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Infineon Technologies BSP171PL6327HTSA1

Part No.:
BSP171PL6327HTSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixBSP171PL6327HTSA1.pdf
Description:
MOSFET P-CH 60V 1.9A SOT223-4
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,729

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Product details

Overview

BSP171PL6327HTSA1 from Infineon Technologies is a P-channel enhancement-mode SIPMOS® small-signal MOSFET rated for −60 V VDS, 0.21 Ω RDS(on) at VGS = −10 V and ID = −1.9 A, avalanche- and dv/dt-rated, and qualified to AEC-Q101 for automotive use. It operates in logic-level gate drive systems and serves as a high-reliability load switch in 12 V automotive body electronics.

For engineers reviewing the BSP171PL6327HTSA1 datasheet, BSP171PL6327HTSA1 pinout, BSP171PL6327HTSA1 application, or BSP171PL6327HTSA1 equivalent, key selection criteria include its −1.5 V gate threshold voltage, 1.4–2.7 S transconductance, −1.9 A continuous drain current, SOT-223 thermal performance (RthJA = 70 K/W with 6 cm² copper), and integrated avalanche energy rating of 1.8 mJ.

Technical Context

This device implements a trench-based P-channel MOSFET structure optimized for low gate charge (Qg = −13 to −20 nC) and fast switching (tr = 25–33 ns, tf = 87–130 ns), enabling efficient operation in PWM-controlled DC loads. Its −1.5 V typical VGS(th) ensures reliable turn-on with standard 3.3 V or 5 V logic outputs without level-shifting.

The integrated body diode exhibits trr = 80–120 ns and Qrr = −125 to −190 nC, supporting synchronous rectification and flyback recovery in compact power stages. Thermal design leverages the SOT-223 package's 25 K/W RthJS to soldering point for direct PCB heat transfer.

Key Specifications

ParameterValue and Actual Design Meaning
VDS−60 V - supports 24 V automotive systems with 2× safety margin against load-dump transients
RDS(on) max0.21 Ω @ VGS = −10 V, ID = −1.9 A - enables <150 mW conduction loss at rated current
VGS(th)−1.5 V typ - compatible with 3.3 V microcontroller GPIO without external driver
Qg−13 to −20 nC - reduces gate-drive power and enables >100 kHz switching in space-constrained designs
EAS1.8 mJ - withstands single-pulse inductive energy without failure in relay or solenoid drive
tr/tf25–33 ns / 87–130 ns - minimizes switching losses in high-frequency DC-DC and LED dimming
RthJA70 K/W (6 cm² copper) - allows 1.5 W dissipation at TA = 85 °C in standard FR4 layout

Pinout & Package

Supplied in PG-SOT223 (SOT-223) package with exposed drain pad for thermal conduction. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source, Pin 4 = Drain (tab). Mounting requires soldering the tab to ≥6 cm² copper area on one PCB layer.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (G)GateLogic-level input controlling channel conduction; accepts −10 V max gate-source voltage
Pin 2 (D)Drain (tab)Main high-side or low-side power path terminal; electrically and thermally connected to exposed metal tab
Pin 3 (S)SourceReference node for gate drive and current return; tied to system ground in high-side switch configurations
Pin 4 (D)Drain (second connection)Redundant drain terminal enhancing current capacity and thermal coupling to PCB copper

Key Features

FeatureDesign Value
Avalanche-rated operationWithstands 1.8 mJ single-pulse inductive energy without degradation-critical for solenoid/relay driving
dv/dt ruggednessRated to 1 kV/µs under specified conditions-prevents false turn-on during high-noise transients
AEC-Q101 qualificationValidated for automotive temperature range (−55 °C to +150 °C) and reliability stress testing
Halogen-free & RoHS-compliantMeets IEC61249-2-21 and EU RoHS Directive-enables compliance in Tier-1 automotive supply chains
Logic-level gate driveVGS(th) = −1.5 V typ enables direct interface with 3.3 V/5 V MCUs-eliminates gate driver IC cost and footprint

Applications

Automotive Door ModuleLED Headlamp Dimming

Use Scenario: Controlling window lift motors and mirror actuators in centralized door ECUs.

IC Role / Device Role / Timing Role: High-side load switch managing 12 V DC loads up to 1.9 A with reverse-battery protection.

Use Value: −60 V VDS rating and AEC-Q101 qualification ensure robustness against load dump and cold-crank conditions.

Use Scenario: PWM dimming of high-brightness LED arrays in adaptive front-lighting systems.

IC Role / Device Role / Timing Role: Low-side switching element operating at 1–5 kHz with fast tf ≤130 ns to minimize current tailing.

Use Value: 0.21 Ω RDS(on) limits conduction loss to <150 mW, reducing thermal load on compact headlamp PCBs.

Body Control Unit (BCU)Smart Rearview Mirror Heater

Use Scenario: Power distribution to interior lighting, seat controls, and HVAC actuators.

IC Role / Device Role / Timing Role: Logic-level P-channel switch enabling hot-swap capability and short-circuit protection via current sensing.

Use Value: −1.5 V VGS(th) allows direct MCU control, while Qg ≤20 nC supports rapid fault shutdown response.

Use Scenario: On-demand heating of electrochromic rearview mirrors in sub-zero ambient conditions.

IC Role / Device Role / Timing Role: Medium-power resistive load switch delivering up to 1.9 A continuously with thermal derating.

Use Value: RthJA = 70 K/W with minimal copper enables full-rated current in space-limited mirror housing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMG2305UX-13RDS(on) = 0.045 Ω @ −4.5 V (lower), but VDS = −20 V onlyNot suitable for 24 V systems or load-dump immunitySelect only for 3.3/5 V low-voltage logic-switching where voltage margin is not required
IPD250N06L3GVDS = −60 V, RDS(on) = 0.0025 Ω, but SOT-223 not offered-available only in TO-252Requires PCB redesign due to larger footprint and different thermal mountingChoose when higher current (>10 A) and lower RDS(on) justify package change and layout rework

Compared with DMG2305UX-13 and IPD250N06L3G, BSP171PL6327HTSA1 uniquely balances −60 V rating, logic-level gate, SOT-223 form factor, and AEC-Q101 qualification-making it optimal for space- and reliability-constrained 12/24 V automotive switches where drop-in replacement and qualification traceability are mandatory.

Availability

BSP171PL6327HTSA1 is available at Aetrix Electronics and suitable for automotive door modules, LED headlamp dimming circuits, and body control units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BSP171PL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification infrastructure.

This device belongs to Infineon's SIPMOS® small-signal MOSFET product line, engineered specifically for high-reliability, logic-compatible switching in automotive body electronics and industrial control applications.

FAQ

Is BSP171PL6327HTSA1 suitable for high-side switching in 24 V automotive systems?

Yes. With −60 V VDS rating, AEC-Q101 qualification, and −1.5 V VGS(th), it supports 24 V nominal systems including load-dump transients up to ±60 V. Its SOT-223 drain-tab configuration enables robust high-side implementation when source is tied to battery rail and gate driven relative to source.

What is the maximum continuous drain current at 105 °C ambient temperature?

At TA = 105 °C with 6 cm² copper cooling, the device delivers −1.1 A continuous drain current. This is derived from the derating curve on page 4 of the datasheet: Ptot drops to ~0.8 W at 105 °C, and with RDS(on) ≈ 0.25 Ω at elevated temperature, ID = √(P/R) ≈ √(0.8/0.25) ≈ 1.1 A.

Does BSP171PL6327HTSA1 include an integrated ESD protection diode?

No. It carries JESD22-A114-HBM Class 1a ESD rating (≥250 V), but no dedicated on-chip ESD protection diode is implemented. External TVS or RC filtering is recommended for gate protection in noisy automotive environments per application note AN2015-05.

Can this MOSFET replace BSP170P in existing designs?

Yes, with verification. BSP171P offers identical SOT-223 package, −60 V rating, and improved RDS(on) (0.21 Ω vs. 0.25 Ω) and lower Qg. Layout is pin-compatible, but gate threshold is slightly tighter (−1.5 V vs. −1.7 V), requiring validation of MCU drive strength and noise margin in high-temperature operation.

BSP171PL6327HTSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SIPMOS®
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
1.9A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
300mOhm @ 1.9A, 10V
Vgs(th) (Max) @ Id:
2V @ 460µA
Gate Charge (Qg) (Max) @ Vgs:
20 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
460 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
1.8W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-SOT223-4-21

BSP171PL6327HTSA1 FAQ

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Please submit a Request for Quotation (RFQ) for BSP171PL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of BSP171PL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP171PL6327HTSA1 is usually 5 days.

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6.How does Aetrix verify that BSP171PL6327HTSA1 is sourced from the original manufacturer or authorized distributors?

All BSP171PL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP171PL6327HTSA1 meets industry standards.

7.What is the process for return or replacement of BSP171PL6327HTSA1?

All BSP171PL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP171PL6327HTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP171PL6327HTSA1 part is unused and in its original packaging.

Return procedure for BSP171PL6327HTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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