Nexperia USA Inc. BCM56DSX
- Part No.:
- BCM56DSX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Bipolar Transistor Arrays
- Package:
- SC-74, SOT-457
- Datasheet:
-
BCM56DSX.pdf
- Description:
- TRANS 2NPN 80V 1A 6TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:286
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BCM56DS from Nexperia is an AEC-Q101-qualified NPN/NPN matched double transistor in SOT457 (TSOP6) package, designed for precision current mirroring and differential amplification. It delivers 80 V VCEO, 1 A continuous collector current per transistor, 5% hFE matching (0.95–1.05), and ≤2 mV VBE matching - enabling stable biasing in automotive power management and MOSFET driver stages.
For engineers reviewing the BCM56DS datasheet, BCM56DS pinout, BCM56DS application, or BCM56DS equivalent, this device is selected where matched gain and voltage characteristics across dual transistors are critical - especially in high-side switch drivers, linear regulators, and temperature-stable analog front-ends requiring minimal component count and AEC-Q101 compliance.
Technical Context
The BCM56DS integrates two electrically isolated NPN transistors on a single die with tightly controlled process matching, ensuring consistent DC current gain (hFE) and base-emitter voltage (VBE) across temperature and operating conditions. Its pinout places complementary emitter-collector terminals on opposite sides to minimize parasitic coupling in differential configurations.
Designed for surface-mount assembly on FR4 PCBs, it supports both reflow and wave soldering per defined footprints and exhibits thermal resistance of 313 K/W (junction-to-ambient, per device, standard footprint). The device operates over −55 °C to +150 °C ambient, with junction temperature limited to 150 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 80 V - Maximum safe collector-emitter voltage with base open; enables use in 48 V automotive systems and industrial power rails. |
| IC | 1 A - Continuous collector current per transistor; supports medium-power switching and regulation without external heatsinking. |
| hFE matching | 0.95–1.05 - ±5% DC current gain ratio between TR1 and TR2; ensures balanced current division in mirror topologies. |
| VBE1−VBE2 | ≤2 mV - Maximum absolute difference in base-emitter turn-on voltage; critical for low-offset differential pairs and precision bias networks. |
| Ptot (per device) | 400 mW - Total power dissipation at Tamb ≤ 25 °C on standard FR4; defines thermal headroom for sustained operation in compact layouts. |
| fT | 100–155 MHz - Transition frequency at VCE = 5 V, IC = 50 mA; supports high-speed switching up to ~50 MHz in driver applications. |
| AEC-Q101 qualified | Qualified per Automotive Electronics Council stress test standard - validated for reliability in under-hood and powertrain control modules. |
Pinout & Package
Package: TSOP6 (SOT457), 6-pin surface-mount plastic package with 1.3 mm pitch, 2.7 mm × 3.1 mm body, and exposed pad-compatible layout per Figure 15 (reflow footprint).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | B1 | Base of Transistor 1 - Input control node for first NPN; routed separately to avoid crosstalk with B2. |
| 2 | B2 | Base of Transistor 2 - Independent control input for second NPN; paired with B1 for matched biasing. |
| 3 | C2 | Collector of Transistor 2 - High-side output node; shares package thermal path with C1 for symmetrical heat distribution. |
| 4 | E2 | Emitter of Transistor 2 - Return path for TR2; positioned adjacent to C2 to minimize loop inductance in switching paths. |
| 5 | E1 | Emitter of Transistor 1 - Return path for TR1; placed opposite E2 to support differential emitter-coupled configurations. |
| 6 | C1 | Collector of Transistor 1 - Primary high-current output node; electrically and thermally symmetric to C2. |
Key Features
| Feature | Design Value |
|---|---|
| Matched hFE tolerance | ±5% (0.95–1.05 ratio) - Enables <1% current error in mirror circuits without trimming resistors. |
| VBE matching | ≤2 mV difference - Reduces offset voltage in differential amplifiers and improves linearity in feedback loops. |
| AEC-Q101 qualification | Validated for automotive-grade reliability - eliminates need for additional qualification testing in Tier-1 power modules. |
| Application-optimized pinout | Opposed emitter-collector layout (E1/C1 vs E2/C2) - Minimizes inter-transistor coupling in high-gain analog stages. |
| Reduced component count | Dual NPN in single SOT457 - Replaces two discrete SOT23 transistors, saving >30% board area and reducing pick-and-place cycles. |
Applications
| Current Mirror | Differential Amplifier |
|---|---|
|
Use Scenario: Precision current replication in sensor biasing and DAC output stages. IC Role / Device Role / Timing Role: Dual-transistor current mirror core providing 1:1 mirrored output with matched hFE and VBE. Use Value: Achieves <0.5% current mismatch over −40 °C to +125 °C, eliminating need for laser-trimmed resistors. |
Use Scenario: Input stage of automotive engine control unit (ECU) analog signal conditioning. IC Role / Device Role / Timing Role: Matched NPN pair forming emitter-coupled differential pair with common-emitter load. Use Value: Delivers <100 µV input offset drift and CMRR >85 dB due to sub-2 mV VBE mismatch and thermal tracking. |
| Linear Voltage Regulator | MOSFET Driver |
|
Use Scenario: Pass transistor driver in low-noise LDOs for infotainment power domains. IC Role / Device Role / Timing Role: Darlington-connected or emitter-follower configured TR1/TR2 driving series pass element. Use Value: Enables 1.2 A output capability with <50 mV dropout at full load, leveraging combined current gain and thermal symmetry. |
Use Scenario: High-side gate driver for N-channel MOSFETs in 12 V/48 V DC-DC converters. IC Role / Device Role / Timing Role: Complementary NPN pair sourcing/sinking gate charge with matched switching thresholds. Use Value: Reduces gate drive rise/fall time mismatch to <5 ns, minimizing shoot-through risk in half-bridge topologies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar matched NPN transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCM53DS | PNP/PNP complement; same package, matching specs, but inverted polarity. | Required for complementary current mirrors or push-pull output stages - not interchangeable in NPN-only circuits. | Select when building complementary differential pairs or PNP-based regulators needing identical matching performance. |
| BC846BDW1T1G | Single-die dual NPN in SC-70; 65 V VCEO, 100 mA IC, no published hFE/VBE matching spec. | Limited to low-power signal-level applications; lacks AEC-Q101 qualification and current capability. | Choose only for non-automotive, low-current (<200 mA) designs where matching is secondary to cost and size. |
Compared with BCM53DS and BC846BDW1T1G, the BCM56DS uniquely combines automotive qualification, 1 A current rating, and guaranteed 5% hFE/2 mV VBE matching in a thermally optimized dual-transistor configuration - making it the sole option for AEC-Q101-compliant, medium-power matched analog functions.
Availability
BCM56DS is available at Aetrix Electronics and suitable for automotive power management, industrial linear regulators, and precision current mirror circuits requiring stable component supply and long-term lifecycle assurance.
Supply support for BCM56DS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging.
The BCM56DS belongs to Nexperia's AEC-Q101-qualified matched transistor product line, engineered specifically for automotive and industrial analog signal conditioning where gain and voltage matching directly impact system accuracy and safety.
FAQ
Is BCM56DS pin-compatible with BCM53DS?
No. While both use the SOT457 package, BCM53DS is a PNP/PNP matched pair with reversed pin functions: its Pin 1 is E1, Pin 6 is B1, and collector/emitter assignments are inverted relative to BCM56DS. Direct substitution would reverse polarity and cause circuit failure.
What is the maximum allowable peak current per transistor?
The BCM56DS supports a peak collector current (ICM) of 2 A for single pulses ≤1 ms, as specified in Table 5. This applies under conditions where duty cycle and thermal accumulation are controlled - e.g., short gate-drive pulses in MOSFET drivers.
Does BCM56DS require derating above 25 °C ambient?
Yes. Total device power dissipation must be derated linearly above 25 °C: from 400 mW at 25 °C to 0 mW at 150 °C, based on a thermal resistance of 313 K/W (junction-to-ambient, standard footprint). Derating slope is −3.2 mW/°C.
Can BCM56DS be used in linear amplifier configurations?
Yes. With fT ≥100 MHz, hFE stability from 150 mA to 500 mA, and low VCEsat (≤500 mV), it supports Class-A and AB linear amplifiers up to ~10 MHz - particularly in matched-pair emitter followers and differential input stages requiring tight gain tracking.
BCM56DSX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-74, SOT-457
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 NPN (Dual) Matched Pair
- Current - Collector (Ic) (Max):
- 1A
- Voltage - Collector Emitter Breakdown (Max):
- 80V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 63 @ 150mA, 2V
- Power - Max:
- 500mW
- Frequency - Transition:
- 155MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSOP
BCM56DSX FAQ
1.How can I place an order for BCM56DSX through Aetrix?
Please submit a Request for Quotation (RFQ) for BCM56DSX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCM56DSX reliable?
The price and inventory of BCM56DSX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCM56DSX is usually 5 days.
3.What payment methods are accepted for BCM56DSX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCM56DSX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BCM56DSX?
BCM56DSX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCM56DSX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCM56DSX?
For technical support, including BCM56DSX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCM56DSX requirements.
6.How does Aetrix verify that BCM56DSX is sourced from the original manufacturer or authorized distributors?
All BCM56DSX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCM56DSX meets industry standards.
7.What is the process for return or replacement of BCM56DSX?
All BCM56DSX units undergo pre-shipment inspection (PSI). If there is an issue with BCM56DSX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCM56DSX part is unused and in its original packaging.
Return procedure for BCM56DSX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BCM56DSX Tags

-
MBT3946DW1T1G
onsemi

-
BC846BPDW1T1G
onsemi

-
MBT2222ADW1T1G
onsemi

-
BC847BDW1T1G
onsemi

-
DMMT5401-7-F
Diodes Incorporated

-
DMMT5551-7-F
Diodes Incorporated

-
DMMT3904W-7-F
Diodes Incorporated

-
DMMT3906W-7-F
Diodes Incorporated

-
FMB3904
onsemi

-
FMB2222A
onsemi

-
ULQ2003D1013TR
STMicroelectronics

-
ZXTD4591E6TA
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

