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Infineon Technologies BSL302SNH6327XTSA1

Part No.:
BSL302SNH6327XTSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
SOT-23-6 Thin, TSOT-23-6
Datasheet:
AetrixBSL302SNH6327XTSA1.pdf
Description:
MOSFET N-CH 30V 7.1A TSOP-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,850

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Product details

Overview

BSL302SNH6327XTSA1 from Infineon Technologies is an N-channel enhancement-mode logic-level MOSFET rated for 30 V VDS, 7.1 A continuous drain current at TA = 25 °C, and 25 mΩ RDS(on) at VGS = 10 V. It features avalanche rating, dv/dt ruggedness, AEC-Q101 qualification, and PG-TSOP-6 packaging-used in automotive body control modules and low-voltage DC-DC synchronous rectification.

For engineers reviewing the BSL302SNH6327XTSA1 datasheet, BSL302SNH6327XTSA1 pinout, BSL302SNH6327XTSA1 application, or BSL302SNH6327XTSA1 equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = 1.2–2.0 V), 38 mΩ RDS(on) at 4.5 V, 30 mJ single-pulse avalanche energy, and TSOP-6 thermal performance with RthJA = 230 K/W on minimal footprint PCB.

Technical Context

This MOSFET employs trench-based OptiMOS®2 technology optimized for low gate charge (Qg = 4.4–6.6 nC) and fast switching (tr = 2.8 ns, tf = 1.9 ns), enabling high-efficiency operation in 12 V automotive and industrial power stages. Its integrated body diode exhibits trr = 14.2 ns and Qrr = 5.1 nC under defined conditions.

The device supports robust operation across –55 °C to +150 °C junction temperature range, with VGS rating of ±20 V and ESD Class 0 (0–250 V HBM). Its dv/dt immunity of 6 kV/µs ensures reliable commutation in inductive load circuits without spurious turn-on.

Key Specifications

ParameterValue and Actual Design Meaning
VDS Rating30 V - supports 12 V nominal automotive and industrial bus systems with margin for transients.
RDS(on) @ 4.5 V38 mΩ max - enables direct logic-level MCU/GPIO drive without level-shifting in compact power switches.
ID Continuous7.1 A @ TA = 25 °C - suitable for medium-current loads like LED drivers and motor gate drivers.
EAS30 mJ - withstands inductive energy dump in relay/coil driving without external snubbers.
Qg4.4–6.6 nC - reduces gate drive power loss and enables >1 MHz switching in SMPS designs.
trr / Qrr14.2 ns / 5.1 nC - minimizes reverse recovery loss in synchronous buck converters.
RthJA230 K/W - defines thermal derating on standard 40 mm × 40 mm FR4 PCB with minimal copper area.

Pinout & Package

Package: PG-TSOP-6 - surface-mount, leadless, 1.6 mm × 2.9 mm footprint, 0.95 mm height, designed for automated assembly and moderate-power thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
1 (Source)Power return path for drain currentInternally connected to exposed drain pad; primary thermal conduction path to PCB.
2 (Gate)Control terminal for channel conductionLogic-compatible input requiring ≤2.0 V threshold; low Ciss (750 pF max) eases drive design.
3 (Drain)Main power output terminalHigh-side or low-side switch node; electrically and thermally tied to package backside metal pad.
4 (Source)Redundant source connectionParallel path to Pin 1; improves current sharing and reduces source inductance in high-di/dt apps.
5 (Drain)Secondary drain connectionElectrically identical to Pin 3; enhances thermal coupling to PCB copper area.
6 (Gate)Redundant gate connectionParallel to Pin 2; lowers gate loop inductance for improved EMI and switching stability.

Key Features

FeatureDesign Value
AEC-Q101 qualifiedValidated for automotive applications including engine control, lighting, and body electronics per stress test requirements.
dv/dt ruggednessRated to 6 kV/µs - prevents false turn-on during fast voltage transients in inductive switching.
Avalanche energy rating30 mJ single-pulse - allows safe operation under unclamped inductive switching without external protection.
Halogen-free & RoHSComplies with IEC61249-2-21 and EU RoHS Directive - meets environmental compliance for global OEM supply chains.
Logic-level gate driveVGS(th) = 1.2–2.0 V - compatible with 3.3 V and 5 V microcontrollers without gate driver ICs.

Applications

Automotive Body Control ModuleIndustrial 12 V DC-DC Synchronous Rectifier

Use Scenario: Driving solenoids, relays, and LED arrays in door modules and seat controls.

IC Role / Device Role / Timing Role: Low-side power switch controlled by 3.3 V CAN/LIN microcontroller GPIO.

Use Value: 38 mΩ RDS(on) at 4.5 V eliminates need for gate driver; AEC-Q101 ensures field reliability over 15-year vehicle life.

Use Scenario: Secondary-side switch in isolated 12 V output DC-DC converters for PLC I/O modules.

IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode to reduce conduction loss.

Use Value: 14.2 ns trr and 5.1 nC Qrr minimize reverse recovery loss, improving efficiency by ~2.1% at 5 A load.

USB-C Power Delivery Load SwitchSmart Home Actuator Driver

Use Scenario: Inrush-limited 5–20 V load switching for USB PD sink ports in docking stations.

IC Role / Device Role / Timing Role: High-side load switch with integrated reverse polarity protection via body diode.

Use Value: VGS = ±20 V rating and 30 V VDS support full USB PD 3.0 voltage range with safety margin.

Use Scenario: Driving small brushed DC motors and latching valves in HVAC actuators and smart locks.

IC Role / Device Role / Timing Role: Half-bridge low-side switch in compact H-bridge motor driver ICs.

Use Value: 230 K/W RthJA enables 7.1 A operation on 2-layer PCB without heatsink-reducing BOM cost and board area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
BSS138W,115 (Nexperia)Lower ID (0.3 A), higher RDS(on) (3.5 Ω), SOT-323 packageNot suitable for >1 A loads; limited thermal capabilitySelect only for signal-switching or low-current biasing-not power switching.
DMN3026LSD-13 (Diodes Inc.)Same VDS (30 V), lower RDS(on) (22 mΩ @ 10 V), SO-8 packageLarger footprint and higher gate charge (12.5 nC); requires gate driver for fast switchingPrefer when higher current (12 A) and lower RDS(on) justify larger board area and drive complexity.

Compared with BSL302SNH6327XTSA1, BSS138W offers ultra-small size but insufficient current handling, while DMN3026LSD delivers lower conduction loss at the cost of slower switching and larger layout footprint-making BSL302SN the optimal balance of logic-drive compatibility, thermal performance, and TSOP-6 space efficiency.

Availability

BSL302SNH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial DC-DC converters, and smart home actuator designs requiring stable component supply, AEC-Q101 compliance, and logic-level gate drive capability.

Supply support for BSL302SNH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap technologies.

The OptiMOS®2 product line targets high-efficiency, logic-compatible power switches for automotive and industrial applications where low RDS(on), fast switching, and ruggedness are critical.

FAQ

What is the maximum continuous drain current at 70 °C ambient temperature?

The BSL302SNH6327XTSA1 supports 5.7 A continuous drain current at TA = 70 °C, as specified in its absolute maximum ratings table. This derating reflects thermal limits of the PG-TSOP-6 package on standard PCB layouts without forced airflow or heatsinking.

Is this MOSFET suitable for use in a synchronous buck converter's low-side switch position?

Yes-the device's 14.2 ns reverse recovery time, 5.1 nC Qrr, and 38 mΩ RDS(on) at 4.5 V make it well-suited for low-side synchronous rectification in 12 V input buck converters up to ~500 kHz, provided gate drive rise/fall times are controlled to limit EMI.

Does the BSL302SNH6327XTSA1 have integrated ESD protection?

No-it is classified as ESD Class 0 per JESD22-A114-HBM (0–250 V), meaning it lacks internal ESD protection structures. External TVS or RC filtering is recommended on gate and drain lines in systems exposed to handling or system-level ESD events.

Can this part replace the BSL302SP in the same footprint?

No-the BSL302SP uses PG-TO263-3 (D²PAK) packaging, while BSL302SNH6327XTSA1 is PG-TSOP-6. They share electrical specs but differ mechanically; PCB redesign and thermal validation are required for substitution.

BSL302SNH6327XTSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
SOT-23-6 Thin, TSOT-23-6
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
7.1A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
25mOhm @ 7.1A, 10V
Vgs(th) (Max) @ Id:
2V @ 30µA
Gate Charge (Qg) (Max) @ Vgs:
6.6 nC @ 5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
750 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSOP6-6

BSL302SNH6327XTSA1 FAQ

1.How can I place an order for BSL302SNH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSL302SNH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSL302SNH6327XTSA1 reliable?

The price and inventory of BSL302SNH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL302SNH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSL302SNH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL302SNH6327XTSA1 transactions.

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4.How is shipping managed for BSL302SNH6327XTSA1?

BSL302SNH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSL302SNH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSL302SNH6327XTSA1?

For technical support, including BSL302SNH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL302SNH6327XTSA1 requirements.

6.How does Aetrix verify that BSL302SNH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSL302SNH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL302SNH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSL302SNH6327XTSA1?

All BSL302SNH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL302SNH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSL302SNH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSL302SNH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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