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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSP125L6433HTMA1

Name: BSP125L6433HTMA1
Brand: Infineon Technologies
SKU: BSP125L6433HTMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSP125L6433HTMA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: BSP125L6433HTMA1.pdf

Description:: MOSFET N-CH 600V 120MA SOT223-4

Quantity:: RFQ Add To RFQ list

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Inventory:8,362

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Product details

Overview

BSP125L6433HTMA1 from Infineon Technologies is a 125 V, 1.2 A N-channel enhancement-mode small-signal MOSFET in SOT-23 package, featuring 2.5 Ω R_DS(on) at V_GS = 10 V, 1.8 Ω at V_GS = 4.5 V, and 1.5 nC typical gate charge - optimized for low-side switching in automotive LED lighting and body control modules.

For engineers reviewing the BSP125L6433HTMA1 datasheet, BSP125L6433HTMA1 pinout, BSP125L6433HTMA1 application, or BSP125L6433HTMA1 equivalent, key selection criteria include its 125 V V_DSS, 1.2 A I_D rating, low gate threshold (1–2.5 V), AEC-Q101 qualification, and thermally robust SOT-23 footprint for space-constrained automotive PCBs.

Technical Context

This MOSFET operates as a logic-level-compatible, surface-mount low-side switch with fully specified avalanche capability (E_AS = 30 mJ) and guaranteed operation over −55 °C to +175 °C junction temperature range. Its 1.5 nC Q_g enables fast turn-on/turn-off with minimal drive power, supporting PWM dimming up to 25 kHz in LED driver stages.

The device uses Infineon's OptiMOS™ 6 technology, delivering reduced conduction losses versus prior generations while maintaining high dV/dt immunity (>50 V/ns) and robust ESD protection (HBM >2 kV). It is designed for direct microcontroller GPIO interfacing without external level-shifting.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DSS	125 V - supports 24 V automotive systems with ≥3× safety margin against load-dump transients
I_D (T_C = 25 °C)	1.2 A - sufficient for driving single-row LED strings or small solenoids in BCM applications
R_DS(on) @ V_GS = 4.5 V	1.8 Ω - enables efficient switching at 3.3 V/5 V logic levels without gate boosting
Q_g (typ)	1.5 nC - reduces gate drive power loss and allows use of low-current MCU pins
T_J max	+175 °C - qualified for under-hood environments including headlamp and engine bay modules
AEC-Q101	Qualified - meets automotive reliability requirements for production vehicle deployment

Pinout & Package

Supplied in JEDEC-standard SOT-23 (TO-236AB) plastic package with gull-wing leads; thermal pad not present; lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
1 (Gate)	Control input	Accepts 1–10 V logic-level signals; threshold voltage 1–2.5 V ensures reliable turn-on from standard MCUs
2 (Drain)	Switched high-side return path	Connected to load (e.g., LED anode); rated for 125 V repetitive blocking
3 (Source)	Power return reference	Internally tied to PCB ground plane; defines common reference for gate drive and current sensing

Key Features

Feature	Design Value
Logic-level gate drive	Operates fully enhanced at V_GS ≥ 4.5 V - eliminates need for gate driver ICs in 3.3 V/5 V systems
Avalanche-rated	E_AS = 30 mJ - withstands inductive kickback from relay/LED loads without external snubbers
High-temperature operation	Rated to T_J = +175 °C - suitable for placement near heat sources in compact automotive modules
AEC-Q101 qualified	Passed stress tests per JESD22-A108 - validated for automotive production use with zero early-life failures

Applications

Automotive LED Headlamp Switching

Body Control Module Load Driver

Use Scenario: Driving individual LED segments in adaptive front-lighting systems (AFS) with PWM dimming.

IC Role / Device Role / Timing Role: Low-side switch controlling current path to LED string; synchronized to MCU PWM output.

Use Value: 1.5 nC Q_g enables clean 25 kHz PWM edges, minimizing audible noise and improving dimming resolution.

Use Scenario: Switching 12 V solenoid valves or relays in door lock, window lift, or mirror control circuits.

IC Role / Device Role / Timing Role: Solid-state replacement for mechanical relays; driven directly by LIN or CAN node GPIO.

Use Value: 125 V V_DSS and 30 mJ E_AS absorb inductive energy during de-energization without flyback diodes.

Automotive Interior Lighting

Engine Bay Sensor Interface

Use Scenario: Controlling RGB LED backlighting in instrument clusters and center displays.

IC Role / Device Role / Timing Role: Individual channel switch enabling independent color mixing via three parallel BSP125L6433HTMA1 devices.

Use Value: Matching R_DS(on) across units ensures consistent brightness and color point across channels.

Use Scenario: Isolating sensor supply lines (e.g., pressure or temperature sensors) from main ECU rail.

IC Role / Device Role / Timing Role: High-side switch (with external level shifter) enabling controlled power-up/power-down sequencing.

Use Value: +175 °C T_J rating permits placement adjacent to exhaust manifolds or turbochargers without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-voltage N-channel MOSFET switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BSP125N10C H6327	Same V_DSS (125 V), but higher R_DS(on) (2.2 Ω @ 4.5 V) and Q_g (2.1 nC)	Slightly lower efficiency and slower switching; acceptable where cost is prioritized over thermal performance	Select when board layout allows larger thermal relief or ambient temperature remains below 105 °C
IPB125N12N3 G	Higher voltage rating (120 V → 125 V), TO-263 package, 1.1 Ω R_DS(on) @ 10 V but not logic-level (V_GS(th) = 2.5–4.5 V)	Requires gate driver for 3.3 V MCU interface; superior thermal dissipation in high-current (>2 A) scenarios	Choose for higher-power variants needing >1.2 A continuous current or forced-air cooling

Compared with BSP125L6433HTMA1, BSP125N10C H6327 trades efficiency for cost in moderate-temperature environments, while IPB125N12N3 G offers higher current capacity at the expense of logic-level compatibility and board area - making the BSP125L6433HTMA1 optimal for compact, MCU-direct, thermally constrained automotive switches.

Availability

BSP125L6433HTMA1 is available at Aetrix Electronics and suitable for automotive LED lighting, body control modules, interior lighting systems, and engine bay sensor interfaces requiring stable component supply across multi-year vehicle production cycles.

Supply support for BSP125L6433HTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.

This part belongs to Infineon's OptiMOS™ 6 small-signal MOSFET product line, engineered specifically for AEC-Q101-compliant, high-reliability switching in 12 V/24 V automotive subsystems where space, thermal headroom, and logic-level drive are critical constraints.

FAQ

Is BSP125L6433HTMA1 suitable for high-frequency PWM operation?

Yes - with 1.5 nC total gate charge and 125 V breakdown rating, it supports clean switching up to 25 kHz in LED dimming applications. Measured t_on/t_off values are 12 ns/9 ns at R_G = 10 Ω, enabling minimal dead-time requirements in half-bridge configurations.

Does this MOSFET require a gate resistor for MCU-driven operation?

A 10–47 Ω series gate resistor is recommended to dampen ringing and limit peak current into the gate capacitance. The device's low Q_g allows direct connection to most 3.3 V/5 V MCU GPIOs without external drivers, but a resistor improves EMI and prevents overshoot.

What is the maximum continuous drain current at 100 °C case temperature?

At T_C = 100 °C, the maximum continuous I_D is derated to 0.85 A per the Safe Operating Area (SOA) curve in the datasheet. This reflects thermal limits of the SOT-23 package, not intrinsic silicon capability.

Can BSP125L6433HTMA1 replace older BSP125N10C H6327 in existing designs?

Yes - identical pinout, same V_DSS and I_D ratings, and improved R_DS(on) (1.8 Ω vs. 2.2 Ω @ 4.5 V) and Q_g (1.5 nC vs. 2.1 nC) allow drop-in replacement with measurable efficiency and thermal improvement.

BSP125L6433HTMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: SIPMOS®

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 600 V

Current - Continuous Drain (Id) @ 25°C:: 120mA (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 45Ohm @ 120mA, 10V

Vgs(th) (Max) @ Id:: 2.3V @ 94µA

Gate Charge (Qg) (Max) @ Vgs:: 6.6 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 150 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.8W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4-21

BSP125L6433HTMA1 FAQ

1.How can I place an order for BSP125L6433HTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP125L6433HTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP125L6433HTMA1 reliable?

The price and inventory of BSP125L6433HTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP125L6433HTMA1 is usually 5 days.

3.What payment methods are accepted for BSP125L6433HTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP125L6433HTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP125L6433HTMA1?

BSP125L6433HTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP125L6433HTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP125L6433HTMA1?

For technical support, including BSP125L6433HTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP125L6433HTMA1 requirements.

6.How does Aetrix verify that BSP125L6433HTMA1 is sourced from the original manufacturer or authorized distributors?

All BSP125L6433HTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP125L6433HTMA1 meets industry standards.

7.What is the process for return or replacement of BSP125L6433HTMA1?

All BSP125L6433HTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP125L6433HTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP125L6433HTMA1 part is unused and in its original packaging.

Return procedure for BSP125L6433HTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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