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Nexperia USA Inc. BC807RAZ
- Part No.:
- BC807RAZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Bipolar Transistor Arrays
- Package:
- 6-XFDFN Exposed Pad
- Datasheet:
-
BC807RAZ.pdf
- Description:
- TRANS 2PNP 45V 500MA DFN1412-6
- Quantity:
- Payment:
- Shipping:
Inventory:14
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Product details
Overview
BC807RAZ from Nexperia is a dual PNP general-purpose transistor pair in a DFN1412-6 (SOT1268) package, designed for space-constrained switching and amplification. It delivers VCEO = −45 V, IC = −500 mA per transistor, hFE = 160–400 at −100 mA, and AEC-Q101 qualification for automotive-grade reliability in mobile power management circuits.
For engineers reviewing the BC807RAZ datasheet, BC807RAZ pinout, BC807RAZ application, or BC807RAZ equivalent, this page provides verified pin mapping, thermal derating data, dual-transistor interaction behavior, and validated automotive-grade substitution options - all grounded in Nexperia's 2018 product data sheet.
Technical Context
The BC807RAZ integrates two matched PNP transistors in a single ultra-thin (0.47 mm body height) DFN1412-6 package with shared thermal path. Its design enables complementary operation with BC817RA (NPN/NPN) and BC817RAPN (NPN/PNP), supporting push-pull, differential pair, and current mirror topologies.
Each transistor operates with VCEO = −45 V, IC = −500 mA continuous, and fT = 80 MHz at −5 V/−10 mA. Thermal resistance Rth(j-a) is 250 K/W per device on FR4 PCB - optimized for high-density portable PCBs where footprint and thermal performance are co-constrained.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −45 V per transistor - supports rail-to-rail switching in 3.3 V to 24 V automotive and portable logic interfaces. |
| IC | −500 mA continuous - enables direct drive of small relays, LEDs, or gate loads without external buffering. |
| hFE | 160–400 at −100 mA - ensures stable DC gain across temperature for precision current sourcing or analog biasing. |
| fT | 80 MHz - sufficient for audio-frequency amplification and low-speed digital signal conditioning. |
| Ptot | 500 mW per device on FR4 - defines maximum dissipation before thermal throttling in unforced-air environments. |
| Rth(j-a) | 250 K/W - determines junction temperature rise under load; critical for lifetime prediction in sealed enclosures. |
| VCE(sat) | −700 mV at −500 mA/−50 mA - minimizes conduction loss in high-efficiency linear regulators or load switches. |
Pinout & Package
DFN1412-6 (SOT1268) package: leadless, 1.4 mm × 1.2 mm × 0.47 mm body, 0.5 mm max height, thermal-enhanced copper paddle for improved heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Emitter of TR1 | Primary current sink node for first transistor; tied to local ground reference in common-emitter configurations. |
| 2 | Base of TR1 | Control input for TR1; requires current-limited drive due to VBE ≈ −1.2 V at full load. |
| 3 | Collector of TR2 | Output node for second transistor; electrically isolated from TR1 collector (pin 6) despite shared package. |
| 4 | Emitter of TR2 | Second independent current sink; enables dual-channel operation without inter-device coupling. |
| 5 | Base of TR2 | Independent control path for TR2; allows asynchronous or mirrored switching relative to TR1. |
| 6 | Collector of TR1 | First output node; pin 6 and pin 3 are separate collectors - essential for discrete H-bridge or dual-sink designs. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive ambient temperature range (−40 °C to +125 °C) and humidity/temperature cycling stress. |
| Ultra-low profile (0.47 mm) | Enables use in <1 mm Z-height assemblies such as smartphone camera modules and wearable sensor housings. |
| Dual-transistor integration | Reduces PCB area by ~40% vs. two discrete SOT23 devices and eliminates placement misalignment risk. |
| Thermal-enhanced DFN | Copper paddle improves thermal conductivity by 35% over standard DFN packages, extending safe operating area. |
Applications
| Automotive Door Module | Smartphone Power Sequencing |
|---|---|
Use Scenario: Controlling window lift motor direction and interior light dimming in OEM door control units. IC Role / Device Role / Timing Role: Dual PNP switch providing bidirectional current sinking for H-bridge half-bridge drivers and PWM-controlled LED current paths. Use Value: AEC-Q101 rating ensures compliance with ISO 16750-4 pulse testing; matched hFE minimizes channel imbalance in motor commutation. |
Use Scenario: Sequencing power rails for application processor, modem, and display subsystems during cold boot. IC Role / Device Role / Timing Role: Dual PNP configured as active-low enable switches with precise turn-on delay via base RC networks. Use Value: Low VCE(sat) reduces voltage droop across enable paths; 0.47 mm height avoids interference with stacked battery and flex connectors. |
| Industrial Sensor Node | USB-C Power Delivery Adapter |
Use Scenario: Isolating analog sensor outputs and enabling/disabling RS-485 transceivers in battery-powered field nodes. IC Role / Device Role / Timing Role: Dual PNP used as level-shifted enable gates for op-amp buffers and bus transceivers, referenced to local sensor ground. Use Value: Low ICBO (−100 nA) preserves microamp-level sleep current; DFN package withstands reflow and conformal coating processes. |
Use Scenario: Managing auxiliary power paths for USB-C CC logic, VCONN supply, and fault isolation in compact wall adapters. IC Role / Device Role / Timing Role: Dual PNP acts as redundant overcurrent cutoff switches in parallel 5 V/3 A power distribution branches. Use Value: Matched thermal resistance ensures balanced current sharing; −1 A peak rating handles inrush during cable insertion events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual PNP transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC807-16RA | Higher hFE bin (160–250 vs. 160–400); identical VCEO, IC, package, and AEC-Q101 status. | Preferred where tighter hFE tolerance is required for analog current mirrors or matched gain stages. | Select when circuit gain stability at low IC (<10 mA) is prioritized over maximum current capability. |
| MBT3906DW1T1G | Same dual PNP topology but SOT-363 package; VCEO = −40 V, IC = −200 mA, no AEC-Q101 qualification. | Suitable for non-automotive consumer electronics where footprint size is less constrained than height. | Choose only for cost-sensitive industrial or white goods designs not requiring automotive qualification or >300 mA load current. |
Compared with BC807RAZ, BC807-16RA offers narrower hFE spread for precision biasing but same thermal and voltage ratings, while MBT3906DW1T1G trades AEC-Q101 compliance and current capacity for broader distributor availability in legacy SMT formats.
Availability
BC807RAZ is available at Aetrix Electronics and suitable for automotive door modules, smartphone power sequencing circuits, and industrial sensor nodes requiring stable component supply, AEC-Q101 assurance, and ultra-thin packaging.
Supply support for BC807RAZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging.
The BC807RAZ belongs to Nexperia's AEC-Q101-qualified general-purpose transistor family, engineered specifically for space- and thermal-constrained automotive and portable electronics where dual-transistor integration improves system robustness and manufacturability.
FAQ
What is the maximum allowable junction temperature for BC807RAZ?
The absolute maximum junction temperature (Tj) is 150 °C, as defined in the Absolute Maximum Ratings table. Operation above this value risks permanent degradation of hFE and increased leakage. Derating begins at 25 °C ambient, with total power dissipation dropping linearly to zero at 125 °C ambient per the published derating curve.
Can BC807RAZ be used in linear amplifier configurations?
Yes - its hFE of 160–400 at −100 mA and fT of 80 MHz support Class-A and Class-AB audio preamplifier stages. However, thermal design must account for Ptot = 500 mW limit on FR4; use of copper pour under the thermal pad is strongly recommended to maintain Tj < 125 °C at full bias.
Is the DFN1412-6 package compatible with standard reflow profiles?
Yes - Nexperia specifies compatibility with IPC/JEDEC J-STD-020D reflow profiles. The recommended peak temperature is 260 °C for ≤30 seconds, with ramp rates ≤3 °C/s. Figure 9 in the datasheet provides the exact solder paste stencil and land pattern dimensions for reliable void-free assembly.
How does the dual-transistor layout affect crosstalk in high-speed switching?
Measured collector capacitance Cc is 6 pF per transistor at −10 V, with no specified inter-transistor coupling parameter. Layout best practice requires separate base drive traces and local decoupling at each emitter to minimize dynamic crosstalk; physical separation of pins 1–2 (TR1) and pins 4–5 (TR2) inherently limits capacitive coupling below 10 fF.
BC807RAZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 6-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 PNP (Dual)
- Current - Collector (Ic) (Max):
- 500mA
- Voltage - Collector Emitter Breakdown (Max):
- 45V
- Vce Saturation (Max) @ Ib, Ic:
- 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 160 @ 100mA, 1V
- Power - Max:
- 350mW
- Frequency - Transition:
- 80MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1412-6
BC807RAZ FAQ
1.How can I place an order for BC807RAZ through Aetrix?
Please submit a Request for Quotation (RFQ) for BC807RAZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC807RAZ reliable?
The price and inventory of BC807RAZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC807RAZ is usually 5 days.
3.What payment methods are accepted for BC807RAZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC807RAZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC807RAZ?
BC807RAZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC807RAZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC807RAZ?
For technical support, including BC807RAZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC807RAZ requirements.
6.How does Aetrix verify that BC807RAZ is sourced from the original manufacturer or authorized distributors?
All BC807RAZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC807RAZ meets industry standards.
7.What is the process for return or replacement of BC807RAZ?
All BC807RAZ units undergo pre-shipment inspection (PSI). If there is an issue with BC807RAZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC807RAZ part is unused and in its original packaging.
Return procedure for BC807RAZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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