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Infineon Technologies BSP295E6327T
- Part No.:
- BSP295E6327T
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP295E6327T.pdf
- Description:
- MOSFET N-CH 60V 1.8A SOT223-4
- Quantity:
- Payment:
- Shipping:
Inventory:7,254
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Product details
Overview
BSP295E6327T from Infineon Technologies is an N-channel enhancement-mode SIPMOS™ small-signal MOSFET in PG-SOT223 package, rated for 60 V VDS, 1.8 A continuous drain current at 25°C, and 0.3 Ω max RDS(on) at VGS = 10 V. It features dv/dt ruggedness (6 kV/µs), integrated body diode with 1.8 A forward current capability, and AEC-Q101 qualification for automotive-grade reliability.
For engineers reviewing the BSP295E6327T datasheet, BSP295E6327T pinout, BSP295E6327T application, or BSP295E6327T equivalent, key selection criteria include its SOT223 thermal performance (RthJA = 48–115 K/W), gate threshold voltage range (0.8–1.8 V), and robust avalanche energy rating (up to 60 mJ at Tj = 25°C).
Technical Context
This discrete power MOSFET operates in enhancement mode with a low-voltage logic-level gate drive compatibility (VGS(th) typ. 1.1 V). Its dv/dt rating ensures immunity against parasitic turn-on in inductive switching circuits, while the integrated body diode supports freewheeling in DC-DC converters and motor drivers.
The device uses Infineon's SIPMOS™ process for optimized RDS(on) × Qg trade-off (17 nC total gate charge), enabling efficient 4.5 V–10 V gate drive operation in space-constrained SMD applications requiring stable on-resistance up to 150°C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Max | 60 V - supports 24 V and 48 V nominal bus systems with margin for transients |
| RDS(on) Max | 0.3 Ω @ VGS = 10 V - enables <1.0 W conduction loss at 1.8 A DC load |
| ID Cont. (TA=25°C) | 1.8 A - suitable for low-power load switches and LED drivers on standard FR4 PCBs |
| dv/dt Rating | 6 kV/µs - prevents false triggering in high-di/dt environments like solenoid control |
| VGS(th) Range | 0.8–1.8 V - ensures reliable turn-on with 3.3 V or 5 V microcontroller GPIO |
| Qg Total | 14–17 nC - balances switching speed and gate driver stress in 100–500 kHz SMPS |
| Tj Range | −55°C to +150°C - qualified for under-hood automotive and industrial ambient conditions |
Pinout & Package
Package: PG-SOT223 (standard SOT-223 outline, 4-pin variant with exposed drain pad; pin 1 = Gate, pin 2 = Drain, pin 3 = Source, pin 4 = Drain - thermally enhanced dual-drain configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate (G) | Control terminal; accepts logic-level voltage; requires ≤20 V absolute max rating |
| Pin 2 | Drain (D) | Main current output path; electrically and thermally connected to exposed pad |
| Pin 3 | Source (S) | Reference node for gate drive; tied to system ground in low-side switch topology |
| Pin 4 | Drain (D) | Secondary drain connection; improves thermal dissipation and current sharing in parallel layout |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 Qualified | Validated for automotive electronics per stress test requirements (HTOL, TC, HTRB) |
| dv/dt Ruggedness | 6 kV/µs - eliminates need for external snubbers in relay replacement circuits |
| Logic-Level Gate Drive | VGS(th) max 1.8 V - directly drivable by 3.3 V MCU outputs without level-shifting |
| Halogen-Free & RoHS | Compliant with IEC61249-2-21 and EU Directive 2011/65/EU |
| Thermal Performance | RthJS typ. 15 K/W - enables >1.2 W power dissipation with minimal heatsinking on 6 cm² copper |
Applications
| Automotive Door Module | Industrial PLC Output Stage |
|---|---|
Use Scenario: Driving 12 V window lift motors and mirror actuators in centralized door control units. IC Role / Device Role / Timing Role: Low-side load switch with integrated body diode for inductive kickback suppression. Use Value: Eliminates external flyback diode; AEC-Q101 qualification ensures 15-year field reliability in vibration-prone environments. | Use Scenario: Solid-state replacement of electromechanical relays in 24 V DC digital output modules. IC Role / Device Role / Timing Role: High-reliability power switch handling 1.5 A resistive/inductive loads with fast turn-off (<41 ns fall time). Use Value: Enables >10 million switching cycles vs. ~100k for mechanical relays; reduces maintenance in factory automation. |
| LED Lighting Driver | USB-C Power Delivery Load Switch |
Use Scenario: Constant-current dimming control for 24 V architectural LED strips in commercial buildings. IC Role / Device Role / Timing Role: PWM-controlled current sink with low RDS(on) to minimize thermal derating at 1.8 A peak. Use Value: Maintains <0.5 W conduction loss at full load, allowing compact 2-layer PCB design without forced air cooling. | Use Scenario: Inrush current limiting and fault isolation in USB-C PD 3.0 source port controllers. IC Role / Device Role / Timing Role: Fast-acting overcurrent protection switch with 36 ns reverse recovery time for clean hot-swap behavior. Use Value: Prevents bus collapse during cable insertion; supports 5–20 V input range with single-device footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP1NK60ZFP | 600 V VDS, 1 A ID, TO-92 package, higher RDS(on) (7 Ω) | Designed for HV flyback snubbing, not low-voltage logic-level switching | Not suitable for 3.3 V gate drive or 1.8 A continuous loads |
| DMN3025LSD-13 | 30 V VDS, 4.5 A ID, SO-8 package, lower RDS(on) (25 mΩ) | Optimized for 5 V USB power rails; lacks dv/dt rating and AEC-Q101 | Preferred for consumer USB-PD but unsuitable for automotive transients or 48 V systems |
Compared with STP1NK60ZFP and DMN3025LSD-13, BSP295E6327T uniquely combines 60 V rating, logic-level gate, AEC-Q101 qualification, and dv/dt ruggedness in SOT223 - making it the only viable option for cost-sensitive, thermally constrained automotive body electronics.
Availability
BSP295E6327T is available at Aetrix Electronics and suitable for automotive door modules, industrial PLC output stages, LED lighting drivers, and USB-C power delivery load switches requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BSP295E6327T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949.
The BSP295 belongs to Infineon's SIPMOS™ small-signal MOSFET product line, engineered for high-reliability, low-voltage switching in automotive body electronics and industrial control where logic-level drive, thermal efficiency, and transient robustness are critical.
FAQ
Is BSP295E6327T pin-compatible with standard SOT-223 N-channel MOSFETs?
No - BSP295E6327T uses a 4-pin PG-SOT223 variant with dual drain terminals (pins 2 and 4), unlike conventional 3-pin SOT-223 packages. PCB layout must allocate separate pads for both drain connections to achieve specified thermal resistance and current rating.
What is the maximum safe operating frequency when using BSP295E6327T in PWM motor control?
Based on its 8.1 ns max turn-off delay and 28 ns max fall time, BSP295E6327T supports PWM frequencies up to 500 kHz with appropriate gate drive strength (≤15 Ω series resistance) and layout optimization to minimize parasitic inductance in the gate loop.
Does the integrated body diode support synchronous rectification in buck converters?
No - the body diode has 36–45 ns reverse recovery time and 38–48 nC Qrr, making it unsuitable for high-frequency synchronous rectification. It is designed for freewheeling and clamping, not active rectification; external Schottky diodes or dedicated sync-FETs are recommended for >100 kHz buck topologies.
Can BSP295E6327T be used in linear regulator pass transistor applications?
Not recommended - its Safe Operating Area (SOA) curve shows limited DC capability above 5 V VDS, and RDS(on) increases significantly with junction temperature. Designed for switching operation only; linear use risks thermal runaway due to positive temperature coefficient of on-resistance.
BSP295E6327T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 1.8A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 300mOhm @ 1.8A, 10V
- Vgs(th) (Max) @ Id:
- 1.8V @ 400µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 368 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4
BSP295E6327T FAQ
1.How can I place an order for BSP295E6327T through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP295E6327T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP295E6327T reliable?
The price and inventory of BSP295E6327T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP295E6327T is usually 5 days.
3.What payment methods are accepted for BSP295E6327T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP295E6327T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP295E6327T?
BSP295E6327T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP295E6327T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP295E6327T?
For technical support, including BSP295E6327T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP295E6327T requirements.
6.How does Aetrix verify that BSP295E6327T is sourced from the original manufacturer or authorized distributors?
All BSP295E6327T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP295E6327T meets industry standards.
7.What is the process for return or replacement of BSP295E6327T?
All BSP295E6327T units undergo pre-shipment inspection (PSI). If there is an issue with BSP295E6327T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP295E6327T part is unused and in its original packaging.
Return procedure for BSP295E6327T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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