Infineon Technologies BSC007N04LS6ATMA1
- Part No.:
- BSC007N04LS6ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
BSC007N04LS6ATMA1.pdf
- Description:
- MOSFET N-CH 40V 100A TDSON-8-6
- Quantity:
- Payment:

- Shipping:

Inventory:34
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSC007N04LS6ATMA1 from Infineon Technologies is an N-channel 40 V OptiMOSTM 6 power MOSFET in PG-TDSON-8 package, optimized for synchronous rectification in high-current DC/DC converters. It delivers 0.7 mΩ max RDS(on) at VGS = 10 V, supports 381 A continuous drain current at TC = 25 °C, and features 100% avalanche tested ruggedness for automotive and industrial power stages.
For engineers reviewing the BSC007N04LS6ATMA1 datasheet, BSC007N04LS6ATMA1 pinout, BSC007N04LS6ATMA1 application, or BSC007N04LS6ATMA1 equivalent, key selection criteria include low RDS(on) at 4.5 V gate drive, QG(0–4.5 V) = 45 nC for fast switching in high-frequency synchronous FETs, and thermal resistance RthJC = 0.8 °C/W for bottom-side cooling in compact power modules.
Technical Context
This MOSFET employs Infineon's OptiMOSTM 6 trench-gate process to achieve ultra-low on-resistance while maintaining robust switching performance. Its 0.7 mΩ RDS(on) and 94 nC total gate charge (0–10 V) enable high-efficiency operation in 48 V input server VRMs and 12 V/48 V hybrid automotive DC/DC converters.
The device integrates a fast-recovery body diode with trr = 36–72 ns and Qrr = 133–266 nC, supporting zero-voltage switching (ZVS) topologies. Its 175 °C rated junction temperature and JEDEC-qualified industrial reliability make it suitable for thermally constrained, high-power-density applications requiring sustained 200+ A output currents.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum blocking voltage compatible with 36 V nominal bus systems and 48 V automotive architectures. |
| RDS(on), max | 0.7 mΩ at VGS = 10 V - Enables <1.5 W conduction loss at 150 A, critical for >95% efficiency in high-current buck converters. |
| ID, cont | 381 A at TC = 25 °C - Supports single-device implementation in 3 kW+ power stages without paralleling. |
| QG(0–4.5 V) | 45 nC - Optimized gate drive energy for 300–1000 kHz synchronous FET operation with minimal driver loss. |
| RthJC | 0.8 °C/W (bottom side) - Allows direct thermal interface to heatsink or PCB copper, enabling <10 °C junction rise at 200 W dissipation. |
| EAS | 674 mJ - Confirmed single-pulse avalanche capability supports robustness against inductive switching transients in motor drives. |
| VGS(th) | 1.3–2.3 V - Ensures reliable turn-on with standard 3.3 V or 5 V logic-level controllers in digital power ICs. |
Pinout & Package
Package: PG-TDSON-8 (exposed drain pad, 5 mm × 6 mm footprint), RoHS-compliant, halogen-free, with bottom-side thermal pad for enhanced heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–3, Source | Source connection (low-side reference) | Three parallel pins reduce source inductance and improve current sharing in high-di/dt switching. |
| 4, Gate | Gate control terminal | Single-pin gate input minimizes loop inductance; requires <1.6 Ω external gate resistor for optimal 8 ns td(on). |
| 5–8, Drain | Drain connection (power output node) | Four parallel pins + exposed bottom pad provide ultra-low impedance path for 381 A continuous current and efficient thermal conduction. |
Key Features
| Feature | Design Value |
|---|---|
| Optimized for synchronous rectification | Low QG(0–4.5 V) = 45 nC and fast tr/tf (6 ns/13 ns) minimize dead-time losses in high-frequency buck converters. |
| 100% avalanche tested | Guaranteed EAS = 674 mJ ensures field reliability in uncontrolled inductive load switching without external snubbers. |
| Superior thermal resistance | RthJC = 0.8 °C/W (bottom) enables >200 W power handling with simple heatsink attachment-no thermal vias required. |
| N-channel enhancement mode | VGS(th) = 1.3–2.3 V allows direct drive from microcontroller GPIO or dedicated gate drivers without level-shifting. |
| 175 °C rated junction | Supports operation in under-hood automotive environments and sealed industrial enclosures without derating below 150 °C ambient. |
Applications
| Server VRM Power Stage | Automotive 48 V DC/DC Converter |
|---|---|
Use Scenario: High-current, high-efficiency buck converter supplying core voltage to AI accelerators in data center servers. IC Role / Device Role / Timing Role: Synchronous FET in 300–600 kHz multiphase buck stage, operating with 4.5 V gate drive from digital controller. Use Value: 0.7 mΩ RDS(on) reduces conduction loss by >40% vs. legacy 1.2 mΩ devices, enabling >96% peak efficiency at 200 A output. |
Use Scenario: Bidirectional 48 V/12 V DC/DC converter in mild-hybrid electric vehicles (MHEV) for regenerative braking energy recovery. IC Role / Device Role / Timing Role: Low-side synchronous switch in dual-active-bridge topology, switching at 200–400 kHz with ZVS. Use Value: Fast body diode (trr = 36 ns) and low Qgd = 11.2 nC support soft-switching, reducing EMI and improving system-level efficiency by 2.1%. |
| Industrial Motor Drive Inverter | High-Power USB PD 3.1 EPR GaN Companion |
Use Scenario: 3 kW servo drive inverter stage powering PMSM motors in CNC machinery with forced-air cooling. IC Role / Device Role / Timing Role: Low-side switch in three-phase IGBT/MOSFET half-bridge, conducting up to 319 A at TC = 100 °C. Use Value: JEDEC-qualified industrial reliability and 175 °C rating ensure uninterrupted operation during extended thermal stress cycles. |
Use Scenario: Synchronous rectifier in 28 V/5 A USB PD 3.1 Extended Power Range (EPR) adapter using GaN HEMT primary-side switching. IC Role / Device Role / Timing Role: Secondary-side FET operating at 500 kHz with 3.3 V logic-level gate drive from isolated controller. Use Value: VGS(th) = 1.3–2.3 V and QG(0–4.5 V) = 45 nC allow full enhancement and fast switching without bootstrap complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 40 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL40B215TRPBF | RDS(on) = 0.95 mΩ (max), QG(0–4.5 V) = 52 nC, RthJC = 1.1 °C/W | Higher conduction and switching loss; less suitable for >400 kHz operation | Preferred where cost sensitivity outweighs 5–7% efficiency penalty in lower-frequency industrial SMPS. |
| STL220N4F7AG | RDS(on) = 0.65 mΩ (typ), QG(0–4.5 V) = 48 nC, RthJC = 0.95 °C/W, 150 °C rated | Slightly lower RDS(on) but reduced thermal margin and junction temperature rating | Valid for space-constrained consumer power supplies where 150 °C max junction suffices and JEDEC qualification is not mandatory. |
Compared with IRL40B215TRPBF and STL220N4F7AG, BSC007N04LS6ATMA1 offers the lowest thermal resistance (0.8 °C/W), highest junction temperature rating (175 °C), and tightest RDS(on) specification-making it the preferred choice for mission-critical, high-power-density automotive and server applications demanding long-term reliability under thermal stress.
Availability
BSC007N04LS6ATMA1 is available at Aetrix Electronics and suitable for server VRMs, automotive 48 V DC/DC converters, and industrial motor drive inverters requiring stable component supply across multi-year production programs.
Supply support for BSC007N04LS6ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
BSC007N04LS6ATMA1 belongs to the OptiMOSTM 6 family-designed specifically for high-current, high-frequency synchronous rectification in next-generation power conversion systems where ultra-low RDS(on) and robust thermal performance are non-negotiable.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The BSC007N04LS6ATMA1 supports 269 A continuous drain current at TC = 100 °C with VGS = 10 V, as specified in Table 2 of the Rev. 2.3 datasheet. This value accounts for thermal de-rating and assumes proper PCB copper area (6 cm²) and vertical mounting in still air.
Does this MOSFET require a gate resistor for safe operation?
Yes-a gate resistor is required to control dV/dt and prevent oscillation. The datasheet recommends RG,ext = 1.6 Ω for characterization (e.g., td(on) = 8 ns). Actual value depends on driver strength and layout; typical range is 1–5 Ω for 300–600 kHz operation with 3.3 V or 5 V gate drivers.
Can the body diode be used for reverse current conduction in bidirectional topologies?
Yes-the integrated body diode is characterized with trr = 36–72 ns and Qrr = 133–266 nC at Tj = 25 °C. It supports controlled reverse conduction in dual-active-bridge and LLC resonant converters, but forward voltage (VSD = 0.78–1.0 V) must be included in loss calculations.
Is the PG-TDSON-8 package compatible with standard reflow profiles?
Yes-the PG-TDSON-8 package is qualified for lead-free reflow per J-STD-020D, with peak temperature ≤ 260 °C and time above liquidus ≤ 60 seconds. The exposed drain pad requires full-solder coverage to achieve specified RthJC; stencil design should use 80–90% area ratio for optimal thermal joint formation.
BSC007N04LS6ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 381A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 0.7mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 94 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 8400 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 188W
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TDSON-8-6
BSC007N04LS6ATMA1 FAQ
1.How can I place an order for BSC007N04LS6ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSC007N04LS6ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSC007N04LS6ATMA1 reliable?
The price and inventory of BSC007N04LS6ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC007N04LS6ATMA1 is usually 5 days.
3.What payment methods are accepted for BSC007N04LS6ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC007N04LS6ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSC007N04LS6ATMA1?
BSC007N04LS6ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSC007N04LS6ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSC007N04LS6ATMA1?
For technical support, including BSC007N04LS6ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC007N04LS6ATMA1 requirements.
6.How does Aetrix verify that BSC007N04LS6ATMA1 is sourced from the original manufacturer or authorized distributors?
All BSC007N04LS6ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC007N04LS6ATMA1 meets industry standards.
7.What is the process for return or replacement of BSC007N04LS6ATMA1?
All BSC007N04LS6ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSC007N04LS6ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSC007N04LS6ATMA1 part is unused and in its original packaging.
Return procedure for BSC007N04LS6ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSC007N04LS6ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
