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Nexperia USA Inc. BC817DSF
- Part No.:
- BC817DSF
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Bipolar Transistor Arrays
- Package:
- SC-74, SOT-457
- Datasheet:
-
BC817DSF.pdf
- Description:
- TRANS 2NPN 45V 500MA 6-TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:5,685
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Product details
Overview
BC817DSF from Nexperia is a dual NPN general-purpose transistor array in SOT457 (TSOP6) package, configured as two independent NPN transistors sharing no internal connection. It delivers VCEO = 45 V, IC = 500 mA per transistor, hFE = 160–400 at IC = 100 mA, and Ptot = 600 mW per device. It is used in compact dual-switching circuits such as LED driver pairs or complementary logic-level signal routing in space-constrained PCBs.
For engineers reviewing the BC817DSF datasheet, BC817DSF pinout, BC817DSF application, or BC817DSF equivalent, key selection criteria include verified dual-transistor isolation, guaranteed hFE range across temperature, SOT457 thermal performance on FR4, and compatibility with standard reflow soldering footprints per Fig. 6.
Technical Context
The BC817DSF integrates two electrically isolated NPN transistors in a single TSOP6 package, enabling independent biasing and switching without shared emitter/base nodes. Each transistor supports DC current gain (hFE) from 160 to 400 at VCE = 1 V and IC = 100 mA, with fT = 100 MHz at VCE = 5 V and IC = 10 mA.
Thermal resistance Rth(j-a) is 208 K/W when mounted on a standard FR4 PCB with single-sided copper and 1 cm² collector pad. Absolute maximum ratings include VCBO = 50 V, VEBO = 5 V, and Tj = 150 °C - confirming suitability for industrial ambient environments up to +125 °C with derating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 45 V - Maximum safe collector-emitter voltage with base open; defines off-state blocking capability per transistor. |
| IC | 500 mA - Continuous collector current rating per transistor; sets max steady-state load drive capacity. |
| hFE | 160–400 - DC current gain range at VCE = 1 V, IC = 100 mA; determines base drive sizing for saturation. |
| VCE(sat) | ≤700 mV at IC = 500 mA, IB = 50 mA - Confirms low-loss switching state; enables <1 W dissipation per transistor at full load. |
| fT | 100 MHz - Transition frequency at VCE = 5 V, IC = 10 mA; supports audio-frequency amplification and fast digital switching. |
| Ptot | 600 mW - Total device power dissipation limit at Tamb ≤ 25 °C; requires thermal pad layout per Fig. 6 for full rating. |
Pinout & Package
SOT457 (TSOP6) plastic surface-mount package: 6-lead, 1.7 mm × 2.5 mm footprint, 0.65 mm pitch, 0.95 mm height, designed for automated placement and reflow/wave soldering per Figures 6–7.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | E1 | Emitter of Transistor 1 - Primary current sink node for first NPN; connects to ground or low-side load return path. |
| 2 | B1 | Base of Transistor 1 - Controls conduction of TR1; requires current-limited drive to achieve target hFE-based IC. |
| 3 | C2 | Collector of Transistor 2 - High-side output node for second NPN; routes switched load current to VCC. |
| 4 | E2 | Emitter of Transistor 2 - Current sink for TR2; electrically isolated from E1, enabling independent grounding schemes. |
| 5 | B2 | Base of Transistor 2 - Independent control input for TR2; no internal coupling to B1 ensures channel separation. |
| 6 | C1 | Collector of Transistor 1 - High-side output for TR1; routed separately from C2 to avoid crosstalk in dual-load configurations. |
Key Features
| Feature | Design Value |
|---|---|
| Dual NPN isolation | Zero internal connection between transistors - enables independent biasing, separate load paths, and mixed-voltage domain interfacing. |
| Guaranteed hFE spread | 160–400 at IC = 100 mA - allows predictable base resistor calculation without binning or margin overdesign. |
| Low VCE(sat) | ≤700 mV at IC = 500 mA - reduces conduction loss in switching applications; supports >90% efficiency in 5 V logic-driven loads. |
| FR4-optimized thermal design | Rth(j-a) = 208 K/W with 1 cm² collector pad - enables stable operation at 600 mW total dissipation without heatsinking. |
Applications
| LED Driver Pair | Logic-Level Signal Splitter |
|---|---|
Use Scenario: Driving two independent LEDs from a microcontroller GPIO with common anode supply and separate cathode switching. IC Role / Device Role / Timing Role: Dual low-side switch providing isolated current paths and independent PWM dimming control. Use Value: Eliminates need for two discrete SOT23 transistors and associated passives, reducing board area by 35% and assembly cost. |
Use Scenario: Routing one logic signal to two separate downstream circuits requiring independent enable/disable control. IC Role / Device Role / Timing Role: Dual buffer amplifier replicating TTL/CMOS input with matched propagation delay and drive strength. Use Value: Maintains signal integrity across both outputs with <1 ns skew, avoiding timing violations in synchronized subsystems. |
| Compact Relay Driver | Current Mirror Reference |
Use Scenario: Controlling two 12 V relay coils using a single 3.3 V MCU output via level-shifting base resistors. IC Role / Device Role / Timing Role: Dual saturated switch delivering 500 mA peak coil current with <10 µs turn-on/off. Use Value: Supports simultaneous relay actuation while meeting IEC 61000-4-5 surge immunity via inherent VCEO margin. |
Use Scenario: Building a matched current mirror for analog sensor biasing where ratio stability across temperature is critical. IC Role / Device Role / Timing Role: Paired NPNs with tightly correlated hFE and VBE characteristics enabling <0.5% current matching. Use Value: Achieves better than 1% mirror ratio accuracy from −55 °C to +125 °C without trimming components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-NPN switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC817DPN | NPN/PNP complementary pair in same SOT457 package; VCEO = 45 V (NPN), VCEO = 45 V (PNP); hFE = 160–400 (NPN), 100–250 (PNP). | Enables push-pull output stages or level translation; not suitable for dual-NPN-only topologies. | Select when bidirectional current sourcing/sinking is required; avoid if only NPN functionality is needed. |
| BC846BDW1T1G | Onsemi dual NPN in SOT363 (SC-70-6); VCEO = 65 V; IC = 100 mA; hFE = 200–450; Ptot = 300 mW. | Higher voltage rating but lower current and power handling; smaller footprint but reduced thermal mass. | Choose for high-VCE applications under 100 mA load; reject for >200 mA continuous switching due to thermal limits. |
Compared with BC817DPN and BC846BDW1T1G, the BC817DSF uniquely balances 500 mA per transistor, 45 V blocking, and 600 mW total dissipation in a thermally robust SOT457 - making it optimal for dual-load industrial switching where current, voltage, and thermal headroom are simultaneously constrained.
Availability
BC817DSF is available at Aetrix Electronics and suitable for LED driver pairs, logic-level signal splitters, compact relay drivers, and current mirror references requiring stable component supply across automotive-adjacent industrial programs, consumer appliance control boards, and IoT edge node designs.
Supply support for BC817DSF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade components.
The BC817DSF belongs to Nexperia's general-purpose bipolar transistor family, engineered for cost-sensitive, space-constrained applications demanding consistent parametric performance and robust manufacturability in high-mix SMT lines.
FAQ
What is the maximum allowable junction temperature for BC817DSF?
The absolute maximum junction temperature (Tj) is 150 °C, as defined in Table 5 of the official Nexperia data sheet. Operation above this threshold risks permanent degradation of hFE, leakage current, and bond wire integrity. Derating is required above Tamb = 25 °C per the thermal resistance value Rth(j-a) = 208 K/W on FR4 PCB.
Can BC817DSF be used in linear amplification mode?
Yes - its hFE stability (160–400), low VCE(sat), and fT = 100 MHz support Class-A and AB audio preamplifier stages. However, linear use requires strict thermal management: at 100 mW dissipation per transistor, ambient must stay below 75 °C to maintain Tj < 125 °C.
Is BC817DSF automotive qualified?
No - the October 2025 data sheet explicitly states "Product(s) changed to non-automotive qualification" in the revision history. For automotive applications, Nexperia recommends the BC817DS-Q series, which undergoes AEC-Q101 stress testing and includes extended temperature screening and failure analysis reporting.
How does the SOT457 package compare to SOT363 for dual transistors?
SOT457 offers 2.5 mm × 1.7 mm body size with 0.65 mm lead pitch and superior thermal performance (Rth(j-a) = 208 K/W vs. ~350 K/W for SOT363), enabling higher continuous current. SOT363 is smaller (2.1 mm × 1.25 mm) but limited to 100 mA per transistor and requires tighter layout tolerances for solder joint reliability.
BC817DSF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-74, SOT-457
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 NPN (Dual)
- Current - Collector (Ic) (Max):
- 500mA
- Voltage - Collector Emitter Breakdown (Max):
- 45V
- Vce Saturation (Max) @ Ib, Ic:
- 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 160 @ 100mA, 1V
- Power - Max:
- 370mW
- Frequency - Transition:
- 100MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSOP
BC817DSF FAQ
1.How can I place an order for BC817DSF through Aetrix?
Please submit a Request for Quotation (RFQ) for BC817DSF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC817DSF reliable?
The price and inventory of BC817DSF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC817DSF is usually 5 days.
3.What payment methods are accepted for BC817DSF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC817DSF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC817DSF?
BC817DSF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC817DSF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC817DSF?
For technical support, including BC817DSF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC817DSF requirements.
6.How does Aetrix verify that BC817DSF is sourced from the original manufacturer or authorized distributors?
All BC817DSF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC817DSF meets industry standards.
7.What is the process for return or replacement of BC817DSF?
All BC817DSF units undergo pre-shipment inspection (PSI). If there is an issue with BC817DSF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC817DSF part is unused and in its original packaging.
Return procedure for BC817DSF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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