Nexperia USA Inc. BAW56W/ZLX

Overview

BAW56W from Nexperia is a dual high-speed switching diode in SOT323 (SC-70) package, featuring common-anode configuration, 90 V reverse voltage rating, ≤4 ns reverse recovery time, and ≤2 pF junction capacitance - deployed in RF signal routing and digital logic clamping circuits.

For engineers reviewing the BAW56W datasheet, BAW56W pinout, BAW56W application, or BAW56W equivalent, key selection criteria include trr ≤ 4 ns at IF = 10 mA, VR = 90 V, Cd ≤ 2 pF at 0 V, IF(max) = 150 mA per diode, and thermal resistance Rth(j-a) = 625 K/W on FR4 PCB.

Technical Context

The BAW56W integrates two independent silicon switching diodes sharing a common anode terminal, enabling compact dual-path clamping or steering without inter-die coupling. Its epitaxial planar structure ensures consistent trr ≤ 4 ns under standardized test conditions (IF = IR = 10 mA, RL = 100 Ω).

Designed for low-capacitance, high-speed operation, it delivers VF ≤ 855 mV at IF = 10 mA and IR ≤ 0.5 µA at VR = 80 V and 25 °C - supporting clean edge transitions in 50–200 MHz signal paths and TTL/CMOS interface protection.

Key Specifications

Pinout & Package

BAW56W uses the SC-70 (SOT323) plastic surface-mount package: 3-terminal, 1.3 mm pitch, 2.0 × 1.25 × 0.95 mm body, optimized for high-density RF and portable PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-diode switching applications.

Compared with BAV99W and MMBD7000, BAW56W uniquely balances 90 V VR, ≤4 ns trr, ≤2 pF Cd, and VF ≤ 855 mV at 10 mA - making it optimal for compact, high-frequency, low-voltage clamping where both speed and low forward loss are critical.

Availability

BAW56W is available at Aetrix Electronics and suitable for RF signal routing, digital logic clamping, and high-speed data line protection requiring stable component supply across production lifecycles.

Supply support for BAW56W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - delivering discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

BAW56W belongs to Nexperia's high-speed switching diode product line, engineered specifically for RF front-ends, logic interface protection, and compact signal conditioning where low trr, low Cd, and tight VF consistency are mandatory.

FAQ

What is the maximum continuous forward current per diode in BAW56W?

The BAW56W supports 150 mA continuous forward current per diode at Tamb ≤ 25 °C on a standard FR4 PCB. Derating is required above 25 °C ambient, following the 625 K/W thermal resistance curve - e.g., 100 mA at 50 °C ambient. Peak pulsed current reaches 4 A for 1 µs square wave pulses.

Can BAW56W be used in automotive applications?

No - BAW56W is explicitly marked as non-automotive qualified in its revision history (v.7, July 2022). It lacks AEC-Q101 qualification, temperature cycling validation, and automotive-grade reliability testing. For automotive use, Nexperia recommends the AEC-Q101-qualified BAW56W-Q variant or BAV756S-Q series.

How does the common-anode configuration affect circuit layout?

The CA (Pin 3) serves as the shared anode node, allowing both diodes to be biased from a single positive rail. This reduces trace count and simplifies PCB routing in dual-clamp designs - e.g., one BAW56W can clamp two separate signals to the same VCC rail while maintaining independent cathode paths (Pins 1 and 2) to distinct I/O lines.

Is BAW56W compatible with lead-free reflow soldering profiles?

Yes - BAW56W is rated for lead-free reflow per JEDEC J-STD-020. Its SC-70 package supports peak temperatures up to 260 °C for ≤40 seconds. Recommended footprint matches Nexperia's sot323_fr layout: 0.55 mm pad width, 0.6 mm length, 1.325 mm center-to-center spacing, with 0.5 mm solder mask opening per pad.