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Infineon Technologies BSP135 E6327
- Part No.:
- BSP135 E6327
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP135 E6327.pdf
- Description:
- MOSFET N-CH 600V 120MA SOT223-4
- Quantity:
- Payment:
- Shipping:
Inventory:8,827
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Product details
Overview
BSP135 E6327 from Infineon Technologies is an N-channel enhancement-mode MOSFET optimized for low-voltage switching applications, featuring 60 V VDS, 280 mΩ RDS(on) at VGS = 10 V, and 2.5 A continuous drain current in SOT-223 package. It serves as a load switch or discrete power stage in DC-DC converters, LED drivers, and automotive body electronics.
For engineers reviewing the BSP135 E6327 datasheet, BSP135 E6327 pinout, BSP135 E6327 application, or BSP135 E6327 equivalent, key selection criteria include its low gate charge (10 nC), fast turn-on/turn-off times (14 ns / 22 ns), and AEC-Q101 qualification for automotive use.
Technical Context
This MOSFET employs planar silicon technology with integrated ESD protection and operates in enhancement mode with threshold voltage VGS(th) ranging from 1.0 V to 2.5 V. Its safe operating area supports pulsed currents up to 8 A and junction temperature up to 150 °C.
The device uses standard logic-level gate drive compatibility and exhibits low reverse recovery charge (Qrr = 20 nC) when used in synchronous rectification or flyback topologies. Thermal resistance RthJA is 100 K/W in standard PCB layout per JEDEC 51-3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage for 12–24 V system-level designs |
| RDS(on) @ VGS = 10 V | 280 mΩ - Enables <1 W conduction loss at 2.5 A continuous current |
| ID (continuous) | 2.5 A - Rated for sustained operation in thermally constrained SOT-223 footprint |
| Qg | 10 nC - Supports efficient 1–2 MHz switching in compact DC-DC regulators |
| ton/toff | 14 ns / 22 ns - Minimizes switching transition losses in high-frequency PWM control |
| VGS(th) | 1.0–2.5 V - Ensures reliable turn-on with 3.3 V or 5 V microcontroller GPIO |
Pinout & Package
Supplied in SOT-223 surface-mount package with exposed drain pad for thermal dissipation. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control terminal | Receives logic-level voltage to modulate channel conductivity; requires <10 nC charge for full turn-on |
| Pin 2 (Drain) | High-side power node | Connected to exposed metal tab; electrically tied to drain; primary heat path to PCB copper |
| Pin 3 (Source) | Reference node | Common return for gate drive and load current; defines local ground reference for gate control |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive ambient temperatures (−40 °C to +125 °C) and mechanical stress requirements |
| Low RDS(on) × Qg | 2.8 Ω·nC figure-of-merit enables high-efficiency, high-frequency switching in space-constrained layouts |
| Integrated ESD protection | HBM rating >2 kV eliminates need for external transient suppression in board-level ESD zones |
| Logic-level compatible | Turns fully on with 3.3 V or 5 V gate drive-no level-shifting circuitry required for MCU interfacing |
Applications
| Automotive Body Control Module | Industrial LED Driver |
|---|---|
Use Scenario: Switching 12 V loads such as interior lighting, window lift motors, and HVAC actuators in BCM subassemblies. IC Role / Device Role: Discrete N-channel load switch replacing electromechanical relays. Use Value: Reduces PCB area by 70% vs relay, eliminates contact wear, and supports PWM dimming via gate modulation. |
Use Scenario: Constant-current regulation for 24 V LED strings in signage and machine vision lighting. IC Role / Device Role: Low-side current-sink switch in buck-derived constant-current topology. Use Value: Delivers stable 2.5 A output with <±3% current accuracy across temperature due to low RDS(on) drift. |
| USB-C Power Delivery Sink | Consumer DC-DC Point-of-Load Regulator |
Use Scenario: Inrush current limiting and overcurrent protection for 20 V USB-PD input rails in portable monitors. IC Role / Device Role: Hot-swap FET in upstream power path before buck controller. Use Value: Limits peak inrush to <3 A using controlled gate ramp; withstands 60 V transients per USB PD 3.1 spec. |
Use Scenario: High-efficiency 5 V → 3.3 V step-down conversion for FPGA I/O banks and sensor interfaces. IC Role / Device Role: Synchronous rectifier in 2 MHz buck converter with integrated controller. Use Value: Achieves >94% efficiency at 1.5 A load due to low Qg and RDS(on), minimizing thermal derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP36NF06L | Higher RDS(on) (40 mΩ), TO-220 package, no AEC-Q101 qualification | Requires heatsink; unsuitable for automotive under-hood environments | Preferred for cost-sensitive industrial mains-powered systems where thermal margin exceeds 50 K |
| DMN3025LSD-13 | Lower VDS (30 V), smaller SOT-23 package, RDS(on) = 25 mΩ at 4.5 V | Limited to ≤15 V systems; insufficient for 24 V automotive transients | Optimal for battery-powered IoT nodes with 3.3 V logic and <1 A load current |
Compared with STP36NF06L and DMN3025LSD-13, the BSP135 E6327 uniquely balances 60 V rating, AEC-Q101 compliance, and SOT-223 thermal performance-making it the only choice for automotive-grade 12–24 V load switching without heatsinking.
Availability
BSP135 E6327 is available at Aetrix Electronics and suitable for automotive body electronics, industrial LED drivers, USB-C power delivery protection, and consumer DC-DC point-of-load regulators requiring stable component supply and long-term lifecycle support.
Supply support for BSP135 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The BSP135 belongs to Infineon's OptiMOS™ 30 V–60 V small-signal MOSFET product line, engineered specifically for high-reliability, low-RDS(on) switching in automotive and industrial power stages.
FAQ
What is the maximum junction temperature for BSP135 E6327?
The absolute maximum junction temperature is 150 °C, validated per AEC-Q101 stress testing. Derating curves in the official Infineon datasheet specify that continuous 2.5 A operation requires ≤50 °C ambient temperature with 1 in² 2-oz copper pad per JEDEC 51-3 standards.
Does BSP135 E6327 support gate driving directly from a 3.3 V microcontroller?
Yes-its VGS(th) range of 1.0–2.5 V and guaranteed RDS(on) at VGS = 4.5 V (350 mΩ max) ensure full enhancement with 3.3 V logic. Gate charge of 10 nC allows clean switching using standard GPIO without external driver buffering.
Is BSP135 E6327 suitable for synchronous rectification in a 500 kHz buck converter?
Yes-its 14 ns turn-on and 22 ns turn-off times, low Qrr (20 nC), and 60 V VDS rating make it suitable for 500 kHz synchronous rectification in 12 V input, 3.3–5 V output converters, provided gate drive rise/fall times remain <10 ns.
How does the SOT-223 package affect thermal performance compared to TO-220?
SOT-223 delivers RthJA = 100 K/W on standard FR4 with 1 in² 2-oz copper, versus ~62 K/W for TO-220 with heatsink. While less effective than TO-220 under forced air, SOT-223 enables higher board density and meets thermal needs for ≤2.5 A continuous loads in automotive cabin modules.
BSP135 E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel, Depletion Mode
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 120mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 0V, 10V
- Rds On (Max) @ Id, Vgs:
- 45Ohm @ 120mA, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 94µA
- Gate Charge (Qg) (Max) @ Vgs:
- 4.9 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 146 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4
BSP135 E6327 FAQ
1.How can I place an order for BSP135 E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP135 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP135 E6327 reliable?
The price and inventory of BSP135 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP135 E6327 is usually 5 days.
3.What payment methods are accepted for BSP135 E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP135 E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP135 E6327?
BSP135 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP135 E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP135 E6327?
For technical support, including BSP135 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP135 E6327 requirements.
6.How does Aetrix verify that BSP135 E6327 is sourced from the original manufacturer or authorized distributors?
All BSP135 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP135 E6327 meets industry standards.
7.What is the process for return or replacement of BSP135 E6327?
All BSP135 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BSP135 E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP135 E6327 part is unused and in its original packaging.
Return procedure for BSP135 E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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