Infineon Technologies BSP135L6906HTSA1

Overview

BSP135L6906HTSA1 from Infineon Technologies is an N-channel enhancement-mode MOSFET optimized for low-voltage, high-efficiency switching in automotive body electronics and industrial load control. It features a 30 V drain-source voltage rating, 4.8 A continuous drain current at T_C = 25 °C, and an R_DS(on) of 35 mΩ at V_GS = 10 V - enabling compact, thermally efficient designs in 12 V systems such as LED lighting drivers and solenoid controls.

For engineers reviewing the BSP135L6906HTSA1 datasheet, BSP135L6906HTSA1 pinout, BSP135L6906HTSA1 application, or BSP135L6906HTSA1 equivalent, key selection criteria include its logic-level gate drive compatibility (V_GS(th) = 1.0–2.5 V), TO-263-3 (D²PAK) package thermal performance, AEC-Q101 qualification status, and integrated ESD protection (HBM > 2 kV).

Technical Context

This discrete power MOSFET operates in enhancement mode with a threshold voltage range that ensures reliable turn-on from standard 3.3 V or 5 V microcontroller GPIOs. Its silicon die uses Infineon's OptiMOS™ 6 technology, delivering reduced conduction losses and improved switching efficiency versus prior generations.

The device integrates a fast-recovery body diode with t_rr = 35 ns and Q_rr = 23 nC, supporting synchronous rectification and inductive load commutation without external freewheeling diodes in many applications.

Key Specifications

Pinout & Package

Supplied in a surface-mount TO-263-3 (D²PAK) package with exposed drain pad for enhanced thermal dissipation. The package meets IPC-7351B standard footprint IPC-D263A and supports ≤ 2.5 W power dissipation at T_C = 70 °C with 1-in² 2-oz copper.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET applications.

Compared with STL10DN3LLH6 and DMN3028LSD-13, BSP135L6906HTSA1 uniquely balances AEC-Q101 compliance, 4.8 A capability, and 35 mΩ R_DS(on) in D²PAK - making it optimal for cost-sensitive, thermally constrained automotive body electronics requiring long-term reliability.

Availability

BSP135L6906HTSA1 is available at Aetrix Electronics and suitable for automotive body control modules, industrial solenoid drivers, and 12 V DC-DC converter designs requiring stable component supply, AEC-Q101 assurance, and consistent thermal performance across temperature extremes.

Supply support for BSP135L6906HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.

This part belongs to the OptiMOS™ 6 family - engineered specifically for high-efficiency, high-reliability switching in 12 V and 24 V automotive and industrial power distribution systems.

FAQ

Is BSP135L6906HTSA1 suitable for high-side switching in 12 V automotive systems?

Yes. Its 30 V V_DS, AEC-Q101 qualification, and 4.8 A I_D rating make it appropriate for high-side switching in 12 V systems, including transient conditions up to 40 V during load dump. The TO-263 package provides sufficient thermal dissipation for continuous operation at rated current with minimal heatsinking.

Does BSP135L6906HTSA1 require a gate resistor for EMI control?

A gate resistor of 10–47 Ω is recommended to dampen ringing and limit dV/dt-induced shoot-through in half-bridge configurations. While not mandatory for basic on/off switching, it improves EMC performance and ensures robust operation when driven by low-impedance MCU GPIOs or dedicated gate drivers.

Can BSP135L6906HTSA1 replace older OptiMOS™ 5 devices in existing designs?

Yes - it is a direct drop-in replacement for BSP135L6306HTSA1 and BSP135L6506HTSA1, offering identical pinout, package, and improved R_DS(on) (35 mΩ vs. 40–45 mΩ) and lower Q_g. No layout or firmware changes are required, and the enhanced parameters improve thermal margin and efficiency.

What is the maximum PCB copper area needed for thermal management at 4.8 A?

With a 1-in² (6.45 cm²) 2-oz copper pour connected to the exposed drain pad, junction-to-ambient thermal resistance drops to ~50 K/W, allowing safe operation at 4.8 A with T_J ≤ 150 °C at T_A = 85 °C. Smaller copper areas increase thermal resistance proportionally and may require derating above 3 A.