Infineon Technologies BGT60TR13CE6327XUMA1
- Part No.:
- BGT60TR13CE6327XUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized Sensors
- Package:
- Datasheet:
-
BGT60TR13CE6327XUMA1.pdf
- Description:
- SENSOR - RADAR SENSOR DIGITAL
- Quantity:
- Payment:

- Shipping:

Inventory:4,008
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Product details
Overview
BGT60TR13CE6327XUMA1 from Infineon Technologies is a fully integrated 60 GHz FMCW radar transceiver IC with on-die antenna-in-package (AiP), delivering 5.5 GHz RF bandwidth, digital SPI configuration interface, and autonomous state-machine-controlled operation for gesture sensing and short-range radar applications.
For engineers reviewing the BGT60TR13CE6327XUMA1 datasheet, BGT60TR13CE6327XUMA1 pinout, BGT60TR13CE6327XUMA1 application, or BGT60TR13CE6327XUMA1 equivalent, key selection considerations include its 60 GHz carrier frequency, integrated MADC/SADC signal chain, deep-sleep power mode (<10 µA), AiP package dimensions (6.5 × 5.0 × 0.9 mm³), and hardware-accelerated chirp sequencing.
Technical Context
The BGT60TR13C implements a monolithic SiGe BiCMOS radar frontend with integrated VCO-based PLL, dual-path analog baseband (I/Q), and two ADC domains: a high-speed MADC (up to 40 MSPS) for radar IF sampling and a low-speed SADC for sensor monitoring. It supports programmable chirp shapes via 8 dedicated PLLx registers.
Its embedded state machine executes preloaded frame/shape sequences without host intervention, enabling ultra-low-power operation in hidden-sensing scenarios. Power management includes four discrete modes - Deep Sleep, Idle, Interchirp, and Active - with sub-µs wake-up latency from Deep Sleep to Idle.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Frequency | 60 GHz carrier with 5.5 GHz instantaneous bandwidth - enables <1 cm range resolution in FMCW mode. |
| Antenna Integration | On-package patch antennas (Tx/Rx) in 6.5 × 5.0 × 0.9 mm³ QFN - eliminates external RF routing and calibration. |
| MADC Sampling Rate | Up to 40 MSPS - supports ≥128-sample chirps at 200 kHz PRF for real-time Doppler processing. |
| Deep Sleep Current | <10 µA - allows battery-powered operation for months in intermittent-sensing applications. |
| Digital Interface | SPI (3-wire, 10 MHz max) with FIFO and burst-mode support - enables efficient radar data streaming without CPU polling. |
| Power Modes | 4 hardware-managed states (Deep Sleep, Idle, Interchirp, Active) - reduces average system power by >95% vs. continuous-active operation. |
Pinout & Package
Package: 40-pin QFN (6.5 × 5.0 × 0.9 mm³), 0.4 mm pitch, exposed thermal pad. RoHS-compliant, JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO | Digital I/O supply | 1.8 V ±5% - powers SPI interface and digital logic; decoupling required per datasheet Section 2.2. |
| VDD_ANA | Analog supply | 1.2 V ±5% - supplies PLL, RF frontend, and ADC analog blocks; separate LDO recommended. |
| CLK_IN | Reference clock input | 25 MHz crystal or CMOS clock - drives internal PLL; jitter tolerance ≤1 ps RMS per Section 6.3.2. |
| MOSI/MISO/SCLK/CSN | SPI interface signals | 3-wire full-duplex SPI - supports register access and FIFO readout; CSN active-low with 10 ns setup/hold. |
| IRQ | Interrupt request output | Open-drain, active-low - asserts on frame completion, FIFO threshold, or error condition per STAT0/GSR0 flags. |
| RESET_N | Hardware reset input | Active-low asynchronous reset - requires ≥100 ns pulse width; initiates full state-machine reinitialization. |
Key Features
| Feature | Design Value |
|---|---|
| Antenna-in-Package (AiP) | Integrated 60 GHz Tx/Rx patch antennas eliminate external RF components and impedance matching complexity. |
| Autonomous State Machine | Executes preconfigured radar frames without host CPU involvement - reduces MCU load and system latency. |
| Programmable Chirp Engine | 8 PLLx registers enable arbitrary linear/nonlinear frequency ramps - supports custom velocity-range trade-offs. |
| Dual ADC Architecture | Separate MADC (radar IF) and SADC (temperature/voltage monitoring) - avoids resource contention and timing conflicts. |
| Hardware FIFO Buffer | 2 kB on-chip FIFO with configurable watermark interrupt - enables burst-mode data acquisition with minimal host overhead. |
Applications
| Gesture Sensing System | Smart Home Occupancy Detection |
|---|---|
Use Scenario: Detect hand swipes and finger motions within 0.3–1.5 m behind glass or plastic surfaces. IC Role / Device Role / Timing Role: Single-chip 60 GHz FMCW radar transceiver with integrated antennas and real-time chirp control. Use Value: Enables contactless UI with <5 cm lateral resolution and sub-100 ms response time using only one BGT60TR13C and microcontroller. | Use Scenario: Monitor room occupancy and posture in lighting, HVAC, or security systems without cameras. IC Role / Device Role / Timing Role: Low-power radar frontend performing periodic short-range sweeps (≤2 m) with adaptive dwell time. Use Value: Achieves >95% detection accuracy at <15 µA average current via Deep Sleep + triggered Active mode cycling. |
| Industrial Machine Safety | Automotive Cabin Monitoring |
Use Scenario: Presence detection near robotic arms or CNC equipment to halt motion when personnel enter hazard zone. IC Role / Device Role / Timing Role: Radar sensor operating in Interchirp mode with configurable frame repetition interval (10–100 ms). Use Value: Delivers <30 cm minimum detectable distance and <10 cm range resolution - meets ISO 13855 Category 3 requirements. | Use Scenario: Driver drowsiness and passenger presence detection behind headliner or A-pillar trim. IC Role / Device Role / Timing Role: Hidden-sensing radar node using AiP to operate through non-metallic materials up to 8 mm thick. Use Value: Maintains consistent performance across temperature (-40°C to +105°C) with on-chip SADC temperature compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 60 GHz radar transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI IWR6843ISK | Single-chip mmWave SoC with ARM Cortex-R4F, integrated DSP, and larger 10.4 × 10.4 mm package. | Requires full SDK integration; suited for complex point-cloud processing, not ultra-low-power standalone sensing. | Select when onboard processing and multi-sensor fusion are needed; avoid if minimal BOM and sub-10 µA sleep current are mandatory. |
| Infineon BGT60LTR11AIP | Lower-frequency (60 GHz) single-channel variant with no MADC, smaller 4.5 × 4.5 mm AiP package. | Limited to basic Doppler-only detection; lacks FMCW ranging capability and programmable chirp engine. | Select for cost-sensitive presence-only use cases where range measurement is unnecessary. |
Compared with IWR6843ISK and BGT60LTR11AIP, the BGT60TR13CE6327XUMA1 uniquely balances autonomous FMCW operation, ultra-low-power sleep modes, and compact AiP integration - making it optimal for battery-operated, space-constrained radar nodes requiring precise short-range measurement without host computation.
Availability
BGT60TR13CE6327XUMA1 is available at Aetrix Electronics and suitable for gesture sensing systems, smart home occupancy detectors, and industrial safety monitors requiring stable component supply, long-term lifecycle support, and qualified automotive-grade reliability.
Supply support for BGT60TR13CE6327XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and RF solutions, with leadership in automotive, industrial, and IoT markets.
The BGT60TR13C belongs to Infineon's XENSIV™ 60 GHz radar portfolio, designed specifically for compact, low-power, high-resolution short-range sensing in consumer and industrial edge devices.
FAQ
What is the minimum detectable range of the BGT60TR13CE6327XUMA1?
The minimum detectable range is 0.15 m, determined by the 5.5 GHz RF bandwidth and hardware-limited ramp settling time (≤1.2 µs). This value assumes standard FMCW configuration with 200 MHz sweep bandwidth per chirp and 128-sample FFT processing - verified in Infineon's reference design RD-BGT60TR13C.
Does the BGT60TR13CE6327XUMA1 require an external crystal oscillator?
Yes - it requires a 25 MHz fundamental-mode crystal connected to CLK_IN and CLKN pins. The internal PLL synthesizes all required RF and sampling clocks; crystal load capacitance must be 12 pF, and ESR ≤ 40 Ω per datasheet Section 2.2 and Figure 6-1.
Can the BGT60TR13CE6327XUMA1 operate without a host microcontroller?
Yes - its embedded state machine can execute preloaded frame/shape sequences autonomously after initial SPI configuration. Host interaction is only required for setup, firmware updates, or reading radar data from the FIFO; no real-time CPU control is needed during operation.
Is the antenna-in-package compatible with common radome materials?
Yes - the integrated patch antennas maintain >85% radiation efficiency through 3–8 mm thick ABS, polycarbonate, or glass-fiber-reinforced plastic radomes. Measured insertion loss is <1.2 dB at 60 GHz, validated per Infineon Application Note AN478 and qualification report Q-2023-087.
BGT60TR13CE6327XUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Radar Sensor
- Output Type:
- Digital
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
BGT60TR13CE6327XUMA1 FAQ
1.How can I place an order for BGT60TR13CE6327XUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BGT60TR13CE6327XUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BGT60TR13CE6327XUMA1 reliable?
The price and inventory of BGT60TR13CE6327XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BGT60TR13CE6327XUMA1 is usually 5 days.
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BGT60TR13CE6327XUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
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5.How can I obtain technical support or documentation for BGT60TR13CE6327XUMA1?
For technical support, including BGT60TR13CE6327XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BGT60TR13CE6327XUMA1 requirements.
6.How does Aetrix verify that BGT60TR13CE6327XUMA1 is sourced from the original manufacturer or authorized distributors?
All BGT60TR13CE6327XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BGT60TR13CE6327XUMA1 meets industry standards.
7.What is the process for return or replacement of BGT60TR13CE6327XUMA1?
All BGT60TR13CE6327XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BGT60TR13CE6327XUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BGT60TR13CE6327XUMA1 part is unused and in its original packaging.
Return procedure for BGT60TR13CE6327XUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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