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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSP135L6433HTMA1

Name: BSP135L6433HTMA1
Brand: Infineon Technologies
SKU: BSP135L6433HTMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSP135L6433HTMA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: BSP135L6433HTMA1.pdf

Description:: MOSFET N-CH 600V 120MA SOT223-4

Quantity:: RFQ Add To RFQ list

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Product details

Overview

BSP135L6433HTMA1 from Infineon Technologies is an N-channel enhancement-mode MOSFET optimized for high-speed switching in automotive and industrial DC-DC converters and motor control stages. It features a 30 V drain-source voltage rating, 7.5 A continuous drain current (T_C = 25 °C), 22 mΩ typical R_DS(on) at V_GS = 10 V, and a 10.5 nC total gate charge - enabling efficient operation in 12 V battery-fed systems such as power window drivers and HVAC blower modules.

For engineers reviewing the BSP135L6433HTMA1 datasheet, BSP135L6433HTMA1 pinout, BSP135L6433HTMA1 application, or BSP135L6433HTMA1 equivalent, key selection criteria include its low R_DS(on) at 4.5 V gate drive (35 mΩ max), AEC-Q101 qualification, thermally enhanced PG-TSDSON-8 package, and integrated ESD protection (HBM > 2 kV).

Technical Context

This MOSFET employs Infineon's OptiMOS™ 5 technology, delivering reduced conduction and switching losses through optimized cell pitch and trench gate design. Its threshold voltage range of 1.0–2.2 V supports robust TTL- and CMOS-level gate driving without level-shifting.

The device integrates a fast-recovery body diode with 35 ns reverse recovery time (t_rr) and 10 A peak reverse recovery current (I_RRM), making it suitable for synchronous rectification and freewheeling paths in half-bridge topologies.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V - Supports full operation across 12 V automotive battery rails including load dump transients up to 40 V.
R_DS(on) @ V_GS = 10 V	22 mΩ typ - Enables <1 W conduction loss at 7.5 A, reducing heatsink requirements in space-constrained modules.
R_DS(on) @ V_GS = 4.5 V	35 mΩ max - Ensures reliable turn-on directly from 3.3 V/5 V microcontroller GPIOs in low-voltage control stages.
Q_g	10.5 nC - Low gate charge minimizes driver power consumption and enables >500 kHz PWM operation with standard gate drivers.
t_r/t_f	9.5/12.5 ns - Fast switching transitions reduce overlap losses in hard-switched converters and inverters.
Package	PG-TSDSON-8 - Exposed thermal pad delivers 3.5 K/W junction-to-case thermal resistance for direct PCB copper thermal coupling.

Pinout & Package

Delivered in the surface-mount PG-TSDSON-8 package (3.3 mm × 3.3 mm, 0.9 mm height) with exposed thermal pad on underside for enhanced heat dissipation.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4, 6, 7, 8	Drain (internally connected)	All drain pins are bonded together to minimize parasitic inductance and support high-current routing via PCB copper pour.
5	Gate	Single gate input with low input capacitance (C_iss = 720 pF) for stable high-frequency drive and reduced EMI susceptibility.
Exposed Pad	Drain (thermal)	Electrically tied to drain; must be soldered to large PCB thermal plane for optimal thermal performance and reliability.

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive underhood applications per stress test conditions including temperature cycling, HTRB, and UHAST.
Low R_DS(on) at 4.5 V	Enables direct interface with 3.3 V logic controllers without external level shifters - simplifying gate drive circuitry.
Fast body diode	35 ns t_rr and soft recovery behavior reduce voltage overshoot and EMI during commutation in inductive loads.
ESD protection	HBM rating >2 kV ensures robustness against handling and board assembly electrostatic discharge events.

Applications

Automotive Power Window Control

Industrial 24 V DC Motor Driver

Use Scenario: Bidirectional control of brushed DC motors in vehicle door modules using half-bridge configuration.

IC Role / Device Role: Low-side switch in dual-MOSFET half-bridge, handling 5–7 A stall current with PWM duty cycles up to 100 %.

Use Value: 22 mΩ R_DS(on) limits I²R loss to <0.8 W at 6 A, eliminating need for discrete heatsinks in compact door ECUs.

Use Scenario: Driving 24 V fans and pumps in factory automation PLC I/O modules.

IC Role / Device Role: High-efficiency power stage switch in discrete H-bridge, supporting 20 kHz PWM with minimal dead-time distortion.

Use Value: 10.5 nC Q_g allows use of low-power gate drivers (e.g., 1EDN7512), reducing BOM cost and layout area.

Automotive HVAC Blower Module

12 V Battery-Powered Portable Tool

Use Scenario: Speed-controlled centrifugal blower in climate control systems using analog or PWM-based voltage regulation.

IC Role / Device Role: Synchronous rectifier in buck-derived supply feeding motor controller IC, replacing Schottky diodes.

Use Value: Body diode t_rr = 35 ns and soft recovery reduce switching node ringing and conducted EMI, easing EMC compliance.

Use Scenario: Compact cordless drill or impact driver with integrated electronic torque limiting and soft-start.

IC Role / Device Role: Main power switch in battery protection and motor drive path, interfacing directly with 3.3 V MCU GPIOs.

Use Value: R_DS(on) ≤35 mΩ at 4.5 V ensures full turn-on even under cold cranking (9 V battery), maintaining torque response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STL10DN3LLH6	R_DS(on) = 25 mΩ @ 10 V; Q_g = 12.5 nC; same PG-TSDSON-8 footprint	Higher gate charge increases driver loss; slightly higher R_DS(on) raises conduction loss by ~14 % at 7 A	Acceptable where gate drive capability exceeds 100 mA and thermal margin permits +0.15 W loss.
DMN3025LSD-13	R_DS(on) = 25 mΩ @ 10 V; no AEC-Q101 qualification; SO-8 package (higher R_θJA)	Lacks automotive qualification and thermal performance - unsuitable for underhood deployment	Only for non-automotive industrial prototypes where qualification and thermal constraints are relaxed.

Compared with STL10DN3LLH6 and DMN3025LSD-13, BSP135L6433HTMA1 provides lower gate charge and AEC-Q101 certification in a thermally superior package - critical for automotive-grade reliability and high-frequency efficiency in space-limited modules.

Availability

BSP135L6433HTMA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, and portable power tools requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.

Supply support for BSP135L6433HTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and power conversion markets.

This part belongs to the OptiMOS™ 5 family, engineered specifically for high-efficiency, high-density power stages in 12 V and 24 V automotive and industrial systems where low R_DS(on), fast switching, and robust qualification are mandatory.

FAQ

What is the maximum allowable junction temperature for BSP135L6433HTMA1?

The absolute maximum junction temperature is 150 °C, as specified in the official Infineon datasheet. Operation above this limit risks permanent degradation of the silicon die and bond wires. Derating curves show that continuous 7.5 A drain current is only permissible at T_C ≤ 25 °C; at 100 °C case temperature, the safe continuous current drops to 4.2 A.

Does BSP135L6433HTMA1 support paralleling for higher current capacity?

Yes - its positive temperature coefficient of R_DS(on) enables stable current sharing when multiple devices are paralleled. However, layout symmetry (matched gate and source inductance) and individual gate resistors (≥5 Ω) are required to suppress oscillation and ensure balanced dynamic current distribution during switching transitions.

Is the exposed thermal pad electrically isolated from other terminals?

No - the exposed pad is internally connected to the drain terminal and must be soldered to a PCB copper area tied to the drain net. Isolating the pad electrically violates the internal construction and compromises thermal performance and reliability. Thermal vias beneath the pad must connect only to drain-copper planes.

Can BSP135L6433HTMA1 be used in linear (analog) regulator applications?

It is not recommended. While the device can operate in the linear region, its Safe Operating Area (SOA) curve shows limited capability above 10 V V_DS at currents >1 A due to second breakdown limitations. For linear regulation, dedicated lateral MOSFETs or bipolar transistors with guaranteed SOA are preferred.

BSP135L6433HTMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: SIPMOS®

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel, Depletion Mode

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 600 V

Current - Continuous Drain (Id) @ 25°C:: 120mA (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 0V, 10V

Rds On (Max) @ Id, Vgs:: 45Ohm @ 120mA, 10V

Vgs(th) (Max) @ Id:: 1V @ 94µA

Gate Charge (Qg) (Max) @ Vgs:: 4.9 nC @ 5 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 146 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.8W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4-21

BSP135L6433HTMA1 FAQ

1.How can I place an order for BSP135L6433HTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP135L6433HTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP135L6433HTMA1 reliable?

The price and inventory of BSP135L6433HTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP135L6433HTMA1 is usually 5 days.

3.What payment methods are accepted for BSP135L6433HTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP135L6433HTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP135L6433HTMA1?

BSP135L6433HTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP135L6433HTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP135L6433HTMA1?

For technical support, including BSP135L6433HTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP135L6433HTMA1 requirements.

6.How does Aetrix verify that BSP135L6433HTMA1 is sourced from the original manufacturer or authorized distributors?

All BSP135L6433HTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP135L6433HTMA1 meets industry standards.

7.What is the process for return or replacement of BSP135L6433HTMA1?

All BSP135L6433HTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP135L6433HTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP135L6433HTMA1 part is unused and in its original packaging.

Return procedure for BSP135L6433HTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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