Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSD314SPEL6327HTSA1

Name: BSD314SPEL6327HTSA1
Brand: Infineon Technologies
SKU: BSD314SPEL6327HTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BSD314SPEL6327HTSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: 6-VSSOP, SC-88, SOT-363

Datasheet:: BSD314SPEL6327HTSA1.pdf

Description:: MOSFET P-CH 30V 1.5A SOT363-6

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:6,050

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BSD314SPEL6327HTSA1 from Infineon Technologies is a P-channel enhancement-mode logic-level MOSFET in PG-SOT-363 package, rated for V_DS = −30 V, R_DS(on) = 230 mΩ at V_GS = −4.5 V and I_D = −1.2 A, qualified to AEC-Q101, and ESD-protected (HBM 1000–2000 V). It serves as a low-side load switch in automotive body electronics and industrial power management circuits.

For engineers reviewing the BSD314SPEL6327HTSA1 datasheet, BSD314SPEL6327HTSA1 pinout, BSD314SPEL6327HTSA1 application, or BSD314SPEL6327HTSA1 equivalent, key selection criteria include logic-level gate drive compatibility (−4.5 V threshold), AEC-Q101 qualification for automotive use, thermal resistance (R_thJA = 250 K/W), and integrated reverse diode with t_rr = 12.5 ns.

Technical Context

This MOSFET operates in enhancement mode with a gate threshold voltage range of −1.0 V to −2.0 V (V_GS(th), I_D = −6.3 µA), enabling reliable turn-on with standard 3.3 V or 5 V logic controllers. Its R_DS(on) remains stable across junction temperatures up to 150 °C, with typical values of 153 mΩ at −4.5 V and 107 mΩ at −10 V gate drive.

Dynamic performance includes C_iss = 221–294 pF, C_oss = 126–168 pF, and fast switching with t_d(on) = 5.1 ns and t_f = 2.8 ns under defined test conditions. The integrated body diode supports synchronous rectification in low-power DC-DC converters with V_SD = 0.8–1.1 V at I_F = −1.5 A.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS Rating	−30 V - supports 24 V automotive rail switching with 25 % margin
R_DS(on) @ V_GS = −4.5 V	230 mΩ max - enables <1.2 A continuous load switching with <0.33 W conduction loss
I_D Continuous @ T_A = 25 °C	−1.5 A - suitable for LED drivers, sensor biasing, and small solenoid control
Q_g Total Gate Charge	2.9 nC - allows efficient driving from low-current GPIOs without external buffer
t_rr Reverse Recovery Time	12.5 ns - minimizes switching losses in high-frequency (<1 MHz) buck regulators
E_AS Avalanche Energy	6 mJ - provides robustness against inductive load transients in relay/actuator interfaces
R_thJA Junction-to-Ambient	250 K/W - requires minimal PCB copper area (40 mm² FR4, 1 mm traces) for thermal compliance

Pinout & Package

Package: PG-SOT-363 (3-pin dual-channel variant, 6-terminal leadless package with exposed drain pad; footprint per Infineon outline Rev 2.4).

Pin/Terminal	Circuit Role	Design Meaning
1 (Source)	Source terminal for Channel 1	Connected to ground or low-side return path; electrically tied to pin 4 in dual configuration
2 (Gate)	Gate terminal for Channel 1	Logic-level input requiring −4.5 V for full enhancement; ESD-protected
3 (Drain)	Drain terminal for Channel 1	High-side connection point for switched load; thermally coupled to exposed pad
4 (Source)	Source terminal for Channel 2	Shared source node with pin 1; enables common-source dual-switch topology
5 (Gate)	Gate terminal for Channel 2	Independent gate control; identical electrical specs to pin 2
6 (Drain)	Drain terminal for Channel 2	Second switched output; isolated drain routing required for independent loads

Key Features

Feature	Design Value
AEC-Q101 Qualified	Validated for automotive applications including interior lighting, door modules, and HVAC actuators
Logic-Level Gate Drive	Guaranteed turn-on at V_GS = −4.5 V, compatible with 3.3 V microcontrollers without level-shifting
Integrated ESD Protection	HBM Class H2 (1000–2000 V) eliminates need for external TVS on gate lines in space-constrained designs
Halogen-Free & RoHS	Complies with IEC61249-2-21 and EU RoHS Directive; suitable for consumer and industrial end-equipment
Low Q_gd/Q_g Ratio	0.3/2.9 nC - improves hard-switching efficiency and reduces Miller-induced shoot-through risk

Applications

Automotive Interior Lighting Control

Industrial Sensor Bias Switching

Use Scenario: Driving multiple LED strings in door handle illumination and ambient lighting modules.

IC Role / Device Role / Timing Role: Low-side load switch enabling PWM dimming at 1–2 kHz with minimal dead-time impact.

Use Value: R_DS(on) stability over temperature ensures consistent brightness across −40 °C to +125 °C cabin environments.

Use Scenario: Enabling/disabling precision analog sensors (e.g., pressure, humidity) during sleep cycles.

IC Role / Device Role / Timing Role: Power-gating transistor isolating sensor supply to reduce system quiescent current below 1 µA.

Use Value: Sub-µA I_DSS at 150 °C prevents sensor drift and false wake-up events in sealed enclosures.

USB-C Port Power Switching

Small-Signal Relay Driver

Use Scenario: Controlling V_BUS enable path in USB-C power delivery sink applications.

IC Role / Device Role / Timing Role: Reverse-polarity protected high-side switch (with external charge pump) managing 5–20 V input rails.

Use Value: −30 V V_DS rating accommodates 20 V PD3.1 extended power range with safety margin.

Use Scenario: Driving 12 V/24 V miniature relays in programmable logic controllers and building automation nodes.

IC Role / Device Role / Timing Role: Inductive load switch with integrated avalanche energy handling (6 mJ) for contactor coil suppression.

Use Value: Eliminates need for external flyback diode, reducing BOM count and PCB area by 30 %.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BSS84RW	R_DS(on) = 5 Ω @ −10 V; lower current rating (I_D = −130 mA); SOT-323 package	Not AEC-Q101 qualified; unsuitable for automotive vibration or temperature cycling	Select only for cost-sensitive, non-automotive consumer applications with <100 mA loads
DMN3026LSD	Single-channel SOT-23; R_DS(on) = 210 mΩ @ −4.5 V; same AEC-Q101 grade and V_DS	Lacks dual-channel integration; requires two devices for identical functionality	Choose when board space permits discrete layout and thermal isolation between channels is preferred

Compared with BSS84RW and DMN3026LSD, BSD314SPEL6327HTSA1 uniquely delivers dual-channel integration, AEC-Q101 compliance, and optimized R_DS(on) at logic-level drive in a compact PG-SOT-363 package-critical for space-constrained automotive modules where channel matching and qualification are mandatory.

Availability

BSD314SPEL6327HTSA1 is available at Aetrix Electronics and suitable for automotive interior lighting control, industrial sensor bias switching, and USB-C port power switching requiring stable component supply, long-term lifecycle support, and AEC-Q101 traceability.

Supply support for BSD314SPEL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and qualification infrastructure.

The OptiMOS™-P 3 product line delivers high-performance P-channel MOSFETs optimized for logic-level drive, low R_DS(on), and automotive-grade reliability in compact packages for body electronics and power distribution systems.

FAQ

Is BSD314SPEL6327HTSA1 pin-compatible with BSD314SP?

Yes, BSD314SPEL6327HTSA1 uses the same PG-SOT-363 package and pinout as BSD314SP. Both share identical terminal assignments (pins 1–6), mechanical dimensions, and thermal pad layout per Infineon's Rev 2.4 package drawing. No PCB redesign is needed for substitution.

What is the maximum allowable gate-source voltage during transient conditions?

The absolute maximum V_GS is ±20 V per datasheet specifications. During ESD events, the integrated protection circuit clamps gate voltage to prevent oxide damage, supporting HBM testing up to 2000 V without external components.

Does this MOSFET support bidirectional current flow in its body diode?

No-the internal body diode conducts only from source to drain (anode at source, cathode at drain). It is not rated for sustained reverse conduction and lacks symmetrical blocking capability; use external diodes for true bidirectional operation.

Can BSD314SPEL6327HTSA1 be used in linear (analog) regulation mode?

It is not recommended. While the device can operate in the linear region, its R_DS(on) variation with temperature and lack of SOA curves beyond pulsed conditions make it unsuitable for precision analog pass elements. Use dedicated LDOs or linear regulators instead.

BSD314SPEL6327HTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: 6-VSSOP, SC-88, SOT-363

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 1.5A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 140mOhm @ 1.5A, 10V

Vgs(th) (Max) @ Id:: 2V @ 6.3µA

Gate Charge (Qg) (Max) @ Vgs:: 2.9 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 294 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 500mW (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT363-PO

BSD314SPEL6327HTSA1 FAQ

1.How can I place an order for BSD314SPEL6327HTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSD314SPEL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSD314SPEL6327HTSA1 reliable?

The price and inventory of BSD314SPEL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSD314SPEL6327HTSA1 is usually 5 days.

3.What payment methods are accepted for BSD314SPEL6327HTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSD314SPEL6327HTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSD314SPEL6327HTSA1?

BSD314SPEL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSD314SPEL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSD314SPEL6327HTSA1?

For technical support, including BSD314SPEL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSD314SPEL6327HTSA1 requirements.

6.How does Aetrix verify that BSD314SPEL6327HTSA1 is sourced from the original manufacturer or authorized distributors?

All BSD314SPEL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSD314SPEL6327HTSA1 meets industry standards.

7.What is the process for return or replacement of BSD314SPEL6327HTSA1?

All BSD314SPEL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSD314SPEL6327HTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSD314SPEL6327HTSA1 part is unused and in its original packaging.

Return procedure for BSD314SPEL6327HTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.