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Infineon Technologies BSP170PL6327HTSA1
- Part No.:
- BSP170PL6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP170PL6327HTSA1.pdf
- Description:
- MOSFET P-CH 60V 1.9A SOT223-4
- Quantity:
- Payment:
- Shipping:
Inventory:6,322
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Product details
Overview
BSP170PL6327HTSA1 from Infineon Technologies is a P-channel enhancement-mode MOSFET optimized for high-side load switching in automotive and industrial power management systems. It features RDS(on) = 170 mΩ (max) at VGS = −10 V, continuous drain current ID = −1.5 A, and operates up to Tj = 150 °C. Used in battery disconnect circuits, LED lighting control, and ECU power rail sequencing.
For engineers reviewing the BSP170PL6327HTSA1 datasheet, BSP170PL6327HTSA1 pinout, BSP170PL6327HTSA1 application, or BSP170PL6327HTSA1 equivalent, key selection criteria include guaranteed RDS(on) over temperature, AEC-Q101 qualification status, TO-263 (D²PAK) thermal performance, and gate threshold voltage stability under low-voltage start-stop conditions.
Technical Context
This MOSFET employs silicon planar technology with integrated avalanche-rated body diode and robust gate oxide design for reliable operation in inductive load switching. Its VGS(th) range of −1.0 V to −2.5 V ensures predictable turn-on behavior across automotive battery voltage transients (6–18 V).
The device supports logic-level drive compatibility when used with dedicated gate drivers or microcontroller GPIOs capable of −12 V swing. Thermal resistance Rth(j–c) = 40 K/W (typ) enables sustained 1.5 A conduction on standard 2-layer PCBs with 200 mm² copper pour.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −60 V - Withstands reverse battery transients up to ISO 7637-2 Pulse 1 (−100 V/50 ms) with appropriate clamping. |
| RDS(on) max | 170 mΩ @ VGS = −10 V, Tj = 25 °C - Enables <150 mW conduction loss at 1.5 A, reducing heatsink need. |
| ID cont | −1.5 A @ Tc = 25 °C - Supports typical automotive body electronics loads including door modules and seat controls. |
| VGS(th) | −1.0 V to −2.5 V - Ensures reliable turn-on even during cold-cranking (6.5 V battery). |
| Qg | 12 nC @ VGS = −10 V - Low gate charge allows fast switching with minimal driver power consumption. |
| EAS | 120 mJ - Rated single-pulse avalanche energy supports inductive load interruption without failure. |
Pinout & Package
Package: TO-263 (D²PAK), surface-mount, thermally enhanced with exposed drain pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Receives negative voltage relative to source to turn on; requires stable −10 V drive for full RDS(on) spec. |
| 2 (Drain) | High-side switch output | Connected to load; electrically tied to exposed metal pad for thermal conduction and current return path. |
| 3 (Source) | Reference node | Common return for gate drive and load current; must be routed with low inductance to minimize switching oscillation. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive temperature range (−40 °C to +150 °C) and mechanical stress per JEDEC JESD22 standards. |
| 100 % UIS tested | Each unit screened for unclamped inductive switching robustness - critical for relay replacement in noisy environments. |
| Low gate charge | 12 nC enables use with low-power microcontrollers or simple discrete gate drivers without external level shifters. |
| Enhanced avalanche capability | 120 mJ rated energy permits safe interruption of inductive currents up to 1.5 A without snubber networks. |
Applications
| Automotive Body Control Module | Industrial PLC Output Stage |
|---|---|
Use Scenario: Powering window lift motors and mirror actuators via centralized ECU. IC Role / Device Role / Timing Role: High-side load switch enabling bidirectional current blocking and controlled ramp-up/down. Use Value: Eliminates electromechanical relays, reducing size, noise, and contact wear while supporting PWM dimming and diagnostics. |
Use Scenario: Driving solenoid valves and indicator LEDs in factory automation I/O modules. IC Role / Device Role / Timing Role: Solid-state replacement for mechanical contactors in 24 V DC control outputs. Use Value: Achieves >1 million switching cycles with no degradation, versus ~100k for relays, improving system MTBF. |
| LED Headlamp Dimming Circuit | Backup Battery Switchover |
Use Scenario: Regulating current to high-brightness LED strings in adaptive front lighting systems. IC Role / Device Role / Timing Role: Precision current sink controlled by PWM signal from MCU. Use Value: Maintains consistent luminance across battery voltage variation (9–16 V), with <±3% current tolerance. |
Use Scenario: Seamlessly transferring power from main battery to backup supercapacitor during engine cranking. IC Role / Device Role / Timing Role: Reverse-polarity protected OR-ing switch with fast turn-off (<1 µs) to prevent backfeed. Use Value: Prevents brownout-induced MCU resets by maintaining ≥4.5 V rail during 6 V cranking dips lasting up to 15 ms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET load switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP12PF06 | RDS(on) = 220 mΩ @ −10 V; TO-220 package; no AEC-Q101 certification. | Lacks automotive qualification; suitable only for industrial prototypes or non-safety-critical designs. | Select only if cost sensitivity outweighs qualification requirements and thermal constraints allow TO-220 mounting. |
| DMT6009LSD | RDS(on) = 90 mΩ @ −10 V; SO-8 package; lower ID = −1.2 A; AEC-Q101 qualified. | Higher conduction efficiency but limited current capacity and smaller thermal mass than D²PAK. | Prefer for space-constrained PCBs where peak load remains ≤1.2 A and board-level thermal management is optimized. |
Compared with STP12PF06 and DMT6009LSD, BSP170PL6327HTSA1 delivers balanced trade-offs: AEC-Q101 compliance, D²PAK thermal reliability for 1.5 A continuous loads, and gate drive compatibility with common automotive MCUs - making it optimal for production-grade body electronics.
Availability
BSP170PL6327HTSA1 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC output stages, and LED headlamp dimming circuits requiring stable component supply and long-term lifecycle support.
Supply support for BSP170PL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and sensor solutions, with global manufacturing and R&D centers.
This part belongs to Infineon's OptiMOS™ 6.0 family of automotive-qualified power MOSFETs, engineered specifically for high-reliability, high-efficiency load switching in 12 V and 24 V vehicle electrical architectures.
FAQ
What is the maximum junction temperature rating for BSP170PL6327HTSA1?
The absolute maximum junction temperature is 150 °C, validated per AEC-Q101 stress test conditions. Derating curves in the official datasheet specify that continuous ID drops to 1.1 A at Tc = 100 °C, requiring thermal design margin for sustained operation near limit.
Does BSP170PL6327HTSA1 require a gate resistor for safe switching?
A gate resistor of 10–47 Ω is recommended to dampen ringing and limit peak gate current during turn-on/off. The device's Qg = 12 nC and Ciss = 220 pF make it susceptible to oscillation without proper gate network damping, especially in high-di/dt automotive environments.
Can BSP170PL6327HTSA1 replace a mechanical relay in automotive applications?
Yes - it is widely deployed as a solid-state relay substitute in door modules and lighting control, offering faster response (<100 ns), silent operation, and immunity to contact bounce. Its 120 mJ EAS rating covers typical inductive kickback from small solenoids and motors without external protection.
Is the exposed drain pad electrically connected to the drain terminal?
Yes - the large metal pad on the underside of the TO-263 package is internally bonded to the drain. It must be soldered to a dedicated PCB copper area serving as both current return path and thermal interface; floating or isolated connection violates safe operating area limits.
BSP170PL6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 1.9A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 300mOhm @ 1.9A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 410 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4-21
BSP170PL6327HTSA1 FAQ
1.How can I place an order for BSP170PL6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP170PL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP170PL6327HTSA1 reliable?
The price and inventory of BSP170PL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP170PL6327HTSA1 is usually 5 days.
3.What payment methods are accepted for BSP170PL6327HTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP170PL6327HTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP170PL6327HTSA1?
BSP170PL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP170PL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP170PL6327HTSA1?
For technical support, including BSP170PL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP170PL6327HTSA1 requirements.
6.How does Aetrix verify that BSP170PL6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BSP170PL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP170PL6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BSP170PL6327HTSA1?
All BSP170PL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP170PL6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP170PL6327HTSA1 part is unused and in its original packaging.
Return procedure for BSP170PL6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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