Infineon Technologies BSC022N03S
- Part No.:
- BSC022N03S
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
BSC022N03S.pdf
- Description:
- MOSFET N-CH 30V 28A/100A TDSON
- Quantity:
- Payment:

- Shipping:

Inventory:2,035
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Product details
Overview
BSC022N03S from Infineon Technologies is an N-channel logic-level OptiMOS®2 power MOSFET in P-TDSON-8 package, rated for 30 V VDS, 2.2 mΩ RDS(on) at 10 VGS, and 50 A continuous drain current at TC = 25 °C. It delivers fast switching, low gate charge × RDS(on) figure-of-merit (FOM), and avalanche-rated ruggedness for high-efficiency DC/DC converters in notebook PCs.
For engineers reviewing the BSC022N03S datasheet, BSC022N03S pinout, BSC022N03S application, or BSC022N03S equivalent, key selection criteria include its 2.2 mΩ on-resistance at 10 VGS, 43–58 nC total gate charge, JEDEC1 qualification, dv/dt rating of 6 kV/µs, and thermal resistance RthJC of 1.2 K/W - all critical for synchronous buck converter high-side or low-side FET design.
Technical Context
This MOSFET employs trench-based silicon technology optimized for high-frequency switching in 30 V-class point-of-load regulators. Its logic-level gate threshold (1.2–2.0 V) enables direct drive from 3.3 V or 5 V controllers, while low Ciss (5.6–7.5 nF) and Crss (0.25–0.38 nF) minimize Miller-induced turn-off delay and improve EMI behavior.
The device integrates a robust body diode with Qrr ≤ 20 nC and VSD ≤ 1.0 V at 50 A, supporting efficient synchronous rectification and hard-switched freewheeling. Its 800 mJ single-pulse avalanche energy and 6 cm² PCB cooling layout support reliable operation under transient overvoltage and short-circuit conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | 30 V - Supports input rails up to 24 V nominal with margin for transients in notebook and server VRMs. |
| RDS(on) max @ 10 VGS | 2.2 mΩ - Enables <1 W conduction loss at 50 A, critical for thermally constrained mobile DC/DC stages. |
| Qg total | 43–58 nC - Determines gate driver power and switching loss; low value reduces driver stress in 300–1000 kHz designs. |
| ID continuous @ TC=25°C | 50 A - Specifies maximum steady-state current with case heatsinking; derates to 28 A at TA=25°C with 45 K/W ambient thermal resistance. |
| RthJC | 1.2 K/W - Enables precise junction temperature estimation using measured case temperature; supports thermal-aware protection schemes. |
| EAS single pulse | 800 mJ - Quantifies energy-handling capability during inductive switching events without failure; validates robustness in non-zero-voltage turn-off. |
| dv/dt rating | 6 kV/µs - Ensures immunity to false turn-on during high-slew-rate voltage transitions in half-bridge configurations. |
Pinout & Package
P-TDSON-8 (Power-Transistor Dual Small Outline No-lead, 8-pin) is a surface-mount, thermally enhanced leadless package with exposed drain pad (pins 1–3, 5–7 = source; pin 4 = gate; pin 8 = drain). The bottom-side thermal pad must be soldered to ≥6 cm² copper area for rated power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 6, 7 | Source | Common return path for channel current; electrically tied internally; requires low-inductance connection to ground plane. |
| 4 | Gate | Control terminal; driven by PWM controller; sensitive to ringing due to low VGS(th) (1.6 V typ); needs local RC snubber if dv/dt > 3 kV/µs. |
| 8 | Drain | Main power output node; connected to PCB thermal pad; carries full load current and switching transients; must avoid parasitic inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V - eliminates need for gate boosters in 3.3 V/5 V controller systems. |
| Low gate charge × RDS(on) FOM | ~100 Ω·nC - balances conduction and switching losses for optimal efficiency at 500 kHz–1 MHz switching frequencies. |
| Avalanche-rated | 800 mJ single-pulse EAS - allows safe operation during inductive load dump or shoot-through fault conditions without external clamping. |
| JEDEC1 qualified | Complies with JESD22-A108 reliability standards - validated for 1000+ hours at 125 °C operating life in notebook DC/DC applications. |
Applications
| High-Efficiency Notebook DC/DC Converters | Synchronous Buck Regulators for Servers |
|---|---|
Use Scenario: Primary high-side switch in 12 V → 1.2 V, 50 A VRM powering CPU cores. IC Role / Device Role / Timing Role: High-side power FET in synchronous buck topology; switches at 600 kHz with 3.3 V gate drive from integrated controller. Use Value: 2.2 mΩ RDS(on) reduces conduction loss to <0.8 W; low Qg minimizes gate drive loss and improves light-load efficiency. | Use Scenario: Low-side synchronous rectifier in 48 V → 12 V intermediate bus converter. IC Role / Device Role / Timing Role: Low-side FET conducting during freewheeling phase; body diode recovery managed via controlled Qrr ≤ 20 nC. Use Value: VSD ≤ 0.81 V at 50 A lowers forward drop vs. Schottky alternatives; 1.2 K/W RthJC enables compact thermal design with minimal heatsink. |
| Industrial 24 V Input POL Modules | Automotive ADAS Power Supplies |
Use Scenario: Output stage FET in isolated 24 V → 3.3 V flyback-derived regulator for PLC I/O modules. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier; driven by self-driven or controller-synchronized gate signal. Use Value: Avalanche rating ensures survival during transformer leakage inductance spikes; -55 °C to 150 °C Tj range supports extended industrial temperature operation. | Use Scenario: Core power switch in 12 V → 5 V/3.3 V buck converter supplying radar sensor SoC. IC Role / Device Role / Timing Role: Main switching FET; subjected to automotive load-dump transients and cold-crank conditions. Use Value: dv/dt rating of 6 kV/µs prevents spurious turn-on during cranking pulses; JEDEC1 qualification confirms reliability under automotive thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLHS6342TRPBF | RDS(on) = 2.9 mΩ @ 4.5 VGS; Qg = 32 nC; SO-8 package; no avalanche rating. | Limited to lower-current (<35 A) or lower-reliability consumer applications due to missing EAS spec. | Prefer when gate drive is strictly 4.5 V and avalanche immunity is not required; lower Qg reduces driver complexity. |
| DMT6009LPS-13 | RDS(on) = 2.3 mΩ @ 4.5 VGS; Qg = 45 nC; PowerDI3333 package; RthJC = 1.5 K/W. | Higher thermal resistance limits power density in space-constrained layouts; same voltage class but less robust thermal path. | Choose where board space favors smaller footprint and thermal management uses forced air; verify PCB copper area meets 6 cm² requirement. |
Compared with IRLHS6342TRPBF and DMT6009LPS-13, BSC022N03S offers superior avalanche ruggedness (800 mJ), lower RthJC (1.2 K/W), and tighter RDS(on) tolerance (1.8–2.2 mΩ), making it preferred for thermally demanding, high-reliability notebook and server VRMs where transient immunity and thermal predictability are critical.
Availability
BSC022N03S is available at Aetrix Electronics and suitable for notebook DC/DC converters, server VRMs, and industrial POL modules requiring stable component supply, long-term lifecycle support, and JEDEC-qualified reliability.
Supply support for BSC022N03S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
The OptiMOS®2 product line targets high-frequency, high-efficiency power conversion in portable and computing applications, emphasizing low RDS(on), fast switching, and ruggedness in compact packages like P-TDSON-8.
FAQ
Is BSC022N03S suitable for synchronous rectification in a 30 V input buck converter?
Yes. Its low RDS(on) (2.2 mΩ), low VSD (≤0.81 V), and Qrr ≤20 nC enable efficient synchronous rectification at 30 V input. The device's 50 A continuous current rating and 1.2 K/W RthJC support high-current, high-density designs when mounted on ≥6 cm² copper.
What is the maximum recommended gate resistor for driving BSC022N03S at 1 MHz?
For 1 MHz operation, a gate resistor of 1–2.7 Ω is recommended to balance switching speed and gate ringing. With Qg = 43–58 nC and typical gate driver output impedance <1 Ω, this range achieves ~10–15 ns rise/fall times while suppressing oscillation caused by Lg–Ciss resonance.
Does BSC022N03S require a negative gate turn-off voltage to prevent dv/dt-induced turn-on?
No. Its 6 kV/µs dv/dt rating and 1.2–2.0 V gate threshold ensure immunity to false turn-on under typical buck converter edge rates. However, a small gate-to-source capacitor (100–470 pF) is advised in high-noise environments to further suppress Miller coupling.
Can BSC022N03S replace BSC014N03LS in an existing design?
Not directly. While both are 30 V OptiMOS devices, BSC014N03LS has lower RDS(on) (1.4 mΩ) and higher Qg (65 nC). Swapping requires re-evaluating gate drive strength, thermal margin, and switching loss trade-offs; layout changes may be needed due to different thermal pad requirements.
BSC022N03S Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 28A (Ta), 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.2mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 58 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 7490 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.8W (Ta), 104W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TDSON-8-1
BSC022N03S FAQ
1.How can I place an order for BSC022N03S through Aetrix?
Please submit a Request for Quotation (RFQ) for BSC022N03S on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSC022N03S reliable?
The price and inventory of BSC022N03S are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC022N03S is usually 5 days.
3.What payment methods are accepted for BSC022N03S?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC022N03S transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSC022N03S?
BSC022N03S orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSC022N03S order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSC022N03S?
For technical support, including BSC022N03S datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC022N03S requirements.
6.How does Aetrix verify that BSC022N03S is sourced from the original manufacturer or authorized distributors?
All BSC022N03S products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC022N03S meets industry standards.
7.What is the process for return or replacement of BSC022N03S?
All BSC022N03S units undergo pre-shipment inspection (PSI). If there is an issue with BSC022N03S, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSC022N03S part is unused and in its original packaging.
Return procedure for BSC022N03S:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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