Nexperia USA Inc. BCM846BSH-QF

Overview

BCM846BSH-QF from Nexperia is an AEC-Q101-qualified NPN/NPN matched double transistor in SOT363 (TSSOP6) package, rated for 65 V V_CEO, 100 mA I_C, and 175 °C junction temperature. It delivers h_FE matching ratio of 0.95–1.05 and V_BE matching ≤2 mV at 2 mA, enabling precision current mirroring and differential amplification in automotive powertrain and body control modules.

For engineers reviewing the BCM846BSH-QF datasheet, BCM846BSH-QF pinout, BCM846BSH-QF application, or BCM846BSH-QF equivalent, this device supports high-temperature analog signal conditioning where transistor pair matching, low V_CE(sat) (≤300 mV @ 100 mA), and minimal mutual interference are critical selection criteria.

Technical Context

This dual NPN transistor integrates two electrically isolated silicon epitaxial planar transistors on a single die with matched h_FE and V_BE characteristics. Its design eliminates cross-talk between channels and maintains parameter tracking across temperature (−55 °C to +175 °C).

The device operates with V_CEO = 65 V, V_CBO = 80 V, and V_EBO = 7 V, supporting robust biasing in automotive 12 V/24 V systems. Thermal resistance R_th(j-a) is 375 K/W per device on FR4 PCB, enabling stable operation without forced cooling in under-hood environments.

Key Specifications

Pinout & Package

SOT363 (TSSOP6) plastic surface-mount package: 2.1 mm × 1.25 mm × 0.95 mm body, 0.65 mm lead pitch, FR4-compatible footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar matched NPN transistor applications.

Compared with BCM846BSH-QF, BCM847BSH-Q trades matching precision for higher gain in non-critical bias networks, while BC846BPDW1T1G lacks AEC-Q101 validation-making it unsuitable for powertrain or chassis control despite identical electrical specs.

Availability

BCM846BSH-QF is available at Aetrix Electronics and suitable for automotive powertrain control, body electronics, and industrial sensor interface applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BCM846BSH-QF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-volume, high-reliability logic, discrete, and MOSFET solutions, with leadership in automotive-qualified components.

This device belongs to Nexperia's AEC-Q101-qualified matched transistor family, engineered specifically for precision analog functions in automotive ECUs where parameter tracking and thermal robustness are mandatory.

FAQ

What is the maximum allowable ambient temperature for continuous operation?

The BCM846BSH-QF supports continuous operation up to +175 °C junction temperature. With R_th(j-a) = 375 K/W on FR4 PCB, ambient temperature must be limited to +125 °C at 100 mA per transistor to maintain T_j ≤ 175 °C. Derating curves in Figure 1 confirm 400 mW total device dissipation at 25 °C ambient.

Can Pin 3 and Pin 6 be used as a common collector node?

No. Pin 3 is the collector of TR2 and Pin 6 is the collector of TR1; they are physically and electrically isolated. The datasheet explicitly states "no mutual interference between the transistors," and internal construction prevents shared collector connections. Using them as a common node would violate isolation and invalidate matching specifications.

How does V_BE matching perform at elevated temperatures?

V_BE matching remains ≤2 mV up to 150 °C, as confirmed by characterization data in Table 7 and Figure 4. Both transistors exhibit identical −2 mV/K temperature coefficient, preserving offset cancellation in differential configurations across the full automotive operating range.

Is the SOT363 footprint compatible with standard reflow profiles?

Yes. The recommended reflow soldering footprint (Figure 12) uses 0.5 mm × 0.5 mm solder pads with 0.65 mm pitch and complies with IPC-7351B density level A. It supports JEDEC J-STD-020D peak temperatures up to 260 °C for 30 seconds, verified in Nexperia's process qualification report.