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NXP Semiconductors BC817RA147
- Part No.:
- BC817RA147
- Manufacturer:
- NXP Semiconductors
- Category:
- Bipolar Transistor Arrays
- Package:
- 6-XFDFN Exposed Pad
- Datasheet:
-
BC817RA147.pdf
- Description:
- TRANS 2NPN 45V 500MA DFN1412-6
- Quantity:
- Payment:
- Shipping:
Inventory:10,000
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Product details
Overview
BC817RA147 from Nexperia is an AEC-Q101-qualified NPN/NPN double transistor in a DFN1412-6 (SOT1268) package, rated for 45 V VCEO, 500 mA IC, and 350 mW per transistor power dissipation at 25 °C ambient. It serves as a compact, low-profile switching and amplification pair in space-constrained automotive and mobile PCBs.
For engineers reviewing the BC817RA147 datasheet, BC817RA147 pinout, BC817RA147 application, or BC817RA147 equivalent, this device is selected for dual-transistor integration where reduced component count, thermal-enhanced ultra-thin packaging, and automotive-grade reliability are required.
Technical Context
The BC817RA147 integrates two matched NPN transistors in a single thermally enhanced DFN1412-6 package with shared thermal path and independent terminals. Each transistor supports DC current gain (hFE) of 160–400 at IC = 100 mA and 40–160 at IC = 500 mA, with VCE(sat) ≤ 700 mV at IC = 500 mA / IB = 50 mA.
It operates across −55 °C to +150 °C junction temperature range, with Rth(j-a) = 250 K/W for the full device on FR4 PCB. The package features 0.47 mm body height and 1.4 mm × 1.2 mm footprint - optimized for high-density reflow assembly.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 45 V - Maximum safe collector-emitter voltage per transistor under open-base condition; defines voltage headroom in switching applications. |
| IC | 500 mA - Continuous collector current rating per transistor; sets load-driving capability in linear or saturated operation. |
| hFE | 160–400 (IC = 100 mA) - DC current gain range enabling predictable base drive sizing for amplification or switching. |
| VCE(sat) | ≤ 700 mV (IC = 500 mA, IB = 50 mA) - Low saturation voltage minimizes conduction loss and self-heating in switching mode. |
| Ptot (device) | 500 mW - Total power dissipation limit for both transistors on FR4 PCB; determines thermal derating requirements above 25 °C. |
| fT | 100 MHz - Transition frequency supporting small-signal amplification up to VHF band with stable gain. |
| AEC-Q101 | Qualified - Meets automotive stress test requirements for discrete semiconductors; validated for under-hood and infotainment use. |
Pinout & Package
BC817RA147 uses the DFN1412-6 (SOT1268) package: leadless, ultra-thin (0.47 mm height), 1.4 mm × 1.2 mm body size, with exposed thermal pad (not electrically connected). Designed for surface-mount reflow on standard FR4 PCBs with defined solder land pattern (Nexperia sot1268_fr).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | E1 | Emitter of Transistor 1 - Common reference node for TR1; connects to ground or low-side load return path. |
| 2 | B1 | Base of Transistor 1 - Control input for TR1; requires current-limited drive to achieve target IC. |
| 3 | C2 | Collector of Transistor 2 - High-side output node for TR2; connects to supply rail or active load. |
| 4 | E2 | Emitter of Transistor 2 - Reference node for TR2; may be tied to E1 or used independently. |
| 5 | B2 | Base of Transistor 2 - Independent control input for TR2; enables dual-channel logic-level switching. |
| 6 | C1 | Collector of Transistor 1 - Primary output node for TR1; used for load switching or signal amplification. |
Key Features
| Feature | Design Value |
|---|---|
| Dual NPN integration | Reduces board area by ~40% vs. two discrete SOT23 transistors; eliminates two pick-and-place placements. |
| 0.47 mm profile | Enables stacking under connectors or beneath shields in slim mobile and ADAS modules. |
| AEC-Q101 qualification | Validated for automotive temperature cycling, humidity, and mechanical shock - no additional qualification needed for Tier-1 designs. |
| Thermal enhancement | 250 K/W Rth(j-a) (device) enables 500 mW total dissipation on standard FR4 - 43% higher than typical dual-SOT23 layout. |
| Matched hFE tracking | Transistors share fabrication process and thermal environment, improving gain consistency in differential or cascaded stages. |
Applications
| Automotive Body Control Module | Mobile Power Management |
|---|---|
Use Scenario: Driving LED arrays and small solenoids in door modules and seat controls. IC Role / Device Role / Timing Role: Dual NPN switch providing independent low-side drive for two loads with shared thermal management. Use Value: Eliminates need for two separate SOT23 packages, reducing PCB real estate by 3.2 mm² and simplifying BOM. |
Use Scenario: Enabling/disabling auxiliary rails (e.g., camera sensor bias, audio codec power) in smartphones and wearables. IC Role / Device Role / Timing Role: Compact dual-stage switch controlling power sequencing and load isolation. Use Value: 0.47 mm height allows placement under thin flex cables or beneath battery connectors without height conflict. |
| Industrial Sensor Interface | Consumer Audio Amplifier Bias |
Use Scenario: Level-shifting and buffering analog sensor outputs (e.g., thermistor, Hall effect) before ADC input. IC Role / Device Role / Timing Role: Dual emitter-follower configuration providing low-output-impedance buffering with matched gain. Use Value: Matched hFE and thermal coupling minimize offset drift between channels over temperature. |
Use Scenario: Setting quiescent current in Class AB headphone amplifier output stages. IC Role / Device Role / Timing Role: Dual NPN pair configured as current mirror for precise bias current generation. Use Value: Integrated matching reduces part-to-part variation in bias current, improving THD performance across production units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-NPN transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC817RAPN | NPN/PNP complementary pair in same DFN1412-6 package; not dual-NPN - unsuitable for identical circuit topology. | Used in push-pull or complementary switching; cannot replace BC817RA147 in NPN-only configurations without redesign. | Select only when complementary drive (e.g., half-bridge gate control) is required. |
| BC847BPDW1T1G | ON Semiconductor dual NPN in SOT-363 (SC-70-6); 45 V VCEO, 100 mA IC, larger 2.2 mm × 1.35 mm footprint, 1.1 mm height. | Lower current rating limits use to signal-level switching; taller profile restricts use in ultra-thin assemblies. | Choose when higher hFE (200–450) at low current is prioritized over power handling or height. |
Compared with BC817RA147, BC817RAPN provides complementary polarity but lacks dual-NPN functionality, while BC847BPDW1T1G offers higher gain at lower current but sacrifices 5× higher IC rating and fails to meet AEC-Q101 - making BC817RA147 the only qualified, high-current, ultra-low-profile dual-NPN option.
Availability
BC817RA147 is available at Aetrix Electronics and suitable for automotive body electronics, mobile power sequencing, and industrial sensor interface designs requiring stable component supply, AEC-Q101 compliance, and ultra-thin packaging.
Supply support for BC817RA147 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies - delivering high-performance, reliable discrete, logic, and MOSFET components.
The BC817RA147 belongs to Nexperia's AEC-Q101-qualified general-purpose transistor family, engineered for space-constrained automotive and portable electronics where reliability, thermal performance, and miniaturization are critical.
FAQ
What is the maximum operating temperature for BC817RA147?
The BC817RA147 has a maximum junction temperature (Tj) of 150 °C and an ambient operating range of −55 °C to +150 °C. Its thermal resistance (Rth(j-a)) is 250 K/W for the full device on FR4 PCB, meaning sustained power dissipation must be derated above 25 °C ambient - for example, to ~300 mW at 75 °C ambient. This rating supports under-hood automotive deployment.
Is BC817RA147 pin-compatible with BC817-16 or BC847 variants?
No, BC817RA147 is not pin-compatible with through-hole BC817-16 or SOT23-packaged BC847 variants. It uses the 6-pin DFN1412-6 (SOT1268) layout with unique pin assignment (E1-B1-C2-E2-B2-C1), whereas BC817-16 uses TO-92 and BC847 variants use SOT23-3 or SOT363. PCB redesign and footprint change are required for migration.
Does BC817RA147 support 5 V logic-level drive?
Yes, BC817RA147 supports 5 V logic-level drive: at IC = 500 mA and IB = 50 mA, VBE is ≤ 1.2 V and VCE(sat) is ≤ 700 mV, confirming full saturation with standard 5 V microcontroller GPIO. Base resistor calculation assumes ~0.7–0.9 V VBE(on) at 25 °C, consistent with TTL/CMOS-compatible switching.
What marking code identifies BC817RA147 on the package?
The BC817RA147 is marked with the code "A7" on the top surface of the DFN1412-6 package. This 2-character laser marking is visible under magnification and aligns with Nexperia's standard marking scheme for the BC817RA series - distinct from BC817RAPN ("A8") and BC807RA ("A6").
How does BC817RA147's thermal performance compare to dual SOT23 transistors?
BC817RA147 delivers 250 K/W Rth(j-a) for the full device on FR4 PCB, versus ~350–400 K/W for two discrete SOT23 transistors due to separate thermal paths and larger combined footprint. This 30–40% improvement in thermal resistance allows 500 mW total dissipation - 150 mW more than typical dual-SOT23 layouts - without added heatsinking.
BC817RA147 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 6-XFDFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Transistor Type:
- 2 NPN
- Current - Collector (Ic) (Max):
- 500mA
- Voltage - Collector Emitter Breakdown (Max):
- 45V
- Vce Saturation (Max) @ Ib, Ic:
- 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 160 @ 100mA, 1V
- Power - Max:
- 500mW
- Frequency - Transition:
- 100MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1412-6
BC817RA147 FAQ
1.How can I place an order for BC817RA147 through Aetrix?
Please submit a Request for Quotation (RFQ) for BC817RA147 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC817RA147 reliable?
The price and inventory of BC817RA147 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC817RA147 is usually 5 days.
3.What payment methods are accepted for BC817RA147?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC817RA147 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC817RA147?
BC817RA147 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC817RA147 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC817RA147?
For technical support, including BC817RA147 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC817RA147 requirements.
6.How does Aetrix verify that BC817RA147 is sourced from the original manufacturer or authorized distributors?
All BC817RA147 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC817RA147 meets industry standards.
7.What is the process for return or replacement of BC817RA147?
All BC817RA147 units undergo pre-shipment inspection (PSI). If there is an issue with BC817RA147, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC817RA147 part is unused and in its original packaging.
Return procedure for BC817RA147:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BC817RA147 Tags
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