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Infineon Technologies BSL303SPEH6327XTSA1

Part No.:
BSL303SPEH6327XTSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
SOT-23-6 Thin, TSOT-23-6
Datasheet:
AetrixBSL303SPEH6327XTSA1.pdf
Description:
MOSFET P-CH 30V 6.3A TSOP-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,053

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Product details

Overview

BSL303SPEH6327XTSA1 from Infineon Technologies is a P-channel enhancement-mode MOSFET in PG-TSOP-6 package, rated for -30 V VDS, 6.3 A continuous drain current at TA = 25 °C, and 33 mΩ RDS(on) at VGS = -10 V. It serves as a logic-level power switch in low-side load control circuits for industrial power management and automotive body electronics.

For engineers reviewing the BSL303SPEH6327XTSA1 datasheet, BSL303SPEH6327XTSA1 pinout, BSL303SPEH6327XTSA1 application, or BSL303SPEH6327XTSA1 equivalent, key selection criteria include its AEC-Q101 qualification, -4.5 V logic-level gate drive compatibility, avalanche energy rating of 30 mJ, and ESD protection per JESD22-A114 Class HBM Level 2.

Technical Context

This OptiMOS™-P3 device uses trench-gate silicon technology optimized for low RDS(on) × Qg figure-of-merit in compact SMD packages. Its gate threshold voltage range (-2.0 to -1.5 V) ensures reliable turn-on with standard 3.3 V/5 V logic drivers while maintaining robustness against false triggering.

Dynamic parameters-including 14.0–20.9 nC total gate charge, 33–49 ns reverse recovery time, and 1053–1401 pF input capacitance-are characterized under defined test conditions (VDD = -15 V, ID = -6.3 A, RG,ext = 6 Ω) and support fast switching in DC-DC converters and motor driver half-bridges.

Key Specifications

ParameterValue and Actual Design Meaning
VDS-30 V - Maximum blocking voltage in reverse-polarity applications
RDS(on) @ VGS = -10 V33 mΩ max - Enables ≤0.13 W conduction loss at 6.3 A
ID continuous-6.3 A @ TA = 25 °C - Supports high-current load switching on minimal PCB copper area
EAS30.0 mJ - Withstands single-pulse inductive energy without failure
Qg14.0–20.9 nC - Determines gate driver power requirement and switching speed trade-off
VGS(th)-2.0 to -1.5 V - Ensures full enhancement with 3.3 V logic-level gate drive
tr/tf7.7–12 ns / 8.3–12 ns - Supports >10 MHz PWM operation in synchronous buck stages

Pinout & Package

PG-TSOP-6 package: surface-mount, lead-free, halogen-free, 1.6 mm × 2.9 mm footprint with exposed drain pad for thermal performance.

Pin/TerminalCircuit RoleDesign Meaning
1 (Source)Current return path for P-channel conductionConnected to system ground or higher potential rail in high-side configuration
2 (Gate)Control electrode for channel formationRequires <20 V absolute rating; logic-compatible with 3.3 V/5 V microcontrollers
3 (Drain)Main current-carrying terminal (connected to exposed pad)Thermally coupled to PCB copper; primary heat dissipation path
4 (Source)Redundant source connectionImproves current sharing and reduces source inductance in high-di/dt switching
5 (Drain)Secondary drain connectionEnhances thermal conduction from die to PCB via dual-drain routing
6 (Gate)Second gate terminalProvides low-inductance gate loop for stable high-frequency switching

Key Features

FeatureDesign Value
AEC-Q101 qualifiedValidated for automotive body electronics requiring reliability across -40 to +150 °C junction range
Logic-level gate driveFull enhancement at VGS = -4.5 V enables direct interface with 3.3 V MCU GPIOs
Avalanche-ratedGuaranteed 30 mJ single-pulse energy handling eliminates need for external snubbers in inductive loads
ESD protected (HBM Class 2)Withstands 2–4 kV human-body-model discharge without parameter shift or failure
Halogen-free & RoHS compliantMeets IPC-1752A material declaration requirements for green manufacturing

Applications

Automotive Door ModuleIndustrial PLC Output Stage

Use Scenario: Controlling power windows, locks, and mirror actuators in 12 V vehicle architectures.

IC Role / Device Role / Timing Role: Low-side P-channel switch enabling load disconnect and short-circuit protection.

Use Value: -30 V rating accommodates load-dump transients up to ±35 V; 6.3 A rating supports dual-motor actuation.

Use Scenario: Driving solenoids, relays, and indicator LEDs in programmable logic controller output modules.

IC Role / Device Role / Timing Role: Solid-state replacement for mechanical relays with µs-scale switching response.

Use Value: 33 mΩ RDS(on) limits self-heating to <1 W at 5 A, eliminating heatsinks in DIN-rail enclosures.

USB-C Power Delivery SinkSmart Lighting Dimming Circuit

Use Scenario: Reverse-polarity protection and inrush current limiting in USB-C PD sink designs.

IC Role / Device Role / Timing Role: Back-to-back P-MOSFET configuration for bidirectional blocking.

Use Value: -2.0 to -1.5 V VGS(th) ensures precise turn-on timing during CC line negotiation sequences.

Use Scenario: Phase-cut dimming control for LED drivers using trailing-edge TRIAC-compatible switching.

IC Role / Device Role / Timing Role: High-speed load switch synchronizing with AC zero-cross detection.

Use Value: 33–49 ns trr and 28–43 nC Qrr minimize commutation losses and EMI in 120 Hz dimming cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPB80P03P4L-04TO-263 package; 4.0 mΩ RDS(on) @ -10 V; 80 A ID; larger footprint and thermal massBetter suited for high-power (>20 A), high-temperature industrial invertersSelect when board space allows TO-263 and thermal design targets >50 W dissipation
SI7148DP-T1-GE3SO-8 package; 42 mΩ RDS(on) @ -4.5 V; 5.3 A ID; no AEC-Q101 qualificationTargeted at commercial-grade consumer power supplies, not automotiveChoose only for cost-sensitive non-automotive applications where AEC-Q101 is not required

Compared with IPB80P03P4L-04 and SI7148DP-T1-GE3, BSL303SPEH6327XTSA1 uniquely balances AEC-Q101 compliance, PG-TSOP-6 miniaturization, and -4.5 V logic-level drive-making it optimal for space-constrained automotive and industrial modules needing validated reliability.

Availability

BSL303SPEH6327XTSA1 is available at Aetrix Electronics and suitable for automotive door modules, industrial PLC output stages, USB-C power delivery sinks, and smart lighting dimming circuits requiring stable component supply and long-term lifecycle support.

Supply support for BSL303SPEH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The OptiMOS™-P3 product line delivers high-efficiency, logic-level P-channel MOSFETs optimized for space-constrained automotive and industrial power switches operating from 3.3 V–5 V control rails.

FAQ

What is the maximum allowable gate-source voltage for BSL303SPEH6327XTSA1?

The absolute maximum VGS is ±20 V, as specified in the datasheet's "Maximum ratings" table. Exceeding this limit risks permanent gate oxide damage. For reliable operation, gate drive should be clamped to -12 V maximum in negative swing applications, especially during hot-plug or transient events.

Does BSL303SPEH6327XTSA1 require a gate resistor for typical 3.3 V MCU drive?

Yes-a 10–47 Ω series gate resistor is recommended to dampen ringing and limit peak gate current during switching. The device's 14–21 nC total gate charge and low input capacitance make it sensitive to parasitic oscillation without controlled gate impedance, particularly in layouts with >5 cm trace length.

How does the PG-TSOP-6 package affect thermal performance compared to SO-8?

PG-TSOP-6 offers lower RthJA (62.5 K/W with 6 cm² copper) than standard SO-8 (typically >80 K/W), due to its exposed drain pad and thinner profile. This enables 1.8× higher power density in constrained spaces but requires strict adherence to solder paste volume and reflow profile to ensure void-free thermal interface to the PCB.

Is the reverse diode in BSL303SPEH6327XTSA1 suitable for synchronous rectification?

No-the integrated body diode has 33–49 ns reverse recovery time and 28–43 nC Qrr, making it unsuitable for high-frequency synchronous rectification above 100 kHz. It is designed for freewheeling and protection, not active conduction; external Schottky or GaN FETs are required for true synchronous operation.

BSL303SPEH6327XTSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
SOT-23-6 Thin, TSOT-23-6
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
6.3A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
33mOhm @ 6.3A, 10V
Vgs(th) (Max) @ Id:
2V @ 30µA
Gate Charge (Qg) (Max) @ Vgs:
20.9 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1401 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSOP6-6

BSL303SPEH6327XTSA1 FAQ

1.How can I place an order for BSL303SPEH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSL303SPEH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSL303SPEH6327XTSA1 reliable?

The price and inventory of BSL303SPEH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL303SPEH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSL303SPEH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL303SPEH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSL303SPEH6327XTSA1?

BSL303SPEH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSL303SPEH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSL303SPEH6327XTSA1?

For technical support, including BSL303SPEH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL303SPEH6327XTSA1 requirements.

6.How does Aetrix verify that BSL303SPEH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSL303SPEH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL303SPEH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSL303SPEH6327XTSA1?

All BSL303SPEH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL303SPEH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSL303SPEH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSL303SPEH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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