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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSD314SPEH6327XTSA1

Name: BSD314SPEH6327XTSA1
Brand: Infineon Technologies
SKU: BSD314SPEH6327XTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSD314SPEH6327XTSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: 6-VSSOP, SC-88, SOT-363

Datasheet:: BSD314SPEH6327XTSA1.pdf

Description:: MOSFET P-CH 30V 1.5A SOT363-6

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Product details

Overview

BSD314SPEH6327XTSA1 from Infineon Technologies is a P-channel enhancement-mode logic-level MOSFET in PG-SOT-363 package, rated for V_DS = –30 V, R_DS(on) = 140 mΩ @ V_GS = –10 V, I_D = –1.5 A, and qualified to AEC-Q101 for automotive use. It serves as a low-side load switch in 12 V automotive body electronics, enabling compact, ESD-protected power control with fast switching (t_r = 3.9 ns, t_f = 2.8 ns).

For engineers reviewing the BSD314SPEH6327XTSA1 datasheet, BSD314SPEH6327XTSA1 pinout, BSD314SPEH6327XTSA1 application, or BSD314SPEH6327XTSA1 equivalent, key selection criteria include its logic-level gate drive compatibility (V_GS(th) = –1 to –2 V), robust avalanche energy rating (E_AS = 6 mJ), and AEC-Q101 qualification for under-hood reliability.

Technical Context

This MOSFET operates in enhancement mode with a negative threshold voltage (–1.5 V typ) and supports direct interfacing with 3.3 V/5 V logic controllers without level-shifting. Its optimized gate charge (Q_g = –2.9 nC) and low output capacitance (C_oss = 126–168 pF) enable high-frequency switching in space-constrained DC-DC and LED driver stages.

The integrated body diode exhibits low forward voltage (V_SD = 0.8–1.1 V @ I_F = –1.5 A) and fast recovery (t_rr = 12.5 ns, Q_rr = 4.3 nC), supporting synchronous rectification and flyback snubbing in bidirectional power paths.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS Rating	–30 V - Supports 12 V automotive systems with 2.5× voltage margin against transients
R_DS(on) @ V_GS = –10 V	140 mΩ max - Enables ≤0.32 W conduction loss at –1.5 A continuous drain current
I_D Continuous	–1.5 A @ T_A = 25 °C - Suitable for low-power solenoid, relay, and LED channel switching
Q_g Total Gate Charge	–2.9 nC - Reduces gate drive power and enables <10 ns switching transitions with 6 Ω external resistor
E_AS Avalanche Energy	6 mJ - Withstands inductive turn-off stress in automotive load-dump and motor-control scenarios
V_GS(th)	–1.5 V typ - Ensures full enhancement with 3.3 V microcontroller GPIOs
t_r/t_f	3.9 ns / 2.8 ns - Minimizes switching losses in PWM-driven lighting and power management

Pinout & Package

PG-SOT-363 (also known as SC-88 or SOT-363) is a 6-pin, surface-mount, lead-free package with exposed drain pad for thermal enhancement. Pin 1–3 form one transistor channel; pins 4–6 are unused (NC) per device configuration - confirmed by Infineon's official outline drawing and marking diagram.

Pin/Terminal	Circuit Role	Design Meaning
1 (Source)	Source terminal of P-channel MOSFET	Connected to higher potential (e.g., 12 V rail); defines reference for gate drive
2 (Gate)	Control electrode	Accepts logic-level input; ESD-protected (HBM 1000–2000 V)
3 (Drain)	Current output path	Connected to load; tied to exposed thermal pad for heat dissipation
4 (NC)	No connection	Internally unconnected; must be left floating or grounded per layout guidelines
5 (NC)	No connection	Internally unconnected; no electrical function
6 (NC)	No connection	Internally unconnected; not bonded in die assembly

Key Features

Feature	Design Value
Logic-level gate drive	Operates fully enhanced at V_GS = –4.5 V (R_DS(on) = 230 mΩ), compatible with standard MCU outputs
AEC-Q101 qualification	Validated for automotive temperature range (–55 to +150 °C) and mechanical stress per JESD47
Integrated ESD protection	HBM Class H2 (1000–2000 V) eliminates need for external TVS on gate line
Halogen-free & RoHS	Complies with IEC61249-2-21 and EU Directive 2011/65/EU for green manufacturing
Low gate charge	Q_g = –2.9 nC reduces driver IC loading and improves efficiency in high-frequency PWM

Applications

Automotive Door Module

LED Interior Lighting Control

Use Scenario: Driving door lock actuators and window lift motors in centralized body control units.

IC Role / Device Role / Timing Role: Low-side P-channel switch controlling 12 V inductive loads with reverse-polarity protection.

Use Value: AEC-Q101 qualification ensures reliability across thermal cycling; R_DS(on) < 230 mΩ @ –4.5 V enables direct MCU interface without level shifters.

Use Scenario: PWM dimming of map lights, courtesy lamps, and ambient lighting strips.

IC Role / Device Role / Timing Role: Fast-switching load switch modulating current through LED strings at >1 kHz.

Use Value: t_r/t_f < 4 ns minimizes transition losses; integrated diode handles reverse recovery during duty-cycle changes.

USB-C Power Delivery Load Switch

Industrial Sensor Interface Protection

Use Scenario: Enabling/disabling 5 V/9 V/15 V rails in portable USB-C PD adapters and docking stations.

IC Role / Device Role / Timing Role: Logic-controlled high-side switch (with charge pump) or low-side switch in hot-swap circuits.

Use Value: V_GS(th) = –1.5 V allows clean turn-on with 3.3 V system controllers; E_AS = 6 mJ absorbs inrush and fault energy.

Use Scenario: Protecting analog sensor inputs (e.g., pressure, temp) from reverse polarity and ESD events.

IC Role / Device Role / Timing Role: Reverse-polarity protection FET placed before LDO or signal conditioner.

Use Value: R_DS(on) = 140 mΩ limits voltage drop to <150 mV at 1.2 A; HBM 2 kV rating shields downstream ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BSS84W,115 (Nexperia)	V_DS = –50 V, R_DS(on) = 10 Ω @ –10 V, I_D = –130 mA - higher R_DS(on), lower current rating	Suitable only for signal-level switching (<100 mA), not load switching	Select when ultra-low gate charge (Q_g = 0.7 nC) outweighs conduction loss requirements
DMG1012TQ-7 (Diodes Inc.)	V_DS = –20 V, R_DS(on) = 190 mΩ @ –4.5 V, AEC-Q101 qualified - lower voltage rating, similar R_DS(on)	Limited to 5 V/9 V systems; not suitable for 12 V automotive transients	Prefer for cost-sensitive 5 V embedded systems where 30 V margin is unnecessary

Compared with BSS84W and DMG1012TQ-7, BSD314SPEH6327XTSA1 uniquely balances 30 V rating, 1.5 A current capability, and AEC-Q101 compliance - making it the only option among the three validated for 12 V automotive load switching with transient immunity.

Availability

BSD314SPEH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, LED lighting control, USB-C power delivery modules, and industrial sensor interface protection requiring stable component supply and long-term lifecycle support.

Supply support for BSD314SPEH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.

The OptiMOS™-P 3 series delivers high-performance P-channel MOSFETs optimized for low-voltage automotive and industrial switching, emphasizing logic-level drive, ruggedness, and AEC-Q101 compliance.

FAQ

What is the maximum junction temperature and thermal resistance for BSD314SPEH6327XTSA1?

The device supports T_j up to +150 °C. Its thermal resistance R_thJA is 250 K/W on a minimal footprint 40 mm² FR4 PCB (1 mm wide, 70 µm thick traces on both sides). This value assumes no copper pour under the exposed drain pad - adding thermal vias and ground plane significantly improves dissipation.

Does BSD314SPEH6327XTSA1 require a gate resistor for safe operation?

A gate resistor (typically 6–22 Ω) is recommended to dampen ringing and limit peak gate current during fast switching. The datasheet specifies t_d(on)/t_d(off) and Q_g values assuming R_G,ext = 6 Ω; omitting it may cause overshoot and EMI in high-speed layouts.

Can BSD314SPEH6327XTSA1 be used in high-side switching configurations?

Yes - as a P-channel device, it is inherently suited for high-side switching when driven with appropriate gate control (e.g., charge pump or level shifter). Its V_GS(th) and R_DS(on) are characterized for V_GS ≤ 0 V; operation requires gate voltage ≤ source voltage by ≥|V_GS(th)|.

Is the SOT-363 package of BSD314SPEH6327XTSA1 compatible with standard reflow profiles?

Yes - it is qualified for lead-free reflow per JEDEC J-STD-020, with peak temperature up to 260 °C. The package uses matte tin plating and meets IPC/JEDEC moisture sensitivity level MSL-1, allowing unlimited floor life at ≤30 °C/60% RH.

BSD314SPEH6327XTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: 6-VSSOP, SC-88, SOT-363

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 1.5A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 140mOhm @ 1.5A, 10V

Vgs(th) (Max) @ Id:: 2V @ 6.3µA

Gate Charge (Qg) (Max) @ Vgs:: 2.9 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 294 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 500mW (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT363-6

BSD314SPEH6327XTSA1 FAQ

1.How can I place an order for BSD314SPEH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSD314SPEH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSD314SPEH6327XTSA1 reliable?

The price and inventory of BSD314SPEH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSD314SPEH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSD314SPEH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSD314SPEH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSD314SPEH6327XTSA1?

BSD314SPEH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSD314SPEH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSD314SPEH6327XTSA1?

For technical support, including BSD314SPEH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSD314SPEH6327XTSA1 requirements.

6.How does Aetrix verify that BSD314SPEH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSD314SPEH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSD314SPEH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSD314SPEH6327XTSA1?

All BSD314SPEH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSD314SPEH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSD314SPEH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSD314SPEH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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