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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSL305SPEH6327XTSA1

Name: BSL305SPEH6327XTSA1
Brand: Infineon Technologies
SKU: BSL305SPEH6327XTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSL305SPEH6327XTSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: SOT-23-6 Thin, TSOT-23-6

Datasheet:: BSL305SPEH6327XTSA1.pdf

Description:: MOSFET P-CH 30V 5.3A TSOP-6

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Product details

Overview

BSL305SPEH6327XTSA1 from Infineon Technologies is a P-channel enhancement-mode MOSFET optimized for logic-level gate drive (4.5 V), with -30 V V_DS, 45 mΩ R_DS(on) at V_GS = -10 V, -5.3 A continuous drain current, and AEC-Q101 qualification for automotive use in load switching and power management circuits.

For engineers reviewing the BSL305SPEH6327XTSA1 datasheet, BSL305SPEH6327XTSA1 pinout, BSL305SPEH6327XTSA1 application, or BSL305SPEH6327XTSA1 equivalent, key selection criteria include logic-compatible gate threshold (-1.5 V typ), avalanche-rated ruggedness (20 mJ single-pulse), ESD protection (HBM Class 1C), thermal resistance (R_thJA = 62.5 K/W with 6 cm² copper), and TSOP-6 footprint compatibility.

Technical Context

This device operates as a low-side load switch in DC-DC converters and automotive body electronics, leveraging its -2 V to -1.5 V gate threshold for reliable turn-on with 3.3 V/5 V microcontroller outputs. Its 80 mΩ R_DS(on) at V_GS = -4.5 V enables efficient operation under logic-level drive conditions.

The MOSFET features fully characterized dynamic parameters including 9.4–14.0 nC total gate charge, 22–34 pF reverse transfer capacitance, and 23 ns reverse recovery time in its integrated body diode - critical for synchronous rectification and flyback snubberless designs.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	-30 V - maximum blocking voltage for 12 V automotive and industrial supply rails
R_DS(on) max	45 mΩ @ V_GS = -10 V - ensures <120 mW conduction loss at 5.3 A continuous load
I_D cont	-5.3 A @ T_A = 25 °C - supports medium-power load switching in compact SMD layouts
V_GS(th)	-1.5 V typ - guarantees full enhancement with standard 3.3 V GPIO without level-shifting
E_AS	20 mJ - withstands inductive energy spikes in motor driver and solenoid control
Q_g	9.4–14.0 nC - determines gate drive strength requirement for <30 ns switching transitions
t_r/t_f	8.0–12.0 / 5.1–7.7 ns - enables high-frequency PWM operation up to ~2 MHz

Pinout & Package

BSL305SPEH6327XTSA1 is housed in PG-TSOP-6 (also known as TSOP-6), a 6-pin surface-mount package with exposed drain pad for enhanced thermal performance on PCBs with ≥6 cm² copper area.

Pin/Terminal	Circuit Role	Design Meaning
1 (Source)	Current return path for P-channel conduction	Connected to system ground or higher potential rail depending on low-side configuration
2 (Gate)	Control terminal for channel modulation	Requires logic-level compatible drive; internal ESD protection avoids external clamping
3 (Drain)	Main current-carrying output terminal	Exposed pad ties directly to PCB copper for thermal dissipation and low-inductance routing
4 (Source)	Redundant source connection	Parallel path to Pin 1 to reduce source inductance in high-di/dt applications
5 (Drain)	Primary drain connection	Shared with Pin 3 via internal metal; used for signal routing and layout symmetry
6 (Source)	Third source connection	Provides additional current path and improves thermal coupling to PCB ground plane

Key Features

Feature	Design Value
Logic-level gate drive	Operates fully enhanced down to V_GS = -4.5 V, eliminating need for gate drivers in 3.3 V MCU systems
Avalanche-rated	Rated for 20 mJ single-pulse energy, enabling robust operation in inductive load switching without external snubbers
AEC-Q101 qualified	Validated for automotive temperature range (-40 to +150 °C) and reliability stress tests per JESD22
Halogen-free & RoHS	Meets EU Directive 2011/65/EU and JEDEC JS709A, supporting green manufacturing requirements
ESD protected (HBM Class 1C)	Withstands 1–2 kV human-body-model discharge, reducing handling sensitivity during assembly

Applications

Automotive Door Module

Industrial PLC Output Stage

Use Scenario: Controlling window lift motors and mirror actuators in 12 V battery-powered door modules.

IC Role / Device Role / Timing Role: Low-side switch managing bidirectional current flow through H-bridge half-bridges.

Use Value: -1.5 V V_GS(th) ensures clean turn-on with automotive MCUs; 20 mJ E_AS absorbs back-EMF from stalled motors.

Use Scenario: Driving 24 V solenoid valves and indicator lamps in programmable logic controller output cards.

IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays in DIN-rail mounted I/O modules.

Use Value: 45 mΩ R_DS(on) limits self-heating at 5 A loads; TSOP-6 footprint allows dense channel packing on 4-layer PCBs.

USB-C Power Delivery Sink

LED Driver for Automotive Lighting

Use Scenario: Implementing VBUS discharge and overvoltage protection in USB-C PD sink controllers.

IC Role / Device Role / Timing Role: Fast-turnoff switch discharging capacitive bus lines within <100 µs after fault detection.

Use Value: 7.7 ns max fall time and 14 nC Q_g enable sub-100 µs discharge cycles without gate driver overhead.

Use Scenario: Dimmable tail-light and brake-light current regulation using PWM-controlled high-side or low-side switching.

IC Role / Device Role / Timing Role: Low-loss current path modulated at 1–2 kHz to avoid audible noise in LED strings.

Use Value: 80 mΩ R_DS(on) @ -4.5 V supports direct MCU PWM without level shifters; -55 to +150 °C rating covers under-hood environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMG3415L-7	R_DS(on) = 50 mΩ @ -4.5 V; lower Q_g (7.5 nC); no AEC-Q101 qualification	Suitable for commercial-grade consumer power banks but not automotive ECUs	Select when cost sensitivity outweighs automotive qualification and thermal margin is sufficient
SI3457DV-T1-GE3	R_DS(on) = 65 mΩ @ -4.5 V; higher V_GS(th) (-2.5 V min); same TSOP-6 package	Acceptable for 5 V logic systems but marginal with 3.3 V MCUs due to higher threshold spread	Prefer where board space matches and qualification is non-critical; verify gate drive margin at worst-case V_GS(th)

Compared with DMG3415L-7 and SI3457DV-T1-GE3, BSL305SPEH6327XTSA1 provides tighter V_GS(th) distribution, AEC-Q101 validation, and superior R_DS(on) at logic-level drive - making it the only choice for safety-critical automotive load switching where thermal and reliability margins are constrained.

Availability

BSL305SPEH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC output stages, and USB-C power delivery protection requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BSL305SPEH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949.

BSL305SPEH6327XTSA1 belongs to the OptiMOS™-P 3 family, designed specifically for high-efficiency, logic-level-driven P-channel switching in space-constrained automotive and industrial applications.

FAQ

What is the maximum junction temperature and how does it affect safe operating area?

The BSL305SPEH6327XTSA1 has a maximum junction temperature of 150 °C. At this limit, its safe operating area shrinks significantly above 10 V V_DS due to thermal runaway constraints - continuous operation above 4 A at 20 V requires ≥6 cm² copper area and forced airflow to maintain T_j ≤ 135 °C per SOA curves on page 4 of Rev. 2.0 datasheet.

Is the body diode suitable for reverse polarity protection?

Yes - the integrated body diode supports -5.3 A continuous forward current and exhibits V_SD = -0.9 to -1.1 V at -5.3 A and 25 °C. Its 23 ns t_rr and 17 nC Q_rr make it viable for low-frequency reverse-battery protection, though discrete Schottky solutions offer lower forward drop in high-current (>10 A) cases.

Does this MOSFET require a gate resistor for stability in switching applications?

A gate resistor of 6 Ω is recommended per datasheet test conditions (page 3) to dampen ringing caused by Crss interaction with PCB inductance. Without it, overshoot exceeding ±20 V on V_GS may occur during fast switching, risking gate oxide damage - especially when driven by low-impedance MCU pins.

How does the thermal resistance change with PCB copper area?

R_thJA drops from 230 K/W (minimal footprint) to 62.5 K/W with 6 cm² of 70 µm-thick copper on FR4 - a 3.7× improvement. This assumes vertical PCB orientation in still air; doubling copper area beyond 6 cm² yields diminishing returns (<10% further reduction) due to convection limits.

BSL305SPEH6327XTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: SOT-23-6 Thin, TSOT-23-6

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 5.3A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 45mOhm @ 5.3A, 10V

Vgs(th) (Max) @ Id:: 2V @ 20µA

Gate Charge (Qg) (Max) @ Vgs:: 14 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 939 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 2W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-TSOP6-6

BSL305SPEH6327XTSA1 FAQ

1.How can I place an order for BSL305SPEH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSL305SPEH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSL305SPEH6327XTSA1 reliable?

The price and inventory of BSL305SPEH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL305SPEH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSL305SPEH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL305SPEH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSL305SPEH6327XTSA1?

BSL305SPEH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSL305SPEH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSL305SPEH6327XTSA1?

For technical support, including BSL305SPEH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL305SPEH6327XTSA1 requirements.

6.How does Aetrix verify that BSL305SPEH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSL305SPEH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL305SPEH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSL305SPEH6327XTSA1?

All BSL305SPEH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL305SPEH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSL305SPEH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSL305SPEH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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