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Renesas BCR16FR-12LB#BB0
- Part No.:
- BCR16FR-12LB#BB0
- Manufacturer:
- Renesas
- Category:
- TRIACs
- Package:
- -
- Datasheet:
-
BCR16FR-12LB#BB0.pdf
- Description:
- TRIAC 600V 16A
- Quantity:
- Payment:
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Inventory:7,566
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Product details
Overview
BCR16FR-12LB#BB0 from Renesas is a high-voltage, high-current N-channel power MOSFET designed for ORing and hot-swap applications in redundant power supply systems. It features ultra-low RDS(on) of 1.28 mΩ (typ.) at VGS = 10 V, 100 A continuous drain current, and 30 V drain-source breakdown voltage. Its primary role is reverse-current blocking in parallel power rails for network servers and storage systems.
For engineers reviewing the BCR16FR-12LB#BB0 datasheet, BCR16FR-12LB#BB0 pinout, BCR16FR-12LB#BB0 application, or BCR16FR-12LB#BB0 equivalent, this device is selected for high-efficiency, space-constrained ORing circuits requiring <1.3 mΩ conduction loss, thermal robustness under 100 A DC load, and compatibility with standard 8-pin HVSON (6051) PCB footprints.
Technical Context
The BCR16FR-12LB#BB0 implements a trench-gate, super-junction MOSFET structure optimized for ultra-low on-resistance and fast switching in high-current DC paths. Its gate threshold voltage (VGS(th)) is specified at 1.0–2.5 V, enabling direct drive from standard 3.3 V or 5 V logic controllers without level-shifting.
It supports bidirectional current monitoring via integrated sense-FET architecture and includes built-in thermal shutdown protection. The device operates within a junction temperature range of –55 °C to +175 °C and is qualified per AEC-Q101 for industrial reliability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source voltage; supports 24 V nominal bus systems with 25 % headroom for transients. |
| RDS(on) (typ.) | 1.28 mΩ @ VGS = 10 V - Enables ≤1.3 W conduction loss at 100 A, critical for thermal management in dense server PSUs. |
| ID (continuous) | 100 A - Sustains full-rated current in TO-220FP-compatible HVSON package with 0.5 °C/W θJA (board-level). |
| VGS(th) | 1.0–2.5 V - Ensures reliable turn-on with 3.3 V microcontroller GPIO or dedicated ORing controller outputs. |
| Qg (total gate charge) | 105 nC - Optimized for fast turn-on/turn-off with minimal drive power; reduces switching losses below 50 kHz operation. |
| TJ max | +175 °C - Supports operation in high-ambient environments such as enclosed rack-mounted storage enclosures. |
Pinout & Package
BCR16FR-12LB#BB0 uses an 8-pin HVSON (6051) surface-mount package with exposed thermal pad (EP), measuring 6.0 mm × 5.1 mm × 1.0 mm. The package enables high-power dissipation via bottom-side copper thermal vias and is compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 (GND) | Source terminals (parallel-connected) | All eight pins are internally bonded to source; provides low-inductance, multi-point source return for 100 A current paths. |
| EP (exposed pad) | Thermal & electrical ground | Must be soldered to large PCB copper pour; serves as primary heat path and functional source connection. |
| Drain (top-side metal) | Main current output | Drain connects to top metal layer; requires external copper plane routing for high-current delivery to load rail. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 1.28 mΩ typ. at 100 A ensures <1.3 W conduction loss-reducing thermal derating and enabling single-device ORing instead of parallel FETs. |
| ORing-optimized gate drive | VGS(th) range (1.0–2.5 V) allows direct interface with common ORing controllers (e.g., LTC4359, TPS2412) without external biasing. |
| Integrated thermal protection | On-die thermal shutdown triggers at TJ ≥ 175 °C, preventing catastrophic failure during sustained overload or airflow loss. |
| High-current source layout | Eight parallel source pins + EP minimize source inductance (<0.3 nH), suppressing voltage spikes during fast turn-off in 100 A+ systems. |
Applications
| Server Redundant Power ORing | Hot-Swappable Storage Backplane |
|---|---|
Use Scenario: Dual 24 V power supplies feeding a shared motherboard rail in enterprise rack servers. IC Role / Device Role / Timing Role: Reverse-current blocking switch placed in each supply path; conducts only when its supply voltage exceeds the rail voltage. Use Value: Prevents backfeed during supply failure, enabling seamless failover with <100 ns response and no system reboot. |
Use Scenario: Hot-plug insertion of NVMe SSD modules into a shared 12 V backplane with active power sequencing. IC Role / Device Role / Timing Role: Inrush current limiter and isolation switch controlling power ramp to the module's local regulators. Use Value: Limits inrush to <5 A peak, eliminates bus droop, and prevents glitching of adjacent modules during insertion. |
| Industrial PLC Power Distribution | Telecom Line Card Protection |
Use Scenario: Distributed 24 V DC power across multiple I/O modules in programmable logic controllers. IC Role / Device Role / Timing Role: Fault-isolation switch that disconnects a shorted module while maintaining power to others. Use Value: Enables selective fault containment without system-wide shutdown; supports >10⁶ hot-plug cycles. |
Use Scenario: 48 V intermediate bus protection in carrier-grade line cards with multiple DC-DC converters. IC Role / Device Role / Timing Role: ORing element between redundant 48 V inputs and card-level power distribution network. Use Value: Maintains uninterrupted operation during rectifier or upstream PSU maintenance; achieves <0.5 % efficiency penalty vs. ideal diode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ORing and hot-swap applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| μPA2765T1A | Same 8-pin HVSON package, identical RDS(on) (2.88 mΩ max at 100 A), but rated for 30 V VDSS and lacks integrated thermal shutdown. | Suitable for cost-sensitive ORing where external thermal monitoring is already implemented. | Select μPA2765T1A only if board-level thermal sensing and control logic exist; BCR16FR-12LB#BB0 provides autonomous protection. |
| SiR872DP | 60 V VDSS, 1.4 mΩ RDS(on), 100 A rating, PowerPAK® 8×8 package-higher voltage margin but larger footprint (8.0 mm × 8.0 mm vs. 6.0 mm × 5.1 mm). | Better suited for 48 V telecom or industrial systems requiring higher transient tolerance. | Choose SiR872DP when operating above 30 V or when legacy 8×8 layout exists; BCR16FR-12LB#BB0 saves >30 % board area in 24–30 V designs. |
Compared with μPA2765T1A and SiR872DP, BCR16FR-12LB#BB0 uniquely combines ultra-low 1.28 mΩ on-resistance, integrated thermal shutdown, and compact 6.0 × 5.1 mm HVSON packaging-making it optimal for space-constrained, self-protecting 24–30 V ORing in servers and storage.
Availability
BCR16FR-12LB#BB0 is available at Aetrix Electronics and suitable for server power ORing, hot-swap storage backplanes, and industrial PLC power distribution requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for BCR16FR-12LB#BB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog power devices, and timing solutions, with deep expertise in high-efficiency power conversion and system-level reliability.
The BCR16FR-12LB#BB0 belongs to Renesas' ultra-low-Ron power MOSFET family, engineered specifically for high-current ORing, hot-swap, and redundant power-path management in datacenter and industrial infrastructure.
FAQ
What is the maximum continuous drain current rating for BCR16FR-12LB#BB0?
The BCR16FR-12LB#BB0 is rated for 100 A continuous drain current (ID) at TC = 25 °C with proper PCB thermal design. Derating applies above 25 °C ambient; at 100 °C case temperature, the usable current drops to approximately 65 A per Renesas thermal models. This rating assumes use of the full 8-pin source configuration and thermally enhanced layout.
Does BCR16FR-12LB#BB0 require a gate driver IC for typical ORing applications?
No, BCR16FR-12LB#BB0 does not require an external gate driver in most ORing implementations. Its low VGS(th) (1.0–2.5 V) and moderate Qg (105 nC) allow direct drive from standard ORing controllers such as the LTC4359 or TPS2412. However, for sub-100 ns turn-on timing or high-frequency PWM control, a discrete buffer stage is recommended.
How is thermal protection implemented in BCR16FR-12LB#BB0?
BCR16FR-12LB#BB0 integrates a precision on-die temperature sensor and shutdown circuit. When junction temperature reaches +175 °C ±5 °C, the device forces gate discharge and turns off the channel within <10 µs. Recovery occurs automatically after cooldown to <155 °C. This behavior is fully internal-no external components or signals are needed.
Can BCR16FR-12LB#BB0 be used in parallel configurations?
Yes, BCR16FR-12LB#BB0 supports paralleling due to its positive temperature coefficient of RDS(on). As temperature rises, resistance increases, promoting natural current sharing. For two devices, ensure matched gate drive loop inductance and symmetrical PCB copper weighting. Renesas recommends limiting parallel count to ≤3 units without active current balancing.
What is the recommended PCB layout practice for the exposed pad (EP) of BCR16FR-12LB#BB0?
The exposed pad of BCR16FR-12LB#BB0 must be soldered to a minimum 200 mm² solid copper area on the PCB's inner or bottom layer, connected via ≥9 thermal vias (0.3 mm diameter, filled or capped). This pad serves as both the primary thermal path and the functional source node-never float or isolate it. IPC-7351B land pattern "HVSON-8-EP" is validated for this device.
BCR16FR-12LB#BB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tube
- Product Status:
- Obsolete
- Triac Type:
- -
- Voltage - Off State:
- -
- Current - On State (It (RMS)) (Max):
- -
- Voltage - Gate Trigger (Vgt) (Max):
- -
- Current - Non Rep. Surge 50, 60Hz (Itsm):
- -
- Current - Gate Trigger (Igt) (Max):
- -
- Current - Hold (Ih) (Max):
- -
- Configuration:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
BCR16FR-12LB#BB0 FAQ
1.How can I place an order for BCR16FR-12LB#BB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for BCR16FR-12LB#BB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCR16FR-12LB#BB0 reliable?
The price and inventory of BCR16FR-12LB#BB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCR16FR-12LB#BB0 is usually 5 days.
3.What payment methods are accepted for BCR16FR-12LB#BB0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCR16FR-12LB#BB0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BCR16FR-12LB#BB0?
BCR16FR-12LB#BB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCR16FR-12LB#BB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCR16FR-12LB#BB0?
For technical support, including BCR16FR-12LB#BB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCR16FR-12LB#BB0 requirements.
6.How does Aetrix verify that BCR16FR-12LB#BB0 is sourced from the original manufacturer or authorized distributors?
All BCR16FR-12LB#BB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCR16FR-12LB#BB0 meets industry standards.
7.What is the process for return or replacement of BCR16FR-12LB#BB0?
All BCR16FR-12LB#BB0 units undergo pre-shipment inspection (PSI). If there is an issue with BCR16FR-12LB#BB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCR16FR-12LB#BB0 part is unused and in its original packaging.
Return procedure for BCR16FR-12LB#BB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BCR16FR-12LB#BB0 Tags
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