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Infineon Technologies BSL211SP
- Part No.:
- BSL211SP
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
BSL211SP.pdf
- Description:
- MOSFET P-CH 20V 4.7A TSOP-6
- Quantity:
- Payment:
- Shipping:
Inventory:4,913
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Product details
Overview
BSL211SP from Infineon Technologies is a dual-channel, high-side smart power switch IC designed for automotive load control in 12 V systems. It integrates two independent 40 mΩ (typ.) N-channel MOSFETs with current sensing, overtemperature shutdown, and short-circuit protection. Rated for 2.5 A continuous output per channel, it supports PWM-controlled resistive and inductive loads such as LED lighting and solenoids in body electronics.
For engineers reviewing the BSL211SP datasheet, BSL211SP pinout, BSL211SP application, or BSL211SP equivalent, key selection criteria include its integrated current-sense ratio (1:2000), diagnostic flag output, fail-safe behavior during overtemperature events, and AEC-Q100 Grade 1 qualification for under-hood use.
Technical Context
The BSL211SP implements two independent high-side driver channels with dedicated INx inputs and ISx current-sense outputs. Each channel features adaptive current limiting, thermal foldback, and open-load detection via voltage monitoring at the OUTx pins.
It operates from 5.5 V to 28 V supply voltage and includes internal charge pump for full enhancement of the integrated MOSFETs. The device communicates fault status through a shared DIAG pin with programmable blanking time and latched vs. auto-recovery modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Channels | Dual independent high-side switches - enables separate control of two loads without external isolation |
| RDS(on) (max) | 55 mΩ per channel at Tj = 150 °C - ensures low conduction loss and thermal margin in 2.5 A continuous operation |
| Current Sense Ratio | 1:2000 - allows accurate load current monitoring using standard ADCs without external amplification |
| Supply Voltage Range | 5.5 V to 28 V - supports cold-crank (6.0 V) and load-dump (28 V) conditions in automotive 12 V systems |
| Diagnostic Output | Open-drain DIAG pin with fault encoding - reports overtemperature, overcurrent, and open-load faults via pulse-width coding |
| AEC-Q100 Grade | Grade 1 (−40 °C to +125 °C ambient) - qualified for engine bay and passenger compartment body control modules |
Pinout & Package
BSL211SP is housed in a thermally enhanced PG-DSO-14-17 package (exposed thermal pad, 14-pin DSO) optimized for PCB heat dissipation in automotive PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBB | Power supply input | Connects to battery rail (5.5–28 V); internal charge pump derives gate drive voltage |
| GND | Ground reference | Common return for power, logic, and sense paths; tied to exposed thermal pad |
| IN1 / IN2 | Digital enable inputs | CMOS-compatible active-high control signals; each independently enables its respective channel |
| OUT1 / OUT2 | High-side switched outputs | Drives loads between OUTx and ground; supports inductive kickback clamping |
| IS1 / IS2 | Analog current sense outputs | Provides scaled replica of load current (ILOAD/2000) for real-time monitoring |
| DIAG | Shared diagnostic flag | Open-drain output encoding fault type and channel via pulse width; requires external pull-up |
| EN | Global enable input | Active-low hardware disable for both channels - used for system-level safety shutdown |
Key Features
| Feature | Design Value |
|---|---|
| Integrated current sensing | Eliminates need for external shunt resistor and amplifier, reducing BOM count and layout area |
| Programmable blanking time | Configurable via external capacitor on BLANK pin to suppress false overcurrent trips during inductive turn-on |
| Latched fault mode | Prevents automatic recovery after critical faults (e.g., short circuit), requiring explicit EN reset for safe re-enable |
| Thermal foldback | Gradually reduces output current above 150 °C junction temperature to maintain safe operation without abrupt shutdown |
| Open-load detection | Identifies disconnected loads by monitoring OUTx voltage during INx high state - supports diagnostics for lamp-out detection |
Applications
| LED Headlamp Control | Engine Cooling Fan Drive |
|---|---|
Use Scenario: Precise dimming and fault monitoring of automotive LED headlamps in adaptive driving beam (ADB) systems. IC Role / Device Role: Dual high-side switch providing independent PWM control and current feedback for left/right lamp strings. Use Value: Enables real-time LED current regulation and open-circuit detection for compliance with ECE R149 and SAE J2993 standards. | Use Scenario: Variable-speed control of brushless DC cooling fans in engine management systems. IC Role / Device Role: High-side driver for fan motor phase control logic, with overtemperature and stall detection. Use Value: Reduces microcontroller GPIO count and eliminates discrete sense/protect circuitry while meeting ISO 16750-2 transient immunity requirements. |
| Body Control Module Outputs | Seat Heating Element Control |
Use Scenario: Switching of door lock actuators, mirror heaters, and interior lighting in centralized body control units. IC Role / Device Role: Dual protected high-side driver replacing discrete FETs and protection ICs in multi-output BCU designs. Use Value: Achieves ASIL-B capable diagnostics (via DIAG encoding) and reduces PCB footprint by >40% versus discrete solutions. | Use Scenario: Safe, current-limited power delivery to PTC heating elements in automotive seat warmers. IC Role / Device Role: High-side switch with integrated current sense and thermal derating for heater element regulation. Use Value: Enables closed-loop temperature control using sensed current and prevents overheating during extended dwell cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side smart switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS4H160-Q1 | Single-channel, higher RDS(on) (80 mΩ), no integrated current sense - requires external shunt and amplifier | Lacks dual-channel integration and analog current monitoring; suited for simpler single-load systems | Select when only one protected output is needed and cost sensitivity outweighs diagnostic capability |
| BTS724G | Dual-channel like BSL211SP but lacks current-sense outputs and uses different fault encoding (separate FLT pins) | Requires additional ADC inputs and GPIOs for fault reporting; less suitable for space-constrained BCU designs | Choose where legacy board reuse favors pin-compatible footprint and discrete sense is acceptable |
Compared with TPS4H160-Q1 and BTS724G, the BSL211SP delivers superior integration density and diagnostic fidelity - its dual-channel architecture with 1:2000 current sense and encoded DIAG output reduces system-level component count and simplifies functional safety validation for ASIL-B subsystems.
Availability
BSL211SP is available at Aetrix Electronics and suitable for automotive body electronics, LED lighting control, and engine management systems requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.
Supply support for BSL211SP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
The BSL211SP belongs to Infineon's PROFET™+ 24V family of high-side switches, engineered specifically for robust, diagnostic-rich load control in automotive 12 V/24 V electrical architectures.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The BSL211SP supports continuous operation up to 150 °C junction temperature, with thermal foldback initiating above that threshold to limit power dissipation. Its PG-DSO-14-17 package includes an exposed thermal pad requiring minimum 200 mm² copper area for optimal heat transfer, enabling 2.5 A per channel at 125 °C ambient with proper PCB layout.
Does BSL211SP support PWM switching at frequencies above 1 kHz?
Yes - the BSL211SP supports PWM frequencies up to 25 kHz with minimal switching losses due to its fast turn-on/turn-off times (tON ≈ 1.5 µs, tOFF ≈ 1.2 µs). Its integrated charge pump ensures full gate drive across the entire supply range, maintaining consistent RDS(on) and thermal performance during high-frequency modulation.
How is open-load detection implemented and what load impedance triggers it?
Open-load detection activates when INx is high and OUTx voltage exceeds 3.5 V (indicating no current flow), confirmed after a 20 µs internal timer. It reliably detects open circuits for loads ≥1 kΩ, including failed LEDs or broken wiring, and asserts the DIAG pin with a specific pulse code distinguishable from overtemperature or overcurrent faults.
Can BSL211SP drive inductive loads without external flyback diodes?
Yes - the BSL211SP integrates internal clamp diodes across each channel to safely dissipate inductive energy during turn-off. It has been validated with solenoid loads up to 1 H and 2.5 A, meeting ISO 7637-2 Pulse 1/2b immunity requirements without external components, though external TVS may be added for enhanced surge robustness in harsh environments.
BSL211SP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 4.7A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 67mOhm @ 4.7A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.2V @ 25µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.4 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 654 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSOP6-6
BSL211SP FAQ
1.How can I place an order for BSL211SP through Aetrix?
Please submit a Request for Quotation (RFQ) for BSL211SP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSL211SP reliable?
The price and inventory of BSL211SP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL211SP is usually 5 days.
3.What payment methods are accepted for BSL211SP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL211SP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSL211SP?
BSL211SP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSL211SP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSL211SP?
For technical support, including BSL211SP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL211SP requirements.
6.How does Aetrix verify that BSL211SP is sourced from the original manufacturer or authorized distributors?
All BSL211SP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL211SP meets industry standards.
7.What is the process for return or replacement of BSL211SP?
All BSL211SP units undergo pre-shipment inspection (PSI). If there is an issue with BSL211SP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSL211SP part is unused and in its original packaging.
Return procedure for BSL211SP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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