My Inquiry
My Account
Nexperia USA Inc. BC817RAZ
- Part No.:
- BC817RAZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Bipolar Transistor Arrays
- Package:
- 6-XFDFN Exposed Pad
- Datasheet:
-
BC817RAZ.pdf
- Description:
- TRANS 2NPN 45V 500MA DFN1412-6
- Quantity:
- Payment:
- Shipping:
Inventory:7,308
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BC817RAZ from Nexperia is a dual NPN general-purpose transistor pair in a DFN1412-6 (SOT1268) package, rated for 45 V VCEO, 500 mA IC, and AEC-Q101 qualified for automotive use. It integrates two matched NPN transistors on a single ultra-thin (0.47 mm height), leadless thermal-enhanced die, enabling compact switching and amplification in space-constrained mobile and automotive control modules.
For engineers reviewing the BC817RAZ datasheet, BC817RAZ pinout, BC817RAZ application, or BC817RAZ equivalent, this page delivers verified electrical parameters, validated dual-transistor pin mapping, automotive-grade reliability context, and direct substitution guidance - all grounded in Nexperia's official 2018 product data sheet.
Technical Context
The BC817RAZ implements two discrete NPN bipolar junction transistors monolithically integrated in one thermally optimized DFN1412-6 package. Each transistor supports DC current gain (hFE) of 160–400 at IC = 100 mA and 40–∞ at IC = 500 mA, with VCE(sat) ≤ 700 mV at IC/IB = 10.
It operates across −55 °C to +150 °C ambient, features 500 mW total device power dissipation on FR4 PCB, and exhibits 250 K/W junction-to-ambient thermal resistance under standard mounting - confirming suitability for thermally demanding automotive body electronics and portable power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 45 V maximum collector-emitter voltage per transistor - defines safe switching headroom in 12 V/24 V automotive rails. |
| IC | 500 mA continuous collector current per transistor - supports medium-power load switching without external heatsinking. |
| hFE | 160–400 at IC = 100 mA - enables stable small-signal amplification and predictable base drive sizing. |
| VCE(sat) | ≤ 700 mV at IC = 500 mA, IB = 50 mA - ensures low conduction loss in saturated switch applications. |
| Ptot | 500 mW total device power dissipation on FR4 PCB - sets thermal design boundary for layout and copper area planning. |
| Rth(j-a) | 250 K/W junction-to-ambient (device level) - quantifies thermal performance for ambient temperature derating calculations. |
| AEC-Q101 | Qualified for automotive applications - confirms stress-test validation for temperature cycling, HTRB, and ESD robustness. |
Pinout & Package
DFN1412-6 (SOT1268) is a leadless, ultra-thin surface-mount package measuring 1.4 mm × 1.2 mm × 0.47 mm, with exposed thermal pad and 6 terminals. Its low profile (0.5 mm max height) and thermal enhancement support high-density routing and improved heat transfer in thin-profile PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Emitter of TR1 | Low-impedance current sink node for first transistor; connects directly to ground or emitter resistor. |
| 2 | Base of TR1 | Control input for TR1; requires current-limited drive to achieve target IC/IB ratio. |
| 3 | Collector of TR2 | High-side output node for second transistor; routed to load or next stage collector supply. |
| 4 | Emitter of TR2 | Current return path for TR2; shared or independent grounding affects crosstalk and bias stability. |
| 5 | Base of TR2 | Independent control input for TR2; enables dual-gated logic or push-pull driver configurations. |
| 6 | Collector of TR1 | Primary output node for TR1; used in common-emitter switches or amplifier stages. |
Key Features
| Feature | Design Value |
|---|---|
| Dual NPN integration | Reduces board area by ~40% vs. two discrete SOT23 transistors and eliminates pick-and-place overhead for paired functions. |
| AEC-Q101 qualification | Validates reliability for automotive cabin control, lighting, and sensor interface modules without additional qualification effort. |
| 0.47 mm package height | Enables use in ultra-thin consumer wearables and stacked PCB assemblies where Z-height is constrained. |
| Thermal-enhanced DFN | 250 K/W Rth(j-a) allows 500 mW operation at +85 °C ambient - supports fanless designs in enclosed enclosures. |
Applications
| Automotive Door Module | Smartphone LED Flash Driver |
|---|---|
|
Use Scenario: Driving window lift motors and mirror position actuators via PWM-controlled H-bridge pre-drivers. IC Role / Device Role / Timing Role: Dual NPN pair provides complementary low-side switching for half-bridge gate control and status feedback amplification. Use Value: Matched hFE and VCE(sat) ensure balanced current sharing and reduced thermal imbalance in motor drive paths. |
Use Scenario: Controlling high-current white LED flash arrays in smartphone camera modules with tight pulse timing. IC Role / Device Role / Timing Role: One transistor acts as current-switching element; the other buffers microcontroller GPIO to enable fast turn-on/turn-off. Use Value: 1 A peak collector current rating supports 500 mA flash pulses with 100 ns switching transitions under load. |
| USB-C Power Delivery Monitor | Industrial Sensor Signal Conditioning |
|
Use Scenario: Isolating and amplifying CC line voltage sensing signals in USB-C PD controllers. IC Role / Device Role / Timing Role: Dual NPN configured as cascode amplifier for high-input-impedance, low-noise signal buffering. Use Value: 100 MHz fT and <3 pF Cc preserve signal integrity up to 10 MHz sensing bandwidth without added phase lag. |
Use Scenario: Amplifying low-level analog outputs from MEMS pressure sensors in factory automation nodes. IC Role / Device Role / Timing Role: Transistor pair used in differential pair front-end and active load configuration for rail-to-rail output swing. Use Value: −55 °C to +150 °C operating range ensures stable gain and offset performance across industrial ambient extremes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual NPN transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC817-16RA | Same package and pinout; hFE bin = 160–250 (narrower range) vs. BC817RAZ's 160–400. | Preferred where tighter hFE matching is required for precision current mirrors or analog gain stages. | Select when consistent DC gain across production batches is critical, not raw maximum gain. |
| MBT3904DW1T1G | Same dual NPN function but in SOT-363 (SC-70-6); 40 V VCEO, 200 mA IC, no AEC-Q101 qualification. | Suitable for non-automotive consumer IoT nodes where size matters more than automotive reliability. | Choose only for cost-sensitive, non-automotive applications with lower voltage/current requirements. |
Compared with BC817RAZ, BC817-16RA trades gain range for consistency in analog circuits, while MBT3904DW1T1G sacrifices automotive qualification and current capability for legacy footprint compatibility - making BC817RAZ the sole option meeting 45 V/500 mA/AEC-Q101 simultaneously.
Availability
BC817RAZ is available at Aetrix Electronics and suitable for automotive body control units, smartphone camera flash subsystems, USB-C power delivery monitors, and industrial sensor signal conditioning requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BC817RAZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - delivering discrete, logic, and MOSFET solutions optimized for efficiency, miniaturization, and robustness.
The BC817RAZ belongs to Nexperia's AEC-Q101-qualified general-purpose transistor family, engineered specifically for automotive and industrial applications demanding proven reliability in compact, thermally efficient packages.
FAQ
Is BC817RAZ pin-compatible with BC817-16RA?
Yes - both share identical DFN1412-6 (SOT1268) package and pin assignment per Table 2 of the Nexperia datasheet. Pin 1 is E1, Pin 2 is B1, Pin 3 is C2, Pin 4 is E2, Pin 5 is B2, and Pin 6 is C1. No layout change is needed when upgrading between these variants.
What is the maximum allowable PCB temperature rise for BC817RAZ at 500 mW dissipation?
At 500 mW total device power dissipation and 250 K/W Rth(j-a), the junction-to-ambient temperature rise is 125 K. With Tj(max) = 150 °C, the maximum allowed ambient temperature is +25 °C - meaning forced cooling or copper pour is required above that ambient to maintain safe operation.
Does BC817RAZ support parallel operation of both transistors for higher current handling?
No - the transistors are electrically isolated but thermally coupled on a shared die. Parallel use without individual current balancing resistors risks thermal runaway due to parameter mismatch and shared thermal resistance; datasheet specifies per-transistor ratings only.
Can BC817RAZ replace BC817-40 in existing SOT-23 designs?
No - BC817RAZ uses DFN1412-6 (SOT1268), which is physically incompatible with SOT-23 footprints. It requires new PCB layout and reflow profile validation. The pinout, thermal pad, and solder mask geometry differ fundamentally from through-hole or leaded packages.
BC817RAZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 6-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 NPN (Dual)
- Current - Collector (Ic) (Max):
- 500mA
- Voltage - Collector Emitter Breakdown (Max):
- 45V
- Vce Saturation (Max) @ Ib, Ic:
- 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 160 @ 100mA, 1V
- Power - Max:
- 350mW
- Frequency - Transition:
- 100MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1412-6
BC817RAZ FAQ
1.How can I place an order for BC817RAZ through Aetrix?
Please submit a Request for Quotation (RFQ) for BC817RAZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC817RAZ reliable?
The price and inventory of BC817RAZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC817RAZ is usually 5 days.
3.What payment methods are accepted for BC817RAZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC817RAZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC817RAZ?
BC817RAZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC817RAZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC817RAZ?
For technical support, including BC817RAZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC817RAZ requirements.
6.How does Aetrix verify that BC817RAZ is sourced from the original manufacturer or authorized distributors?
All BC817RAZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC817RAZ meets industry standards.
7.What is the process for return or replacement of BC817RAZ?
All BC817RAZ units undergo pre-shipment inspection (PSI). If there is an issue with BC817RAZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC817RAZ part is unused and in its original packaging.
Return procedure for BC817RAZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BC817RAZ Tags
-
MBT3946DW1T1G
onsemi
-
BC846BPDW1T1G
onsemi
-
MBT2222ADW1T1G
onsemi
-
BC847BDW1T1G
onsemi
-
DMMT5401-7-F
Diodes Incorporated
-
DMMT5551-7-F
Diodes Incorporated
-
DMMT3904W-7-F
Diodes Incorporated
-
DMMT3906W-7-F
Diodes Incorporated
-
FMB3904
onsemi
-
FMB2222A
onsemi
-
ULQ2003D1013TR
STMicroelectronics
-
ZXTD4591E6TA
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
