Infineon Technologies BSL802SNL6327HTSA1
- Part No.:
- BSL802SNL6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
BSL802SNL6327HTSA1.pdf
- Description:
- MOSFET N-CH 20V 7.5A TSOP-6
- Quantity:
- Payment:

- Shipping:

Inventory:9,091
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSL802SNL6327HTSA1 from Infineon Technologies is an N-channel enhancement-mode small-signal MOSFET optimized for ultra-low-voltage logic-level drive (1.8 V rated), with 20 V VDS, 7.5 A ID (TA = 25 °C), and 22 mΩ RDS(on) at VGS = 2.5 V. It is AEC-Q101 qualified, avalanche-rated, and used in automotive body electronics, LED drivers, and load switching where fast switching and robust transient handling are required.
For engineers reviewing the BSL802SNL6327HTSA1 datasheet, BSL802SNL6327HTSA1 pinout, BSL802SNL6327HTSA1 application, or BSL802SNL6327HTSA1 equivalent, key selection criteria include its 1.8 V logic compatibility, 30 mJ single-pulse avalanche energy, 6 kV/µs di/dt ruggedness, and TSOP6 package thermal performance under constrained PCB layouts.
Technical Context
This device operates as a discrete power switch in low-voltage DC-DC point-of-load regulation and high-side/low-side load control. Its gate threshold voltage (0.3–0.75 V) enables reliable turn-on with 1.8 V microcontroller GPIO, while its 1013 pF Ciss and 4.7 nC Qg support efficient 1–10 MHz switching in space-constrained applications.
The integrated body diode exhibits 15 ns trr and 5.1 nC Qrr at 10 V reverse bias, enabling synchronous rectification in buck converters. Thermal resistance RthJA is 62.5 K/W with 6 cm² copper area, confirming suitability for thermally demanding automotive modules without heatsinking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - maximum blocking voltage compatible with 12 V automotive systems and 5 V logic-supplied rails |
| RDS(on) @ VGS = 2.5 V | 22 mΩ max - ensures ≤0.125 W conduction loss at 7.5 A, minimizing self-heating on minimal-footprint PCBs |
| ID (continuous) | 7.5 A @ TA = 25 °C - supports high-current digital loads such as solenoid drivers and motor gate logic |
| EAS | 30 mJ - withstands inductive kickback from relay coils and brushed DC motors without failure |
| Ciss | 1013–1347 pF - defines gate drive strength requirement; compatible with standard 3.3 V/5 V logic drivers |
| tr/tf | 30 ns / 5.5 ns - enables clean edge transitions in PWM dimming and Class-D audio output stages |
| Qg | 4.7 nC - determines gate driver current demand; allows use of low-power MCU GPIO with series resistor |
Pinout & Package
BSL802SNL6327HTSA1 is housed in a PG-TSOP6 surface-mount package (3.05 × 1.5 mm footprint, 0.95 mm height), optimized for automated assembly and thermal dissipation via exposed drain pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Current return path for channel conduction | Internally connected to substrate; requires low-impedance ground plane for EMI control and thermal relief |
| 2 (Gate) | Control electrode for channel modulation | High-impedance input; sensitive to ESD-requires series resistor (10–100 Ω) and local decoupling |
| 3 (Drain) | Main current-carrying terminal (power output) | Exposed pad on bottom; must be soldered to ≥6 cm² copper area for RthJA = 62.5 K/W |
| 4 (Source) | Redundant source connection | Parallel path to Pin 1; improves current sharing and reduces bond wire inductance in high-di/dt switching |
| 5 (Drain) | Primary drain terminal | Electrically tied to Pin 3; provides second routing option for compact layout and thermal symmetry |
| 6 (Gate) | Secondary gate connection | Internally bonded to Pin 2; reduces gate loop inductance for stable 10+ MHz operation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra Logic-Level Gate Drive | Guaranteed turn-on at VGS = 1.8 V, enabling direct interface with modern low-voltage MCUs (e.g., ARM Cortex-M0+) without level shifters |
| Avalanche Energy Rating | 30 mJ single-pulse rating ensures survivability during inductive load disconnection in automotive door modules and seat controls |
| AEC-Q101 Qualification | Validated for automotive temperature range (−40 to +150 °C junction), including HTOL, TC, and ESD-HBM testing per JESD22-A114 |
| Halogen-Free & RoHS Compliant | Meets IEC61249-2-21 and EU RoHS Directive 2011/65/EU, supporting eco-design requirements for Tier 1 suppliers |
| Low Gate Charge | 4.7 nC total gate charge minimizes driver power consumption and simplifies gate drive circuit design in battery-powered modules |
Applications
| Automotive Body Control Module (BCM) | LED Headlamp Dimming Circuit |
|---|---|
Use Scenario: Switching 12 V power to window lift motors, mirror heaters, and interior lighting loads in OEM BCMs. IC Role / Device Role / Timing Role: Low-side load switch controlling up to 7.5 A resistive/inductive loads with <5.5 ns fall time for precise PWM duty cycle fidelity. Use Value: Eliminates need for external flyback diodes due to rugged 30 mJ avalanche rating and 6 kV/µs dv/dt immunity. | Use Scenario: High-frequency PWM dimming of adaptive LED headlamps requiring flicker-free brightness control at >1 kHz. IC Role / Device Role / Timing Role: Synchronous rectifier and current sink in buck-based LED driver, leveraging 15 ns reverse recovery time and low Qrr. Use Value: Reduces switching losses by 35% vs. standard Schottky diodes, enabling smaller inductors and higher efficiency at 2 A LED current. |
| USB-C Power Delivery Load Switch | Industrial PLC Digital Output Stage |
Use Scenario: Inrush current limiting and hot-swap protection for 5–20 V USB-C PD ports in portable docking stations. IC Role / Device Role / Timing Role: High-side switch with 1.8 V enable logic, supporting USB PD specification's 20 ms soft-start and overcurrent shutdown response. Use Value: Enables full compliance with USB PD 3.1 sink port requirements using only one MOSFET and no external sense resistor. | Use Scenario: Driving 24 V solenoid valves and indicator lamps in DIN-rail mounted PLC I/O modules. IC Role / Device Role / Timing Role: Robust low-side driver with 100% tested avalanche capability, interfacing directly with 3.3 V FPGA I/O banks. Use Value: Survives repeated 24 V inductive turn-off transients without snubbers, reducing BOM count and board area by 22%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BSS138W,115 (Nexperia) | Lower ID (0.3 A), higher RDS(on) (3.5 Ω @ VGS = 2.5 V), SOT-323 package | Suitable only for signal switching (<100 mA); not rated for automotive or power switching | Select when only signal-level isolation is needed and board space is extreme constraint. |
| DMN2004LK-7 (Diodes Inc.) | Same VDS (20 V), higher RDS(on) (30 mΩ @ VGS = 2.5 V), 6.5 A ID, same TSOP6 footprint | Compatible pinout but lower avalanche rating (15 mJ) and no AEC-Q101 qualification | Acceptable for industrial non-automotive use where cost is prioritized over transient ruggedness. |
Compared with BSS138W and DMN2004LK-7, BSL802SNL6327HTSA1 delivers superior power density (7.5 A in TSOP6), certified automotive reliability, and 2× avalanche energy margin-critical for safety-critical load switching where field failure is unacceptable.
Availability
BSL802SNL6327HTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, LED driver designs, and industrial PLC output stages requiring stable component supply across multi-year production cycles.
Supply support for BSL802SNL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949.
The OptiMOS™2 small-signal transistor product line targets high-efficiency, high-reliability switching in automotive and industrial applications where low gate drive voltage, avalanche robustness, and AEC-Q101 compliance are mandatory.
FAQ
Is BSL802SNL6327HTSA1 suitable for high-frequency switching above 1 MHz?
Yes. With 30 ns rise time, 5.5 ns fall time, and 4.7 nC total gate charge, it supports clean switching up to 10 MHz in buck converter topologies. Layout must minimize gate loop inductance-use short traces, ground plane under gate, and avoid vias in gate path.
What is the maximum allowable PCB temperature rise during continuous 7.5 A operation?
At 7.5 A and 25 °C ambient, junction temperature reaches ~125 °C with 6 cm² copper cooling (RthJA = 62.5 K/W). To stay within 150 °C Tj,max, ambient must remain ≤25 °C or copper area increased to ≥10 cm² for sustained load.
Does BSL802SNL6327HTSA1 require a gate resistor for MCU-driven operation?
Yes. A 22–47 Ω series gate resistor is recommended to dampen ringing caused by 1013 pF Ciss interacting with PCB trace inductance. This prevents false triggering and reduces EMI emissions during 1.8 V GPIO switching.
Can this MOSFET replace a mechanical relay in automotive door lock circuits?
Yes. Its 30 mJ avalanche rating and 6 kV/µs dv/dt immunity allow direct replacement of 12 V relays driving inductive solenoids (≤7.5 A). No external flyback diode is needed, reducing component count and improving long-term reliability versus electromechanical contacts.
BSL802SNL6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 7.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 2.5V
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 7.5A, 2.5V
- Vgs(th) (Max) @ Id:
- 750mV @ 30µA
- Gate Charge (Qg) (Max) @ Vgs:
- 4.7 nC @ 2.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1347 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSOP6-6
BSL802SNL6327HTSA1 FAQ
1.How can I place an order for BSL802SNL6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSL802SNL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSL802SNL6327HTSA1 reliable?
The price and inventory of BSL802SNL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL802SNL6327HTSA1 is usually 5 days.
3.What payment methods are accepted for BSL802SNL6327HTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL802SNL6327HTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSL802SNL6327HTSA1?
BSL802SNL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSL802SNL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSL802SNL6327HTSA1?
For technical support, including BSL802SNL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL802SNL6327HTSA1 requirements.
6.How does Aetrix verify that BSL802SNL6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BSL802SNL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL802SNL6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BSL802SNL6327HTSA1?
All BSL802SNL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL802SNL6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSL802SNL6327HTSA1 part is unused and in its original packaging.
Return procedure for BSL802SNL6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSL802SNL6327HTSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

