal integrity, ESD robustness, and space-constrained PCB integration.
FAQ
What is the maximum continuous forward current per diode in the BAW56SRA-Q?
The BAW56SRA-Q supports 375 mA per diode when mounted on FR4 PCB with standard footprint at Tamb = 25 °C. Derating applies above 25 °C: at 125 °C ambient, max continuous current drops to ~220 mA per diode per Fig. 1. This rating assumes single-diode conduction; simultaneous conduction of two diodes reduces per-diode limit to 220 mA.
How does the dual common-anode configuration affect PCB layout?
The dual common-anode structure (A1,2 and A3,4) requires separate anode traces for each pair-reducing net count versus four independent diodes but demanding careful thermal pad connection. Pin 3 and Pin 6 must be routed to distinct reference rails or bias sources; shared anode routing invalidates the intended isolation between diode pairs.
Is the BAW56SRA-Q suitable for bidirectional signal clamping?
No-it is configured exclusively for unidirectional clamping (anode-referenced). Each diode conducts only when its cathode is ≥ VF above its shared anode. For bidirectional protection, external series resistors and dual-rail connections (e.g., to VCC and GND) are required, leveraging the discrete cathodes (Pins 1, 2, 4, 5) with appropriate biasing.
What reflow profile is recommended for the DFN1412-6 package?
Nexperia specifies JEDEC J-STD-020-compliant reflow for SOT1268: peak temperature 260 °C, time above 217 °C = 40–90 s, ramp-up ≤ 3 °C/s. The footprint in Fig. 11 requires 0.43 mm wide solder lands and 0.27 mm solder paste stencil aperture to ensure void-free thermal pad wetting and mechanical reliability.
BAW56SRA-QZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 6-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 2 Pair Common Anode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 90 V
- Current - Average Rectified (Io) (per Diode):
- 375mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 150 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 500 nA @ 80 V
- Operating Temperature - Junction:
- 150°C
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1412-6
BAW56SRA-QZ FAQ
1.How can I place an order for BAW56SRA-QZ through Aetrix?
Please submit a Request for Quotation (RFQ) for BAW56SRA-QZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAW56SRA-QZ reliable?
The price and inventory of BAW56SRA-QZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAW56SRA-QZ is usually 5 days.
3.What payment methods are accepted for BAW56SRA-QZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAW56SRA-QZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAW56SRA-QZ?
BAW56SRA-QZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAW56SRA-QZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAW56SRA-QZ?
For technical support, including BAW56SRA-QZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAW56SRA-QZ requirements.
6.How does Aetrix verify that BAW56SRA-QZ is sourced from the original manufacturer or authorized distributors?
All BAW56SRA-QZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAW56SRA-QZ meets industry standards.
7.What is the process for return or replacement of BAW56SRA-QZ?
All BAW56SRA-QZ units undergo pre-shipment inspection (PSI). If there is an issue with BAW56SRA-QZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAW56SRA-QZ part is unused and in its original packaging.
Return procedure for BAW56SRA-QZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAW56SRA-QZ Tags

-
BAV99-7-F
Diodes Incorporated

-
BAT54C-7-F
Diodes Incorporated

-
BAV99,215
Nexperia USA Inc.

-
BAT54SLT1G
onsemi

-
BAV70LT1G
onsemi

-
BAT54CLT1G
onsemi

-
BAT54S-7-F
Diodes Incorporated

-
BAV99LT1G
onsemi

-
BAT54S,215
Nexperia USA Inc.

-
BAS40-04LT1G
onsemi

-
MMBD1503-TP
Micro Commercial Co

-
BAV99WT1G
onsemi
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

