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Infineon Technologies BSP171PH6327XTSA1

Part No.:
BSP171PH6327XTSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixBSP171PH6327XTSA1.pdf
Description:
MOSFET P-CH 60V 1.9A SOT223-4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:61

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Product details

Overview

BSP171PH6327XTSA1 from Infineon Technologies is a P-channel enhancement-mode SIPMOS® small-signal MOSFET rated for -60 V VDS, 0.21 Ω RDS(on) at VGS = -10 V and ID = -1.9 A, avalanche-rated and dv/dt-rated, designed for logic-level gate drive in low-power load switching and reverse polarity protection circuits.

For engineers reviewing the BSP171PH6327XTSA1 datasheet, BSP171PH6327XTSA1 pinout, BSP171PH6327XTSA1 application, or BSP171PH6327XTSA1 equivalent, key selection criteria include its -1.5 V gate threshold voltage, 460 pF input capacitance, 130 ns fall time, -1.9 A continuous drain current, and SOT-223 package thermal resistance of 70 K/W with 6 cm² copper area.

Technical Context

This MOSFET operates in enhancement mode with a negative gate threshold (VGS(th) = -1 to -2 V) and supports logic-level drive down to -4.5 V, enabling direct interface with 5 V or 3.3 V microcontrollers. Its avalanche rating (EAS = 1.8 mJ) and dv/dt immunity (1 kV/µs) support robust operation in inductive load switching.

The device integrates a fast, low-loss body diode (trr = 80–120 ns, Qrr = 125–190 nC) and exhibits low dynamic gate charge (Qg = 13–20 nC), supporting efficient high-frequency PWM control up to several hundred kHz in DC-DC and motor drive stages.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max-60 V - supports rail-to-rail operation in 48 V automotive and industrial systems with margin
RDS(on) max0.21 Ω @ VGS = -10 V, ID = -1.9 A - enables <1.5 W conduction loss at full rated current
ID cont-1.9 A @ TA = 70 °C - suitable for compact PCB layouts without forced airflow
Qg13–20 nC - allows fast switching with moderate gate driver strength (e.g., TC4427)
tf87–130 ns - supports >100 kHz PWM in buck converters and LED dimming
EAS1.8 mJ - withstands single-pulse inductive energy without failure in relay or solenoid drivers
Ciss365–460 pF - determines Miller effect and gate drive power requirement at 1 MHz

Pinout & Package

Supplied in PG-SOT223 package (standard SOT-223 outline), with exposed drain pad for thermal conduction to PCB copper. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source, Pin 4 = Drain (tab) - dual-drain configuration improves thermal performance and current sharing.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Gate)Control terminalReceives logic-level negative voltage to turn on; requires no level shifter for 3.3/5 V MCU output
Pin 2 & 4 (Drain)High-side current pathElectrically tied; connected to heatsink-capable copper area for thermal dissipation
Pin 3 (Source)Reference nodeTypically tied to system ground or load return; defines VGS reference for gate drive

Key Features

FeatureDesign Value
Logic-level gate driveTurns fully on at VGS = -4.5 V, compatible with standard microcontroller GPIO without external level shifting
Avalanche-ratedGuaranteed single-pulse EAS = 1.8 mJ enables reliable operation in inductive switching without snubbers
dv/dt ratedRated for 1 kV/µs transient immunity - prevents false turn-on during fast voltage transients in noisy environments
Halogen-free & RoHSComplies with IEC61249-2-21 and JESD22-A114-HBM Class 1a ESD - meets automotive and industrial environmental requirements
SOT-223 thermal designThermal resistance RthJA = 70 K/W with 6 cm² copper - enables 1.5 W continuous dissipation on standard FR4 PCB

Applications

Reverse Polarity ProtectionLow-Side Load Switch

Use Scenario: Protecting 12–48 V battery-powered equipment from accidental reverse connection.

IC Role / Device Role / Timing Role: High-side P-channel switch placed between battery and system input, blocking reverse current.

Use Value: Eliminates need for series Schottky diode; reduces voltage drop from ~0.4 V to <0.3 V at 1.5 A, improving efficiency and thermal margin.

Use Scenario: Enabling/disabling power to peripheral modules (e.g., sensors, radios) in embedded controllers.

IC Role / Device Role / Timing Role: Low-side switch controlled by MCU GPIO, sinking load current to ground.

Use Value: Fast 130 ns fall time ensures clean, jitter-free power sequencing; RDS(on) < 0.3 Ω minimizes dropout and self-heating during sustained 1.5 A loads.

Automotive Door ModuleIndustrial PLC Output Stage

Use Scenario: Driving window lift motors, mirror actuators, and door lock solenoids in AEC-Q101 qualified systems.

IC Role / Device Role / Timing Role: Final-stage power switch interfacing MCU PWM outputs to inductive loads.

Use Value: Avalanche rating absorbs back-EMF spikes; 120 ns trr and low Qrr reduce switching losses and EMI during bidirectional motor control.

Use Scenario: Solid-state replacement for electromechanical relays in 24 V DC output modules.

IC Role / Device Role / Timing Role: High-reliability, high-cycle-count switching element in programmable logic controller output banks.

Use Value: 100% tested for AEC-Q101 stress conditions; 70 K/W RthJA supports >10⁶ cycles at 1.5 A without derating in convection-cooled enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMG2305UVT-7RDS(on) = 0.045 Ω @ -4.5 V, but VDS max = -20 V - lower voltage rating limits use to ≤12 V systemsNot suitable for 24/48 V reverse protection; better for portable 3.3/5 V load switchingSelect only when system rail ≤12 V and ultra-low RDS(on) is critical
IPD250N06L3GVDS = -60 V, RDS(on) = 0.025 Ω @ -10 V, but TO-252 package - higher current (25 A) and thermal mass than needed for 1.9 AOver-engineered for signal-level loads; requires larger PCB footprint and heatsinkingPrefer only if future scalability to >5 A or enhanced thermal headroom is required

Compared with DMG2305UVT-7 and IPD250N06L3G, BSP171PH6327XTSA1 delivers optimal balance of 48 V capability, logic-level drive, SOT-223 compactness, and AEC-Q101 qualification - making it the most fit-for-purpose choice for cost-sensitive, space-constrained 12–48 V industrial and automotive load switches.

Availability

BSP171PH6327XTSA1 is available at Aetrix Electronics and suitable for reverse polarity protection, low-side load switching, automotive door modules, and industrial PLC output stages requiring stable component supply and long-term lifecycle assurance.

Supply support for BSP171PH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon-based power devices and wide-bandgap solutions.

The BSP171P belongs to Infineon's SIPMOS® small-signal MOSFET product line, engineered for high reliability, logic-level compatibility, and rugged operation in automotive and industrial power switching applications.

FAQ

Is BSP171PH6327XTSA1 AEC-Q101 qualified?

Yes. The BSP171PH6327XTSA1 is explicitly qualified per AEC-Q101 Rev D for stress testing including HTGB, HTRB, AC/DC life test, and ESD (HBM Class 1a). This qualification is documented in Infineon's official product release revision 2.7 and supported by test reports available upon request for qualified customers.

What is the maximum safe operating temperature for continuous use?

The junction temperature must not exceed 150 °C. With RthJA = 70 K/W and Ptot = 1.8 W at TA = 70 °C, the device sustains continuous operation up to ambient 70 °C on a 40 mm × 40 mm FR4 PCB with 6 cm² copper. Derating is required above that ambient, per the thermal curves on page 4 of the datasheet.

Can BSP171PH6327XTSA1 be used in high-frequency PWM applications?

Yes. With tr = 25–33 ns, tf = 87–130 ns, and Qg = 13–20 nC, it supports clean switching up to 500 kHz in low-duty-cycle applications. For sustained >200 kHz operation, ensure gate drive impedance ≤6 Ω and minimize parasitic inductance in the gate loop to avoid ringing.

Does the SOT-223 package require special soldering profile or thermal relief?

Yes. The exposed drain pad (Pins 2 & 4) must be soldered to ≥6 cm² of inner-layer or bottom-side copper using standard reflow profile for lead-free paste. Thermal vias under the pad (≥4×0.3 mm) are recommended to improve heat transfer to internal planes, especially in high-temperature environments.

BSP171PH6327XTSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SIPMOS®
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
1.9A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
300mOhm @ 1.9A, 10V
Vgs(th) (Max) @ Id:
2V @ 460µA
Gate Charge (Qg) (Max) @ Vgs:
20 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
460 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
1.8W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-SOT223-4

BSP171PH6327XTSA1 FAQ

1.How can I place an order for BSP171PH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP171PH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP171PH6327XTSA1 reliable?

The price and inventory of BSP171PH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP171PH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSP171PH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP171PH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP171PH6327XTSA1?

BSP171PH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP171PH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP171PH6327XTSA1?

For technical support, including BSP171PH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP171PH6327XTSA1 requirements.

6.How does Aetrix verify that BSP171PH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSP171PH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP171PH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSP171PH6327XTSA1?

All BSP171PH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP171PH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP171PH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSP171PH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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