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Infineon Technologies BSP300 E6327
- Part No.:
- BSP300 E6327
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP300 E6327.pdf
- Description:
- MOSFET N-CH 800V 190MA SOT223-4
- Quantity:
- Payment:
- Shipping:
Inventory:2,179
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Product details
Overview
BSP300 E6327 from Infineon Technologies is an N-channel enhancement-mode SIPMOS® small-signal power MOSFET rated for 800 V drain-source voltage, 0.19 A continuous drain current, and 20 Ω RDS(on) at VGS = 10 V. It features avalanche energy rating (36 mJ), ±20 V gate-source voltage tolerance, and operates from –55 °C to +150 °C - used in high-voltage flyback snubber circuits and offline AC-DC auxiliary supplies.
For engineers reviewing the BSP300 E6327 datasheet, BSP300 E6327 pinout, BSP300 E6327 application, or BSP300 E6327 equivalent, key selection criteria include its 800 V V(BR)DSS, 2.0–4.0 V gate threshold, 1.8 W power dissipation at 25 °C, and PG-SOT223 package thermal performance with RthJA ≤ 70 K/W.
Technical Context
This device is a single N-channel silicon-based power MOSFET optimized for high-voltage switching in low-power, high-reliability applications. Its avalanche-rated construction supports unclamped inductive switching, and its gate threshold (2.0–4.0 V) enables direct drive from standard logic-level controllers without level-shifting.
The PG-SOT223 package provides enhanced thermal coupling via the exposed drain pad, supporting 1.8 W dissipation at 25 °C ambient. Dynamic parameters - including Ciss = 170–230 pF, tr = 16–24 ns, and Qrr = 0.25 µC - reflect fast switching capability suitable for <100 kHz SMPS topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 800 V - withstands full mains-related transients in 230 VAC systems without breakdown |
| RDS(on) | 20 Ω max at VGS = 10 V - defines conduction loss in low-current auxiliary rails (e.g., bias windings) |
| ID | 0.19 A continuous - supports up to ~1.5 W output in self-biased flyback snubbers |
| EAS | 36 mJ single-pulse - enables robust operation under inductive turn-off stress without external clamping |
| VGS(th) | 2.0–4.0 V - ensures reliable turn-on with 3.3 V or 5 V microcontroller GPIO or optocoupler outputs |
| Ciss | 170–230 pF - impacts gate drive strength requirement and switching speed in low-frequency converters |
| RthJA | ≤ 70 K/W - requires ≥6 cm² copper pour on PCB for thermal compliance at full load |
Pinout & Package
Package: PG-SOT223 (TO-261AA), surface-mount, with Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source, Pin 4 = Drain (dual-drain configuration for improved thermal and current handling).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Control terminal; accepts logic-level input; requires ≤20 V absolute max rating |
| Pin 2 | Drain | Main high-side current path; electrically connected to exposed metal tab for thermal conduction |
| Pin 3 | Source | Reference node for gate drive; tied to local ground or return path in flyback/auxiliary circuits |
| Pin 4 | Drain | Second drain connection - paralleled internally with Pin 2 to reduce package inductance and improve thermal spreading |
Key Features
| Feature | Design Value |
|---|---|
| Avalanche energy rating | 36 mJ single-pulse - eliminates need for external RCD clamp in many low-power flyback designs |
| High V(BR)DSS | 800 V - supports universal input (85–265 VAC) offline converters without derating |
| RoHS-compliant & AEC-Q101 qualified | Qualified for automotive-grade reliability - validated for temperature cycling, HBM ESD (Class 1a), and humidity exposure |
| Low gate charge | Ciss = 170–230 pF - reduces gate driver power loss and simplifies drive circuit design |
| Thermally enhanced SOT223 | Dual-drain PG-SOT223 package - improves junction-to-ambient thermal resistance by ~15% vs. standard SOT223 |
Applications
| AC-DC Auxiliary Power Supply | Flyback Snubber Switch |
|---|---|
Use Scenario: Provides isolated bias voltage for PWM controller ICs in offline flyback converters operating across 85–265 VAC input. IC Role / Device Role / Timing Role: High-side switch in auxiliary winding rectification path; conducts during transformer reset phase. Use Value: 800 V rating avoids overvoltage failure during line surges; 36 mJ EAS absorbs leakage inductance energy without external components. | Use Scenario: Replaces passive RCD snubber in low-power flyback designs to reduce losses and improve efficiency. IC Role / Device Role / Timing Role: Active clamp switch synchronized with main power MOSFET; turns on during primary-side voltage reversal. Use Value: Dual-drain PG-SOT223 lowers thermal resistance, enabling sustained 0.19 A conduction at elevated ambient temperatures. |
| Industrial Sensor Interface Protection | Automotive HVAC Blower Control |
Use Scenario: Protects 24 V sensor signal lines against induced transients in factory automation cabinets. IC Role / Device Role / Timing Role: High-voltage transient suppressor placed between field wiring and analog front-end. Use Value: Avalanche-rated structure safely clamps >600 V spikes without degradation; VGS(th) range ensures compatibility with 3.3 V microcontroller enable signals. | Use Scenario: Controls low-current blower motor feedback or status LED in automotive HVAC modules. IC Role / Device Role / Timing Role: Low-duty-cycle switching element for indicator loads requiring AEC-Q101 qualification. Use Value: AEC-Q101 qualification and –55 °C to +150 °C operation ensure reliability in under-dash environments with wide thermal excursions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP3NK80ZFP | 800 V, 3 A, 4.5 Ω RDS(on), TO-220FP package - higher current, lower RDS(on), larger footprint | Designed for main power switching, not auxiliary/signal-level use | Select when higher current (>0.5 A) and lower conduction loss are required; not drop-in due to package and drive requirements |
| IRFRC20 | 600 V, 0.24 A, 22 Ω RDS(on), TO-92 - lower voltage rating, same current class, smaller package | Limited to 115 VAC-only systems; lacks avalanche rating and AEC-Q101 qualification | Acceptable only in cost-sensitive, non-automotive, low-line applications where 600 V margin suffices |
Compared with STP3NK80ZFP and IRFRC20, the BSP300 E6327 uniquely balances 800 V capability, AEC-Q101 qualification, and SOT223 thermal performance for space-constrained auxiliary and protection roles - neither alternative matches its combination of voltage, qualification, and package size.
Availability
BSP300 E6327 is available at Aetrix Electronics and suitable for AC-DC auxiliary power supplies, flyback snubber circuits, industrial sensor interface protection, and automotive HVAC blower control requiring stable component supply and long-term lifecycle support.
Supply support for BSP300 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
The BSP300 belongs to Infineon's SIPMOS® small-signal MOSFET product line, designed specifically for high-voltage, low-current switching in auxiliary, protection, and interface applications where reliability and compact packaging are critical.
FAQ
Is BSP300 E6327 suitable for 230 VAC primary-side switching?
No - while its 800 V V(BR)DSS exceeds peak line voltage (~325 V), its 0.19 A ID and 20 Ω RDS(on) limit it to auxiliary or snubber roles, not main power switching. It is intended for bias supplies, clamps, and protection-not primary FET replacement.
What is the maximum gate resistor value for reliable switching at 50 kHz?
Based on Ciss = 230 pF max and typical gate drive rise time targets, a 100 Ω series gate resistor achieves <20 ns edge times with 5 V logic drivers. Values above 470 Ω risk excessive switching loss and thermal stress due to prolonged linear region conduction.
Does BSP300 E6327 include an integrated body diode?
Yes - it contains a monolithic parasitic body diode with VSD = 1.0–1.4 V at 0.38 A and trr = 95 ns. This diode is rated for 0.19 A continuous forward current and supports freewheeling in flyback and snubber configurations.
Can BSP300 E6327 be used in place of a Zener diode for overvoltage clamping?
No - it is not a voltage-reference device. Its avalanche rating allows safe energy absorption during transient overvoltage events, but it does not regulate or clamp at a fixed voltage like a Zener. Clamping voltage depends on current, temperature, and layout - not specified as a regulation parameter.
BSP300 E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 800 V
- Current - Continuous Drain (Id) @ 25°C:
- 190mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 20Ohm @ 190mA, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 230 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4-21
BSP300 E6327 FAQ
1.How can I place an order for BSP300 E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP300 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP300 E6327 reliable?
The price and inventory of BSP300 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP300 E6327 is usually 5 days.
3.What payment methods are accepted for BSP300 E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP300 E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP300 E6327?
BSP300 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP300 E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP300 E6327?
For technical support, including BSP300 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP300 E6327 requirements.
6.How does Aetrix verify that BSP300 E6327 is sourced from the original manufacturer or authorized distributors?
All BSP300 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP300 E6327 meets industry standards.
7.What is the process for return or replacement of BSP300 E6327?
All BSP300 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BSP300 E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP300 E6327 part is unused and in its original packaging.
Return procedure for BSP300 E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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