Infineon Technologies BSC048N025S G
- Part No.:
- BSC048N025S G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
BSC048N025S G.pdf
- Description:
- MOSFET N-CH 25V 19A/89A TDSON
- Quantity:
- Payment:

- Shipping:

Inventory:6,461
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Product details
Overview
BSC048N025S G from Infineon Technologies is a logic-level N-channel enhancement-mode MOSFET optimized for high-efficiency notebook DC/DC converters and synchronous buck converters, featuring 25 V VDS, 4.8 mΩ RDS(on) at VGS = 10 V, 89 A continuous drain current at TC = 25 °C, and avalanche-rated ruggedness for reliable operation in hard-switching SMPS topologies.
For engineers reviewing the BSC048N025S G datasheet, BSC048N025S G pinout, BSC048N025S G application, or BSC048N025S G equivalent, this device is selected for high-current, low-voltage point-of-load regulation where fast switching, low gate charge (Qg = 16–21 nC), and thermal robustness (RthJC = 2 K/W) are critical to power stage efficiency and board-level thermal management.
Technical Context
This OptiMOS®2 power transistor employs trench-gate superjunction technology to achieve ultra-low RDS(on) × Qg figure-of-merit (FOM), enabling reduced conduction and switching losses in 5–12 V input synchronous buck stages. Its 25 V breakdown voltage and 6 kV/µs dv/dt rating support stable operation under fast transient conditions typical of CPU/GPU VRMs.
The device integrates an optimized body diode with Qrr = 10 nC and VSD = 0.87–1.1 V at IF = 50 A, supporting efficient synchronous rectification and minimizing reverse recovery loss during dead-time transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 25 V - supports 12 V and lower input rails in notebook and portable computing power supplies |
| RDS(on) max | 4.8 mΩ at VGS = 10 V - enables <1 W conduction loss at 45 A, critical for high-current POL stages |
| ID continuous | 89 A at TC = 25 °C - delivers high output current capability with minimal PCB copper area |
| Qg total | 16–21 nC - reduces gate drive power and allows use of low-power drivers in compact VRM designs |
| RthJC | 2 K/W (bottom side) - enables direct thermal coupling to heatsink or copper pour for >60 W power dissipation |
| EAS | 185 mJ - provides single-pulse avalanche energy margin for inductive load transients in buck converters |
| dv/dt rating | 6 kV/µs - ensures immunity to parasitic turn-on in high-speed, high-dI/dt synchronous FET applications |
Pinout & Package
PG-TDSON-8 (Power-Transistor Dual-Side Cooling Outline, 8-pin) package with exposed drain pad on bottom side for optimal thermal performance and dual-side cooling capability. Pin 1–8 arranged in two rows; drain terminals occupy pins 1, 2, 3, 4, 5, 6, and 8; source connected to pin 7 and integrated into the exposed pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–6, 8 | Drain (D) | Parallel drain connections reduce package inductance and improve current sharing in high-frequency switching |
| 7 | Source (S) | Single-source pin tied to internal source metallization; used for gate driver reference and current sensing |
| Exposed Pad | Drain (D) | Primary thermal path and high-current drain node; must be soldered to large PCB copper area for RthJA ≤ 45 K/W |
| Gate (G) | Control terminal | Connected internally to pin 1 via bond wire; gate loop inductance minimized by adjacent source pin placement |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V - compatible with 5 V and 3.3 V controller outputs without level-shifting |
| Ultra-low RDS(on) × Qg FOM | ~30 Ω·nC - balances switching speed and conduction loss for peak efficiency at 500 kHz–1 MHz switching frequencies |
| Avalanche-rated | 185 mJ single-pulse EAS - eliminates need for external snubbers in non-isolated buck converters subjected to load dumps or startup surges |
| Optimized body diode | Qrr = 10 nC, VSD = 0.87 V - reduces reverse recovery loss and EMI in synchronous rectification mode |
| Pb-free & RoHS compliant | Pb-free lead plating per JEDEC J-STD-20 - meets global environmental compliance requirements for consumer electronics manufacturing |
Applications
| High-Efficiency Notebook VRM | Server Point-of-Load Converter |
|---|---|
Use Scenario: 12 V input to 1.0–1.8 V output conversion for CPU core supply in ultrabook platforms. IC Role / Device Role / Timing Role: Synchronous high-side FET in multiphase buck converter, switching at 600–800 kHz with precise gate timing control. Use Value: 4.8 mΩ RDS(on) and 21 nC Qg enable >92% efficiency at 45 A load while maintaining junction temperature below 105 °C. | Use Scenario: 48 V to 12 V intermediate bus conversion feeding downstream 3.3 V/5 V POL modules in edge server racks. IC Role / Device Role / Timing Role: Primary switch in active-clamp forward or LLC-synchronized rectifier stage operating up to 300 kHz. Use Value: 6 kV/µs dv/dt rating and 185 mJ EAS ensure reliability during rapid load transients and hot-plug events. |
| USB-C PD Fast Charging | Industrial PLC Power Module |
Use Scenario: 20 V input to 5–20 V programmable output in bidirectional USB-C PD 3.1 sink/source designs. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in buck-boost topology, driven with adaptive dead-time control. Use Value: 0.87 V VSD and 10 nC Qrr minimize conduction loss and reverse recovery spikes during 100–300 kHz variable-frequency operation. | Use Scenario: 24 V DC input to isolated 5 V/3.3 V auxiliary supply in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Main switch in flyback or forward converter primary side, operating at fixed 100 kHz with overtemperature protection. Use Value: -55 to 150 °C Tj range and JEDEC qualification support extended industrial temperature operation with no derating up to 100 °C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLHS6242PBF | RDS(on) = 5.2 mΩ @ 4.5 V; Qg = 22 nC; SO-8 package with higher RthJA (62 K/W) | Limited to lower-current (<35 A) applications due to thermal resistance and smaller footprint | Preferred for space-constrained, medium-current designs where dual-side cooling is unavailable |
| DMT6009LPS-13 | RDS(on) = 4.5 mΩ @ 4.5 V; Qg = 26 nC; 3.3 × 3.3 mm WDFN with no exposed drain pad | Lower thermal performance (RthJC ≈ 4.5 K/W); unsuitable for >50 A continuous operation | Selected when PCB real estate is critical and peak current remains below 40 A |
Compared with IRLHS6242PBF and DMT6009LPS-13, BSC048N025S G delivers superior thermal handling (2 K/W RthJC) and higher current capability (89 A), making it the preferred choice for high-density, high-reliability notebook and server VRMs where thermal margin and avalanche robustness are design-critical.
Availability
BSC048N025S G is available at Aetrix Electronics and suitable for high-current DC/DC converters, notebook voltage regulator modules, and industrial power supplies requiring stable component supply across multi-year production cycles.
Supply support for BSC048N025S G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial sensors, with leadership in silicon and wide-bandgap power devices.
BSC048N025S G belongs to the OptiMOS®2 family, engineered specifically for high-frequency, high-efficiency synchronous rectification in low-voltage DC/DC conversion systems targeting portable computing and communications infrastructure.
FAQ
What is the maximum recommended gate-source voltage for BSC048N025S G?
The absolute maximum VGS is ±20 V, but the device is characterized and optimized for operation between 0 V and 10 V. Gate drive circuits should limit VGS to ≤12 V to avoid accelerated gate oxide degradation while maintaining full enhancement. Transient overshoot beyond 15 V must be suppressed using clamping diodes or RC snubbers.
Can BSC048N025S G be used as a synchronous rectifier in a 5 V output buck converter?
Yes - its logic-level threshold (VGS(th) = 1.2–2.0 V), low RDS(on) (4.8 mΩ), and fast switching (tr = 5–8 ns) make it ideal for low-voltage synchronous rectification. At 5 V output and 30 A load, conduction loss is ~4.3 W, and thermal design must accommodate RthJC = 2 K/W via direct pad soldering to ≥6 cm² copper.
Does BSC048N025S G require a gate resistor for stability in high-frequency operation?
A gate resistor (typically 2.2–4.7 Ω) is recommended to dampen ringing caused by gate loop inductance and Miller capacitance interaction. With Qgd = 4–7 nC and Ciss = 2010–2670 pF, uncontrolled gate drive can cause oscillation above 500 kHz; empirical testing shows 2.7 Ω yields optimal trade-off between switching speed and EMI suppression.
How does the PG-TDSON-8 package improve thermal performance compared to standard SO-8?
PG-TDSON-8 features an exposed drain pad on the bottom surface that serves as both high-current path and primary thermal interface, achieving RthJC = 2 K/W - over 10× better than SO-8's ~25 K/W. This allows direct mounting to heatsinks or thick copper pours, enabling >60 W power dissipation without forced air, unlike SO-8 which is limited to ~2.8 W in still air.
BSC048N025S G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 19A (Ta), 89A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.8mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 35µA
- Gate Charge (Qg) (Max) @ Vgs:
- 21 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2670 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.8W (Ta), 63W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TDSON-8-1
BSC048N025S G FAQ
1.How can I place an order for BSC048N025S G through Aetrix?
Please submit a Request for Quotation (RFQ) for BSC048N025S G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of BSC048N025S G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC048N025S G is usually 5 days.
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6.How does Aetrix verify that BSC048N025S G is sourced from the original manufacturer or authorized distributors?
All BSC048N025S G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC048N025S G meets industry standards.
7.What is the process for return or replacement of BSC048N025S G?
All BSC048N025S G units undergo pre-shipment inspection (PSI). If there is an issue with BSC048N025S G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSC048N025S G part is unused and in its original packaging.
Return procedure for BSC048N025S G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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