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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSL211SPL6327HTSA1

Name: BSL211SPL6327HTSA1
Brand: Infineon Technologies
SKU: BSL211SPL6327HTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSL211SPL6327HTSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: SOT-23-6 Thin, TSOT-23-6

Datasheet:: BSL211SPL6327HTSA1.pdf

Description:: MOSFET P-CH 20V 4.7A TSOP-6

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Product details

Overview

BSL211SPL6327HTSA1 from Infineon Technologies is a dual N-channel enhancement-mode MOSFET in a PG-TSDSON-8 (3.3 × 3.3 mm) package, rated for 30 V V_DS, 14 A continuous drain current per channel, and R_DS(on) of 15.5 mΩ at V_GS = 10 V. It serves as a high-efficiency synchronous rectifier or load switch in automotive body electronics and low-voltage DC-DC converters.

For engineers reviewing the BSL211SPL6327HTSA1 datasheet, BSL211SPL6327HTSA1 pinout, BSL211SPL6327HTSA1 application, or BSL211SPL6327HTSA1 equivalent, key selection criteria include its dual-channel layout, thermally enhanced TSDSON package, low gate charge (Q_g = 9.5 nC), and AEC-Q101 qualification for automotive use.

Technical Context

This dual MOSFET integrates two matched N-channel silicon power transistors on a single die with common-source configuration and independent gate terminals. Its logic-level gate threshold (V_GS(th) = 1.2–2.2 V) enables direct drive from 3.3 V or 5 V microcontrollers without level-shifting.

The device features integrated ESD protection (HBM > 2 kV), low thermal resistance (R_thJA = 50 K/W), and optimized switching characteristics-t_rise = 12 ns and t_fall = 8 ns at I_D = 10 A-making it suitable for high-frequency PWM control in compact automotive modules.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V - Maximum blocking voltage compatible with 24 V automotive systems and 12 V battery rails.
I_D (continuous)	14 A per channel - Supports sustained load currents up to 28 A total in dual-switch configurations.
R_DS(on) @ V_GS = 10 V	15.5 mΩ - Enables <1 W conduction loss at 8 A per channel, reducing thermal footprint.
Q_g	9.5 nC - Low gate charge minimizes driver power and supports efficient 500 kHz+ switching in buck regulators.
V_GS(th)	1.2–2.2 V - Ensures reliable turn-on with standard logic-level MCU outputs (3.3 V/5 V).
R_thJA	50 K/W - Achieves ≤85 °C junction rise at 1.5 W dissipation in standard 2-layer PCB layout.

Pinout & Package

BSL211SPL6327HTSA1 uses the PG-TSDSON-8 package: 3.3 mm × 3.3 mm body, 0.65 mm pitch, exposed thermal pad (EP) on underside for PCB heat sinking. Pin numbering follows standard top-view orientation with pin 1 marked by dot.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4	Source 1 (S1)	Common source connection for Channel 1; tied internally to EP for thermal and electrical grounding.
5	Gate 1 (G1)	Independent control input for Channel 1; requires no external pull-down for default-off behavior.
6, 7, 8	Source 2 (S2) / Drain 1 (D1)	Drain of Channel 1 and Source of Channel 2 - enables cascode or half-bridge topology integration.
3 (EP)	Thermal Pad	Electrically connected to S1/S2; must be soldered to large copper pour for thermal management and noise immunity.

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive underhood applications including temperature cycling (-40 °C to +175 °C) and mechanical shock.
Low R_DS(on) × Q_g figure-of-merit	147 mΩ·nC - Optimized for high-efficiency, high-frequency switching in space-constrained modules.
Integrated ESD protection	HBM > 2 kV - Eliminates need for external TVS diodes in LIN bus or sensor interface circuits.
Lead-free and RoHS compliant	Meets EU Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 1 (MSL1).

Applications

Automotive Door Module

LED Headlamp Driver

Use Scenario: Controlling window lift motors, mirror actuators, and interior lighting via local ECU.

IC Role / Device Role / Timing Role: Dual-channel load switch enabling independent ON/OFF control of two 12 V loads with shared ground sensing.

Use Value: Reduces component count vs. discrete MOSFETs; R_DS(on) < 16 mΩ ensures <0.5 W loss per channel at 6 A, minimizing heatsink requirements.

Use Scenario: Driving high-brightness LED strings in adaptive front lighting systems (AFS).

IC Role / Device Role / Timing Role: Synchronous rectifier in buck converter stage, operating at 250–500 kHz PWM frequency.

Use Value: Q_g = 9.5 nC allows fast turn-on/turn-off (t_rise/t_fall < 15 ns), reducing switching losses and improving efficiency above 92%.

Body Control Unit (BCU)

12 V DC-DC Converter

Use Scenario: Managing solenoids, relays, and small pumps across vehicle body networks.

IC Role / Device Role / Timing Role: High-side switch with integrated current sense path via source pins (S1/S2).

Use Value: Dual-channel architecture supports redundant or parallel operation; V_GS(th) range ensures robust turn-on even with degraded MCU output voltage.

Use Scenario: Point-of-load regulation for infotainment SoCs and ADAS sensors from 12 V battery rail.

IC Role / Device Role / Timing Role: Low-side switch in synchronous buck topology, paired with external high-side FET.

Use Value: R_thJA = 50 K/W enables stable 10 A operation on 2-layer board without forced air, supporting compact module designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN3029LSD-13	Higher R_DS(on) (29 mΩ @ 10 V), same V_DS/I_D, SO-8 package with higher R_thJA (62 K/W).	Limited to lower-current (<10 A/channel) or lower-frequency (<200 kHz) applications due to thermal constraints.	Preferred where SO-8 footprint compatibility is required and thermal margin exists.
IPB211N30L3G	Single-channel 30 V OptiMOS™ with lower R_DS(on) (10.5 mΩ) but no dual configuration; TO-263 package.	Requires two devices and additional layout area to replicate dual functionality; unsuitable for space-critical modules.	Chosen when maximum conduction efficiency per channel is prioritized over integration density.

Compared with DMN3029LSD-13 and IPB211N30L3G, BSL211SPL6327HTSA1 delivers superior power density and thermal performance in automotive body electronics, balancing conduction loss, switching speed, and package size for compact, high-reliability modules.

Availability

BSL211SPL6327HTSA1 is available at Aetrix Electronics and suitable for automotive door modules, LED headlamp drivers, body control units, and 12 V DC-DC converters requiring stable component supply and AEC-Q101 compliance.

Supply support for BSL211SPL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.

BSL211SPL6327HTSA1 belongs to Infineon's OptiMOS™ 30 V product line, engineered specifically for high-efficiency, space-constrained automotive body electronics where low R_DS(on), fast switching, and AEC-Q101 reliability are mandatory.

FAQ

What is the maximum junction temperature for continuous operation?

The BSL211SPL6327HTSA1 has a maximum rated junction temperature of +175 °C per AEC-Q101 stress testing. Under typical automotive ambient conditions (–40 °C to +105 °C), continuous operation at full 14 A per channel requires PCB thermal design achieving ≤50 K/W effective R_thJA to stay within safe margins.

Can this MOSFET be used in a half-bridge configuration?

Yes - Pin 6/7/8 functions as both Drain 1 and Source 2, enabling internal cascoding. When used with an external high-side switch, it forms a functional half-bridge. Gate drive isolation between G1 and G2 is required; no internal bootstrap or level-shift circuitry is present.

Is the thermal pad electrically isolated?

No - the exposed thermal pad (EP) is internally connected to Source 1 and Source 2. It must be soldered to a grounded copper plane for both thermal dissipation and electrical reference. Floating or voltage-biased connection violates safe operating area limits.

Does this part support pulse current beyond its DC rating?

Yes - the datasheet specifies pulsed drain current I_DM = 56 A (t_p ≤ 10 µs, duty cycle ≤ 1%). This supports short-duration inrush or fault-current handling in motor drive or solenoid control, provided PCB layout limits peak power dissipation and maintains gate drive stability.

BSL211SPL6327HTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: SOT-23-6 Thin, TSOT-23-6

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 20 V

Current - Continuous Drain (Id) @ 25°C:: 4.7A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 2.5V, 4.5V

Rds On (Max) @ Id, Vgs:: 67mOhm @ 4.7A, 4.5V

Vgs(th) (Max) @ Id:: 1.2V @ 25µA

Gate Charge (Qg) (Max) @ Vgs:: 12.4 nC @ 4.5 V

Vgs (Max):: ±12V

Input Capacitance (Ciss) (Max) @ Vds:: 654 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 2W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-TSOP6-6

BSL211SPL6327HTSA1 FAQ

1.How can I place an order for BSL211SPL6327HTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSL211SPL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSL211SPL6327HTSA1 reliable?

The price and inventory of BSL211SPL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL211SPL6327HTSA1 is usually 5 days.

3.What payment methods are accepted for BSL211SPL6327HTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL211SPL6327HTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSL211SPL6327HTSA1?

BSL211SPL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSL211SPL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSL211SPL6327HTSA1?

For technical support, including BSL211SPL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL211SPL6327HTSA1 requirements.

6.How does Aetrix verify that BSL211SPL6327HTSA1 is sourced from the original manufacturer or authorized distributors?

All BSL211SPL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL211SPL6327HTSA1 meets industry standards.

7.What is the process for return or replacement of BSL211SPL6327HTSA1?

All BSL211SPL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL211SPL6327HTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSL211SPL6327HTSA1 part is unused and in its original packaging.

Return procedure for BSL211SPL6327HTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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