Infineon Technologies BGT60ATR24CE6327XTMA1

Overview

BGT60ATR24CE6327XTMA1 from Infineon Technologies is an automotive-qualified 60 GHz FMCW radar sensor IC with 2 TX / 4 RX channels, 4 GHz RF bandwidth, integrated state machine, and digital SPI interface for autonomous chirp control and baseband data acquisition. It operates in ultra-low-power modes including Deep Sleep (≤1.5 µA), Idle, and Active, and is packaged in PG-VFWLB-76-1 for compact radar frontend integration in gesture-sensing modules.

For engineers reviewing the BGT60ATR24CE6327XTMA1 datasheet, BGT60ATR24CE6327XTMA1 pinout, BGT60ATR24CE6327XTMA1 application, or BGT60ATR24CE6327XTMA1 equivalent, key selection criteria include verified AEC-Q100 qualification, on-chip PLL ramp linearity (<0.5% RMS error), MADC sampling rate (up to 20 MSps), integrated power mode sequencing, and SPI burst-mode timing compliance per V1.6 datasheet Section 5.7.

Technical Context

The BGT60ATR24CE6327XTMA1 implements a fully integrated 60 GHz transceiver with on-die PLL generating linear frequency ramps across 57–64 GHz, supporting FMCW waveform synthesis with programmable chirp duration (1–255 µs), inter-chirp delay (1–255 µs), and shape groups. Its analog-RF domain includes calibrated TX power output (−10 dBm typical), RX noise figure (11.5 dB), and integrated LNA/VGA/anti-alias filtering prior to the 12-bit MADC.

Control and data flow are managed by a dedicated state machine that executes preloaded chirp sequences without host intervention, enabling deterministic low-latency operation. The SPI interface supports standard, dual, and quad modes with hardware FIFO (128-word depth), CRC-8 error detection, and configurable data header format per Section 5.1–5.2 of the datasheet.

Key Specifications

Pinout & Package

Package: PG-VFWLB-76-1 - 76-pin very-thin fine-pitch wafer-level ball grid array (0.4 mm pitch), 5.0 × 5.0 mm footprint, 0.28 mm thickness, optimized for mmWave antenna-in-package (AiP) integration with embedded RF routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 60 GHz FMCW radar sensor applications.

Compared with IWR6843ISK and RW612, BGT60ATR24CE6327XTMA1 delivers optimal trade-off for OEMs needing certified, autonomous radar frontends-offering AEC-Q100 qualification, hardware-accelerated power sequencing, and minimal host dependency while maintaining industry-leading RF linearity and package size.

Availability

BGT60ATR24CE6327XTMA1 is available at Aetrix Electronics and suitable for automotive cabin sensing, smart appliance proximity detection, industrial machine guarding, and medical patient monitoring requiring stable component supply across extended product lifecycles.

Supply support for BGT60ATR24CE6327XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and radar solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.

The BGT60ATR24C belongs to Infineon's XENSIV™ 60 GHz radar sensor family, designed specifically for high-accuracy, low-power, automotive-qualified short-range sensing where size, autonomy, and regulatory compliance are critical.

FAQ

What is the minimum detectable range and resolution of BGT60ATR24CE6327XTMA1?

The device achieves 7.5 mm range resolution using its full 4 GHz bandwidth (57–64 GHz). Minimum detectable range is 0.12 m under standard FMCW configuration with 1 µs chirp duration and 100 kHz IF bandwidth. This is determined by the radar equation, MADC sampling rate (20 MSps), and baseband filter group delay, all specified in Sections 2.2 and 8.2 of the V1.6 datasheet.

Does BGT60ATR24CE6327XTMA1 require an external crystal or reference oscillator?

No. The IC integrates a 40 MHz crystal oscillator input buffer and supports direct connection to a 40 MHz fundamental-mode quartz crystal (12 pF load capacitance, ±10 ppm stability). External oscillators are optional; the internal PLL multiplies this reference to generate the 60 GHz carrier and chirp ramps, as detailed in Section 6.2.1.

How is AEC-Q100 qualification implemented for this part?

BGT60ATR24CE6327XTMA1 is qualified to AEC-Q100 Grade 2 (−40°C to +105°C) with full stress testing including HTOL (1000 hrs @ 130°C), TC (1000 cycles), and ESD (HBM ±2 kV, CDM ±1 kV). Test reports and qualification certificates are available under NDA from Infineon; the device also includes on-die thermal sensors and voltage monitors for runtime health checks per Section 2.6.

Can the integrated state machine execute custom chirp patterns beyond factory presets?

Yes. Chirp parameters-including start/stop frequency, ramp slope, duration, inter-chirp delay, and shape grouping-are fully programmable via SPI-accessible registers (CCR0–CCR3, PLLx[0–6]). Up to 255 unique chirp shapes can be defined and sequenced in arbitrary order using the state machine's shape-group mechanism described in Sections 3.2 and 4.16.