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Infineon Technologies BSC072N025S G

Part No.:
BSC072N025S G
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixBSC072N025S G.pdf
Description:
MOSFET N-CH 25V 15A/40A TDSON
Quantity:
Payment:
Payment
Shipping:
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Inventory:6,776

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Product details

Overview

BSC072N025S G from Infineon Technologies is a logic-level N-channel enhancement-mode MOSFET optimized for high-efficiency DC/DC converters in notebook power supplies, featuring 25 V VDS, 7.2 mΩ RDS(on) at VGS = 10 V and 40 A continuous drain current at TC = 100 °C. It delivers low gate charge × RDS(on) figure-of-merit (FOM), avalanche rating, and JEDEC JESD22 qualification for reliability-critical SMPS applications.

For engineers reviewing the BSC072N025S G datasheet, BSC072N025S G pinout, BSC072N025S G application, or BSC072N025S G equivalent, key selection criteria include its 2.1 K/W junction-to-case thermal resistance, 6.0–7.2 mΩ on-resistance at 10 V drive, 13–18 nC total gate charge, and PG-TDSON-8 package compatibility with high-density PCB layouts in synchronous buck topologies.

Technical Context

This OptiMOS™2 device uses trench-gate superjunction technology to achieve ultra-low RDS(on) while maintaining fast switching performance: tr = 4.8–7.2 ns, tf = 3.8–5.7 ns, and Ciss = 1680–2230 pF at VDS = 15 V. Its gate threshold voltage (1.2–2.0 V) enables direct drive from 3.3 V or 5 V controllers without level-shifting.

The MOSFET supports synchronous rectification with Qg(sync) = 12–16 nC under 0–5 V gate swing and exhibits robust dv/dt immunity (6 kV/µs) and unclamped inductive switching capability (EAS = 160 mJ at ID = 40 A), making it suitable for hard-switched and resonant converter stages.

Key Specifications

ParameterValue and Actual Design Meaning
VDS25 V - Maximum blocking voltage for 12 V input rail systems with margin
RDS(on) max7.2 mΩ at VGS = 10 V, ID = 40 A - Enables <1 W conduction loss at 40 A
ID continuous40 A at TC = 100 °C - Sustains full load in thermally constrained notebook VRMs
Qg total13–18 nC - Low gate drive power requirement for 500 kHz–1 MHz operation
RthJC2.1 K/W (bottom side) - Enables efficient heat transfer to heatsink or copper plane
EAS160 mJ - Withstands single-pulse inductive energy in synchronous buck freewheeling
dv/dt rating6 kV/µs - Resists false turn-on in high di/dt node environments

Pinout & Package

Package: PG-TDSON-8 (exposed drain pad, 5 mm × 6 mm footprint, 0.95 mm height), RoHS-compliant, halogen-free per IEC61249-2-21.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 6, 7, 8 (Drain)Power Drain (common source connection)All pins 1–8 are internally connected to the exposed drain pad - provides low-inductance, high-current path and thermal conduction to PCB
G (Gate)Control terminalPin 1 of standard TDSON-8 layout (per Infineon outline P-TDSON-8 Rev. 1.4) - requires <20 V drive, compatible with 3.3 V logic
S (Source)Reference node for gate drive and current sensingPin 8 - forms Kelvin source connection when used with dedicated sense FET layout; defines local ground reference for driver IC

Key Features

FeatureDesign Value
Logic-level gate driveVGS(th) = 1.2–2.0 V - eliminates need for gate driver boost stage in 3.3 V/5 V controller designs
Low RDS(on) × Qg FOM~50 Ω·nC - balances conduction and switching losses for >95% efficiency in 500 kHz buck converters
Avalanche-ratedEAS = 160 mJ - ensures ruggedness during transient overloads without external snubbers
Superior thermal resistanceRthJC = 2.1 K/W - allows >40 W power dissipation with minimal case temperature rise under forced cooling
Reverse diode performanceVSD = 0.93–1.1 V at 40 A - reduces body-diode conduction loss during dead-time in synchronous rectification

Applications

High-Efficiency Notebook VRMSynchronous Buck Converter

Use Scenario: Point-of-load regulation for CPU/GPU core voltage in ultrathin notebooks with strict thermal envelope.

IC Role / Device Role / Timing Role: High-side synchronous FET in 2-phase interleaved buck converter operating at 1 MHz.

Use Value: 7.2 mΩ RDS(on) and 13–18 nC Qg enable >94% efficiency at 25 A load while limiting junction temperature rise to <40 K above ambient.

Use Scenario: Main power switch in industrial 24 V input DC/DC module delivering 5 V/30 A output.

IC Role / Device Role / Timing Role: Primary switching element in hard-switched buck topology with integrated controller.

Use Value: 6 kV/µs dv/dt rating prevents spurious turn-on during fast voltage transitions; avalanche rating eliminates need for external clamping diodes.

USB-C PD Power DeliveryServer VR13 Voltage Regulator

Use Scenario: Secondary-side synchronous rectifier in 100 W USB-C PD adapter with GaN primary.

IC Role / Device Role / Timing Role: Low-side FET in active clamp forward or LLC secondary synchronous rectification stage.

Use Value: Qg(sync) = 12–16 nC at 0–5 V gate swing minimizes drive loss; 0.93 V VSD reduces reverse conduction loss during dead time.

Use Scenario: High-current phase FET in multi-phase server VRM supporting DDR5 memory power rails.

IC Role / Device Role / Timing Role: 40 A-rated power stage FET in 3+1 phase configuration with digital PWM controller.

Use Value: JEDEC JESD22 qualification and 150 °C Tj,max ensure long-term reliability under sustained 100% load at elevated ambient temperatures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRLHS6242PBFRDS(on) = 6.3 mΩ @ 4.5 V, Qg = 15.5 nC, SO-8 packageHigher RDS(on) at 10 V (6.3 vs. 7.2 mΩ), but lower gate drive voltage sensitivityPreferred where 4.5 V gate drive dominates and thermal budget allows slightly higher conduction loss
SI7157DP-T1-GE3RDS(on) = 7.5 mΩ @ 10 V, Qg = 14.5 nC, PowerPAK® SO-8Similar RDS(on) and Qg, but higher RthJA (50 K/W vs. 45 K/W) and no avalanche ratingAcceptable for non-avalanche-critical consumer applications with adequate board-level thermal design

Compared with IRLHS6242PBF and SI7157DP-T1-GE3, BSC072N025S G offers superior avalanche ruggedness (160 mJ), lower RthJC (2.1 K/W), and JEDEC qualification-making it preferred for mission-critical notebook and server VRMs where reliability and thermal headroom are prioritized over marginal RDS(on) reduction.

Availability

BSC072N025S G is available at Aetrix Electronics and suitable for high-efficiency notebook VRMs, USB-C PD adapters, and server voltage regulators requiring stable component supply and long-lifecycle support.

Supply support for BSC072N025S G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

BSC072N025S G belongs to the OptiMOS™2 power transistor family, designed specifically for high-frequency, high-efficiency DC/DC conversion in space-constrained portable and computing applications where low RDS(on), fast switching, and thermal performance are critical.

FAQ

What is the maximum continuous drain current for BSC072N025S G at 100 °C case temperature?

The maximum continuous drain current is 40 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This rating assumes proper PCB copper area (6 cm²) and vertical mounting in still air, with RthJA = 45 K/W. Derating applies beyond this temperature per the ID vs. TC curve on page 4 of the datasheet.

Does BSC072N025S G support 3.3 V gate drive in practical applications?

Yes - its gate threshold voltage range is 1.2–2.0 V, and RDS(on) is characterized down to VGS = 4.5 V (8.7–10.9 mΩ). At 3.3 V, it achieves partial enhancement suitable for low-duty-cycle or low-current operation, but full 40 A conduction requires ≥4.5 V drive per datasheet test conditions.

How is the PG-TDSON-8 package thermally optimized compared to standard SO-8?

The PG-TDSON-8 features an exposed drain pad on the bottom surface, enabling direct thermal coupling to the PCB's inner copper layers or external heatsink. Its RthJC is 2.1 K/W (bottom), versus ~5–6 K/W for standard SO-8, reducing junction-to-board thermal resistance by >70% and allowing higher power density in compact layouts.

Is BSC072N025S G suitable for synchronous rectification in LLC resonant converters?

Yes - its low Qg(sync) (12–16 nC), fast tf (3.8–5.7 ns), and low VSD (0.93–1.1 V) make it well-suited for low-loss synchronous rectification in LLC secondaries. The 6 kV/µs dv/dt rating also prevents false triggering during high-slew-rate resonant node transitions.

BSC072N025S G Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
8-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
25 V
Current - Continuous Drain (Id) @ 25°C:
15A (Ta), 40A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
7.2mOhm @ 40A, 10V
Vgs(th) (Max) @ Id:
2V @ 30µA
Gate Charge (Qg) (Max) @ Vgs:
18 nC @ 5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2230 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.8W (Ta), 60W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TDSON-8-1

BSC072N025S G FAQ

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Please submit a Request for Quotation (RFQ) for BSC072N025S G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of BSC072N025S G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC072N025S G is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSC072N025S G?

For technical support, including BSC072N025S G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC072N025S G requirements.

6.How does Aetrix verify that BSC072N025S G is sourced from the original manufacturer or authorized distributors?

All BSC072N025S G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC072N025S G meets industry standards.

7.What is the process for return or replacement of BSC072N025S G?

All BSC072N025S G units undergo pre-shipment inspection (PSI). If there is an issue with BSC072N025S G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSC072N025S G part is unused and in its original packaging.

Return procedure for BSC072N025S G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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