Infineon Technologies BAW79DE6327HTSA1

Overview

BAW79DE6327HTSA1 from Infineon Technologies is a silicon switching diode in SOT-89 package with common-cathode dual configuration, 400 V reverse voltage rating, 1 A continuous forward current, and 1 µs typical reverse recovery time - used in high-voltage DC-DC converter flyback snubbers and automotive ignition coil clamp circuits.

For engineers reviewing the BAW79DE6327HTSA1 datasheet, BAW79DE6327HTSA1 pinout, BAW79DE6327HTSA1 application, or BAW79DE6327HTSA1 equivalent, key selection criteria include verified 400 V V_R, thermal resistance R_thJS ≤ 35 K/W, 100 µA I_R at 150 °C, 2.0 V V_F at 2 A, and SOT-89 mechanical compatibility with board-level thermal management requirements.

Technical Context

This diode operates as a fast-switching, high-voltage clamp device with a common-cathode dual-die structure in a single SOT-89 leadframe. Its 400 V V(BR) and ≤1 µs trr enable reliable energy recycling in inductive load switching, while the 150 °C T_j rating supports under-hood automotive environments.

The device meets AEC-Q101 stress testing for automotive applications and features Pb-free (RoHS-compliant) packaging. Thermal performance is defined by junction-to-solder-point resistance ≤35 K/W, enabling direct PCB copper pour heatsinking without additional thermal vias in space-constrained layouts.

Key Specifications

Pinout & Package

SOT-89 package with 3-pin outline: molded plastic body, exposed thermal pad on underside, standard tape-and-reel packaging (1000 pcs/reel, ø180 mm).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage switching diode applications.

Compared with STTH1R04 and ES1J, BAW79DE6327HTSA1 uniquely delivers AEC-Q101 compliance, dual-anode common-cathode integration, and SOT-89 thermal efficiency - making it optimal for space-limited, thermally demanding automotive power stages where dual-path clamping or redundancy is required.

Availability

BAW79DE6327HTSA1 is available at Aetrix Electronics and suitable for automotive ignition systems, industrial DC-DC converters, and telecom power surge protection requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BAW79DE6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

BAW79DE6327HTSA1 belongs to Infineon's BAW78/BAW79 series of high-voltage switching diodes designed specifically for automotive-grade inductive load clamping and industrial power conversion snubbing applications.

FAQ

What is the maximum junction temperature and how does it affect thermal design?

The absolute maximum junction temperature is 150 °C. With R_thJS ≤ 35 K/W and a maximum case temperature of 115 °C, the device allows up to 1 W of power dissipation under steady-state conditions. Designers must ensure the solder-point temperature stays below 115 °C using adequate PCB copper area, as exceeding this limit violates the derating curve shown in the datasheet Figure 4.

Is BAW79DE6327HTSA1 suitable for bidirectional transient suppression?

No - it is a unidirectional switching diode optimized for forward conduction and reverse blocking. While it clamps inductive kickback in one direction, it lacks symmetrical avalanche capability or TVS-specific breakdown characteristics. For bidirectional surge protection, a dedicated TVS diode such as P6SMB400A is required.

How does the common-cathode configuration impact PCB layout?

The shared cathode (Pin 2) must be connected to a low-impedance, thermally robust copper pour - ideally ≥100 mm² of 2 oz copper - since it carries combined current from both anodes. Separating cathodes would require two SOT-89 footprints and double the thermal interface resistance, increasing junction temperature by ~25 °C at full load.

Does this part support reflow soldering per J-STD-020?

Yes - the SOT-89 package is rated for standard lead-free reflow profiles (peak temperature 260 °C, 10–15 sec dwell). The device passes JEDEC J-STD-020D.3 moisture sensitivity level 1 (MSL-1), meaning it may be stored indefinitely at ≤30 °C/60% RH without baking prior to assembly.