Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSC085N025S G

Name: BSC085N025S G
Brand: Infineon Technologies
SKU: BSC085N025S G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BSC085N025S G

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: 8-PowerTDFN

Datasheet:: BSC085N025S G.pdf

Description:: MOSFET N-CH 25V 14A/35A TDSON

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,691

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BSC085N025S G from Infineon Technologies is a logic-level N-channel enhancement-mode MOSFET optimized for high-efficiency notebook DC/DC converters and synchronous buck regulators, featuring 25 V V_DS, 8.5 mΩ R_DS(on) at V_GS = 10 V and I_D = 35 A, avalanche-rated operation, and PG-TDSON-8 package with bottom-side thermal pad.

For engineers reviewing the BSC085N025S G datasheet, BSC085N025S G pinout, BSC085N025S G application, or BSC085N025S G equivalent, key selection criteria include gate charge (Q_g = 11–14 nC), dv/dt ruggedness (6 kV/µs), thermal resistance (R_thJC = 2.4 K/W), and low R_DS(on) × Q_g figure-of-merit for fast-switching SMPS designs.

Technical Context

This OptiMOS™2 power transistor employs trench-gate superjunction technology to achieve ultra-low on-resistance and fast switching with controlled EMI. Its gate threshold voltage (1.2–2.0 V) enables direct drive from 3.3 V or 5 V controllers without level-shifting.

The device integrates an optimized body diode with low Q_rr (≤10 nC) and V_SD (0.93–1.1 V at 35 A), supporting high-frequency synchronous rectification in buck converters up to 1 MHz. Thermal performance is enhanced by the exposed drain pad in the PG-TDSON-8 package.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	25 V - supports input rails up to 24 V in notebook VRMs and point-of-load converters
R_DS(on) max	8.5 mΩ at V_GS = 10 V, I_D = 35 A - enables <1 W conduction loss at 30 A in compact PCB layouts
Q_g	11–14 nC - balances switching speed and gate driver stress in 300–1000 kHz applications
R_thJC	2.4 K/W - allows >40 W power dissipation with minimal junction-to-case temperature rise under heatsink cooling
E_AS	120 mJ - withstands single-pulse inductive energy during hard-switching or fault events
dv/dt rating	6 kV/µs - ensures reliable operation in high-slew-rate synchronous buck topologies without spurious turn-on
Q_rr	≤10 nC - reduces reverse recovery losses and EMI in high-frequency synchronous rectification

Pinout & Package

PG-TDSON-8 (Power-Transistor Dual-Side Cooling Outline) is a surface-mount, thermally enhanced 8-pin package with exposed drain pad on the bottom side for low-inductance, high-current routing and efficient heat transfer to PCB copper.

Pin/Terminal	Circuit Role	Design Meaning
1–3, 5–7	Drain (D)	Internally connected to exposed bottom pad; carries full load current and serves as primary thermal path
4	Gate (G)	Control terminal; requires low-impedance gate driver due to 1.2 Ω R_G and 14 nC Q_g
8	Source (S)	Reference node for gate drive and current sensing; tied to power ground plane

Key Features

Feature	Design Value
Logic-level gate drive	Operates fully enhanced at V_GS ≥ 4.5 V - compatible with standard 3.3 V/5 V PWM controllers without gate boosters
Low R_DS(on) × Q_g FOM	~90 mΩ·nC - minimizes combined conduction and switching losses in high-frequency SMPS
Avalanche-rated	120 mJ single-pulse E_AS - eliminates need for external snubbers in non-isolated DC/DC converters
Enhanced dv/dt immunity	6 kV/µs rated - prevents false turn-on during fast voltage transients in high-side synchronous FET applications

Applications

High-Efficiency Notebook VRM

Synchronous Buck Converter

Use Scenario: Core voltage regulation for Intel Core i-series CPUs in ultrabooks, operating at 0.8–1.5 V output and 30–60 A load current.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier FET in dual-phase buck converter with 500 kHz–1 MHz switching frequency.

Use Value: 8.5 mΩ R_DS(on) and 10 nC Q_rr reduce conduction and recovery losses, enabling >95% efficiency at 35 A.

Use Scenario: Point-of-load (POL) regulator supplying GPU memory or SoC I/O rails in portable computing platforms.

IC Role / Device Role / Timing Role: High-current, low-voltage power switch with fast turn-on/turn-off (t_r/t_f ≤ 6 ns) for tight duty-cycle control.

Use Value: 2.4 K/W R_thJC and bottom-side thermal pad enable stable operation at T_j ≤ 125 °C under 40 W dissipation.

Server DDR5 Memory Regulator

Industrial 24 V Input Buck Module

Use Scenario: 1.1 V/40 A DDR5 VDDQ regulator requiring high reliability and low noise in data center blade servers.

IC Role / Device Role / Timing Role: Synchronous rectifier in multiphase buck topology with interleaved gate drive to minimize input ripple.

Use Value: Avalanche rating and 6 kV/µs dv/dt immunity ensure robustness against transient overvoltage during hot-plug events.

Use Scenario: Compact 24 V-to-5 V/12 V industrial power module for PLC I/O modules and sensor interfaces.

IC Role / Device Role / Timing Role: Primary power switch in fixed-frequency (300 kHz) buck converter with wide ambient temperature range (-40 to +105 °C).

Use Value: -55 to +150 °C T_j rating and JEDEC J-STD-20 qualification support extended thermal cycling life in unventilated enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRLHS6342TRPBF	R_DS(on) = 9.5 mΩ @ 4.5 V; Q_g = 12.5 nC; SO-8 package (no exposed pad)	Higher R_thJA (62 K/W vs. 45 K/W) limits power handling in space-constrained designs	Preferable where board-level thermal management is limited and lower gate charge is prioritized over thermal performance
DMTH3010LPS-13	R_DS(on) = 8.0 mΩ @ 4.5 V; Q_g = 15.5 nC; PowerDI^5060-8 package with top-side thermal pad	Higher Q_g increases gate drive loss; different pinout requires layout revision	Preferred when lowest possible R_DS(on) at 4.5 V is critical and top-side cooling is available

Compared with IRLHS6342TRPBF and DMTH3010LPS-13, BSC085N025S G delivers optimal balance of low R_DS(on), moderate Q_g, and superior bottom-side thermal dissipation-making it ideal for thermally dense notebook VRMs where PCB copper area is allocated beneath the FET.

Availability

BSC085N025S G is available at Aetrix Electronics and suitable for notebook VRMs, synchronous buck converters, DDR5 memory regulators, and industrial 24 V input power modules requiring stable component supply and long-term manufacturability.

Supply support for BSC085N025S G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The OptiMOS™2 product line targets high-frequency, high-efficiency DC/DC conversion in portable and server computing, emphasizing low R_DS(on) × Q_g FOM, avalanche ruggedness, and JEDEC-qualified reliability for mission-critical power stages.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The BSC085N025S G supports 35 A continuous drain current at T_C = 100 °C, as specified in the Absolute Maximum Ratings table. This reflects its robust thermal design and low R_DS(on), enabling sustained high-current operation without derating in well-cooled notebook VRM layouts.

Is this MOSFET suitable for synchronous rectification in a 1 MHz buck converter?

Yes. With t_r ≤ 6 ns, t_f ≤ 5 ns, Q_rr ≤ 10 nC, and low C_oss (518–689 pF), the BSC085N025S G is explicitly optimized for synchronous rectification in high-frequency buck converters up to 1 MHz, as confirmed in Infineon's OptiMOS™2 application notes for notebook DC/DC.

Does the PG-TDSON-8 package require solder paste stencil optimization for the exposed drain pad?

Yes. The exposed drain pad must be soldered with ≥70% coverage using a 0.15 mm thick stencil and 50% open area pattern to ensure mechanical reliability and thermal performance. IPC-7351B land pattern and reflow profile per J-STD-020 are recommended for void minimization and R_thJC consistency.

How does the avalanche rating impact system-level protection design?

The 120 mJ single-pulse E_AS rating allows the BSC085N025S G to absorb inductive energy during short-circuit or startup faults without failure, reducing or eliminating the need for external clamping circuits in non-isolated buck converters-verified per JEDEC JESD22-A112 test conditions.

BSC085N025S G Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: 8-PowerTDFN

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 25 V

Current - Continuous Drain (Id) @ 25°C:: 14A (Ta), 35A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 8.5mOhm @ 35A, 10V

Vgs(th) (Max) @ Id:: 2V @ 25µA

Gate Charge (Qg) (Max) @ Vgs:: 14 nC @ 5 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 1800 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 2.8W (Ta), 52W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-TDSON-8-1

BSC085N025S G FAQ

1.How can I place an order for BSC085N025S G through Aetrix?

Please submit a Request for Quotation (RFQ) for BSC085N025S G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSC085N025S G reliable?

The price and inventory of BSC085N025S G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC085N025S G is usually 5 days.

3.What payment methods are accepted for BSC085N025S G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC085N025S G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSC085N025S G?

BSC085N025S G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSC085N025S G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSC085N025S G?

For technical support, including BSC085N025S G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC085N025S G requirements.

6.How does Aetrix verify that BSC085N025S G is sourced from the original manufacturer or authorized distributors?

All BSC085N025S G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC085N025S G meets industry standards.

7.What is the process for return or replacement of BSC085N025S G?

All BSC085N025S G units undergo pre-shipment inspection (PSI). If there is an issue with BSC085N025S G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSC085N025S G part is unused and in its original packaging.

Return procedure for BSC085N025S G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.