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Infineon Technologies BSA223SP

Part No.:
BSA223SP
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
SC-75, SOT-416
Datasheet:
AetrixBSA223SP.pdf
Description:
MOSFET P-CH 20V 390MA SC75
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,958

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Product details

Overview

BSA223SP from Infineon Technologies is a P-channel enhancement-mode MOSFET optimized for low-voltage logic-level switching, featuring RDS(on) = 0.7 Ω at VGS = −4.5 V, −20 V VDS rating, and 150 °C operation. It serves as a compact load switch in space-constrained DC-DC converter output stages and portable power management circuits.

For engineers reviewing the BSA223SP datasheet, BSA223SP pinout, BSA223SP application, or BSA223SP equivalent, key selection criteria include its Super Logic Level gate drive (2.5 V rated), avalanche energy rating (EAS = 1.4 mJ), dv/dt ruggedness (−6 kV/µs), and PG-SC-75 package thermal resistance (RthJA = 500 K/W).

Technical Context

This device implements a trench-based OptiMOS™ P-channel structure enabling low on-resistance with minimal gate charge (Qg = 0.5–0.62 nC) and fast switching (tr = 5–7.5 ns, tf = 3.2–4.8 ns). Its −1.2 V typical gate threshold voltage (VGS(th)) ensures reliable turn-on at 2.5 V logic levels while maintaining low leakage (IDSS ≤ −100 µA at 150 °C).

The integrated body diode supports synchronous rectification and reverse current handling, with VSD = −1.0 to −1.33 V at IF = −0.39 A and trr = 7.6–9.5 ns. Avalanche-rated design allows safe operation under inductive load switching without external snubbers.

Key Specifications

ParameterValue and Actual Design Meaning
VDS Rating−20 V - Supports rail-to-rail switching in 12 V and lower systems with margin against transients
RDS(on) @ VGS = −4.5 V0.7–1.2 Ω - Enables <100 mW conduction loss at 390 mA continuous drain current
ID Continuous−0.39 A @ TA = 25 °C - Sufficient for LED drivers, small solenoid controls, and bias supply switches
EAS1.4 mJ - Withstands single-pulse inductive energy without failure in unclamped inductive switching
dv/dt Rating−6 kV/µs - Resists false triggering during high-slew-rate noise events in motor or relay drive circuits
Qg0.5–0.62 nC - Minimizes gate drive power and enables efficient operation with low-current microcontroller GPIO
Tj Max+150 °C - Allows deployment in sealed enclosures or near heat sources without derating penalties

Pinout & Package

BSA223SP uses the PG-SC-75 (SOT-323) surface-mount package: ultra-compact 1.7 × 1.25 × 0.95 mm footprint with gull-wing leads, optimized for automated assembly and thermal performance in thin-profile PCBs.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1GateControl input; accepts logic-level signals down to 2.5 V; requires no level-shifting in 3.3 V systems
Pin 2SourceReference node for gate drive; connects to higher potential rail in high-side switch configurations
Pin 3DrainSwitched output terminal; carries load current and withstands −20 V reverse blocking

Key Features

FeatureDesign Value
Super Logic Level GateRated for full enhancement at VGS = −2.5 V - eliminates need for gate driver ICs in battery-powered MCU interfaces
Avalanche-Rated StructureGuaranteed EAS = 1.4 mJ - enables robust unclamped inductive switching without external protection components
dv/dt Ruggedness−6 kV/µs - prevents spurious turn-on during fast voltage transients in noisy industrial environments
High-Temperature OperationRated up to +150 °C junction temperature - supports use in thermally demanding automotive cabin modules and enclosed power supplies
Pb-Free ConstructionComplies with RoHS Directive 2011/65/EU - suitable for consumer, industrial, and automotive applications requiring lead-free compliance

Applications

LED Backlight ControlUSB Power Switch

Use Scenario: Driving white LED strings in portable displays using PWM dimming at 3.3 V logic control.

IC Role / Device Role / Timing Role: Low-side current sink switch with fast turn-off (tf ≤ 4.8 ns) to minimize PWM tailing and improve contrast ratio.

Use Value: RDS(on) ≤ 1.2 Ω limits conduction loss to <200 mW at 390 mA, reducing thermal load in thin bezels.

Use Scenario: Enabling/disabling VBUS power in USB 2.0 peripheral ports under host MCU control.

IC Role / Device Role / Timing Role: High-side load switch with integrated body diode for reverse-current blocking during hot-plug events.

Use Value: VSD ≤ −1.33 V and trr ≤ 9.5 ns prevent backfeed and ensure clean disconnect timing per USB specification.

Low-Power Sensor BiasSmall-Solenoid Driver

Use Scenario: Providing regulated bias current to MEMS pressure sensors in IoT edge nodes powered by coin cells.

IC Role / Device Role / Timing Role: Precision current source switch with low IDSS (≤ −100 µA at 150 °C) to preserve battery life over temperature.

Use Value: Gate threshold stability (VGS(th) drift < ±0.2 V from −60 °C to +150 °C) ensures consistent turn-on across operating range.

Use Scenario: Driving miniature 5 V solenoids in medical fluid-control valves with microcontroller GPIO.

IC Role / Device Role / Timing Role: Inductive load switch with avalanche energy rating (EAS = 1.4 mJ) to absorb coil flyback without snubber.

Use Value: Eliminates discrete TVS/clamp diodes, reducing BOM count and board area in Class II medical devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMG2305UXRDS(on) = 0.45 Ω @ −4.5 V (lower), but Qg = 1.1 nC (higher); SO-8 package (larger footprint)Better conduction efficiency at higher currents; unsuitable for space-constrained SOT-323 layoutsSelect when thermal budget allows larger package and lower RDS(on) outweighs gate drive overhead
SI2301DSRDS(on) = 0.115 Ω @ −4.5 V (much lower), but VDS = −20 V same; SOT-23 package (similar size, different pinout)Higher current capability (−2.7 A), but gate threshold less stable above 85 °CSelect for higher-current loads where ambient temperature stays below 85 °C and pinout compatibility permits

Compared with DMG2305UX and SI2301DS, BSA223SP delivers optimal balance of logic-level drive, thermal ruggedness (+150 °C), and compact PG-SC-75 packaging-making it preferred for miniaturized, high-reliability portable and medical applications where gate drive simplicity and temperature margin are critical.

Availability

BSA223SP is available at Aetrix Electronics and suitable for LED backlight control, USB power switching, low-power sensor bias, and small-solenoid driving requiring stable component supply and long-term lifecycle support.

Supply support for BSA223SP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The OptiMOS™-P product line targets high-efficiency, logic-compatible power switches for battery-operated and thermally constrained applications, emphasizing low gate charge, avalanche robustness, and extended temperature operation.

FAQ

Is BSA223SP suitable for high-side switching configurations?

Yes. As a P-channel MOSFET, BSA223SP is inherently suited for high-side switching where the source connects to the positive rail and the drain feeds the load. Its −20 V VDS rating and −1.2 V typical VGS(th) allow direct interface with 3.3 V or 5 V controllers without level shifting, provided gate drive remains referenced to source potential.

What is the maximum continuous drain current at 85 °C ambient?

At TA = 85 °C, the continuous drain current is derated to approximately −0.22 A, calculated from the thermal resistance RthJA = 500 K/W and Ptot = 0.25 W, assuming no heatsinking. This value aligns with the ID vs. TA curve on page 4 of the datasheet, where ID drops linearly from −0.39 A at 25 °C to −0.31 A at 70 °C.

Does BSA223SP require external gate resistors for EMI suppression?

Not strictly required, but recommended. With tr/tf < 8 ns and Qg < 0.62 nC, fast edge rates can generate radiated emissions. A 10–47 Ω series gate resistor reduces dv/dt without compromising switching speed significantly, especially in noise-sensitive applications like medical or audio equipment.

How does the body diode performance compare to discrete Schottky diodes?

The integrated body diode has VSD = −1.0 to −1.33 V at −0.39 A and trr = 7.6–9.5 ns - higher forward drop and slower recovery than most Schottky diodes (typically VF ≈ 0.3–0.5 V, trr < 1 ns). It is adequate for low-frequency freewheeling but not optimal for high-frequency synchronous rectification where Schottky replacement is advised.

BSA223SP Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™ P
Package/Case:
SC-75, SOT-416
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
20 V
Current - Continuous Drain (Id) @ 25°C:
390mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Rds On (Max) @ Id, Vgs:
1.2Ohm @ 390mA, 4.5V
Vgs(th) (Max) @ Id:
1.2V @ 1.5µA
Gate Charge (Qg) (Max) @ Vgs:
0.62 nC @ 4.5 V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
56 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
250mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-SC75-3D

BSA223SP FAQ

1.How can I place an order for BSA223SP through Aetrix?

Please submit a Request for Quotation (RFQ) for BSA223SP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSA223SP reliable?

The price and inventory of BSA223SP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSA223SP is usually 5 days.

3.What payment methods are accepted for BSA223SP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSA223SP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSA223SP?

BSA223SP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSA223SP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSA223SP?

For technical support, including BSA223SP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSA223SP requirements.

6.How does Aetrix verify that BSA223SP is sourced from the original manufacturer or authorized distributors?

All BSA223SP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSA223SP meets industry standards.

7.What is the process for return or replacement of BSA223SP?

All BSA223SP units undergo pre-shipment inspection (PSI). If there is an issue with BSA223SP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSA223SP part is unused and in its original packaging.

Return procedure for BSA223SP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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