Infineon Technologies BSP315PL6327HTSA1

Overview

BSP315PL6327HTSA1 from Infineon Technologies is a P-channel enhancement-mode SIPMOS™ small-signal MOSFET in SOT-223 package, rated for −60 V drain-source voltage, 0.8 Ω R_DS(on) at V_GS = −4.5 V, and −1.17 A continuous drain current. It features logic-level gate drive, avalanche rating (24 mJ single-pulse), and dv/dt ruggedness-used in low-power DC-DC load switching and reverse polarity protection circuits.

For engineers reviewing the BSP315PL6327HTSA1 datasheet, BSP315PL6327HTSA1 pinout, BSP315PL6327HTSA1 application, or BSP315PL6327HTSA1 equivalent, key selection criteria include verified −60 V V_BS rating, guaranteed R_DS(on) ≤ 0.8 Ω at −4.5 V gate drive, SOT-223 thermal performance with R_thJA = 70 K/W (6 cm² copper), and integrated body diode with t_rr ≤ 46 ns and Q_rr ≤ 54 µC.

Technical Context

This device operates as a normally-off P-channel switch requiring negative gate-to-source bias to conduct. Its threshold voltage (V_GS(th)) ranges from −1.0 V to −2.0 V at T_j = 25 °C, enabling direct interface with 3.3 V/5 V logic controllers via level-shifting or open-drain drivers. The MOSFET supports fast switching with t_d(on) = 24 ns, t_r = 9 ns, and Q_g = 5.2 nC (V_GS = 0 to −10 V).

Thermal design relies on Pin 4 (drain) soldered to ≥6 cm² PCB copper area, delivering R_thJA = 70 K/W under natural convection. Avalanche capability is validated at I_D = −1.17 A, V_DD = −25 V, R_GS = 25 Ω, ensuring robustness against inductive turn-off transients in relay drivers and motor control interfaces.

Key Specifications

Pinout & Package

SOT-223 package with exposed drain pad (Pin 4) for thermal conduction and mechanical anchoring. Standard 4-pin configuration: Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source, Pin 4 = Drain (solderable thermal pad). Mounting requires full-surface soldering of Pin 4 to ≥6 cm² copper pour.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET applications.

Compared with DMG2305UVT-7 and SI2301DDS-T1-GE3, BSP315PL6327HTSA1 uniquely balances −60 V rating, SOT-223 thermal capability, and logic-level drive-making it optimal for industrial 24 V load switching where reliability under avalanche stress and board-level heat spreading are mandatory.

Availability

BSP315PL6327HTSA1 is available at Aetrix Electronics and suitable for reverse polarity protection, low-side load switching, DC-DC synchronous rectification, and relay driver circuits requiring stable component supply across automotive aftermarket, industrial control, and IoT edge devices.

Supply support for BSP315PL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

This part belongs to the SIPMOS™ small-signal transistor product line, engineered for high-reliability, logic-compatible P-channel switching in thermally demanding environments such as automotive body electronics and programmable logic controllers.

FAQ

Is BSP315PL6327HTSA1 suitable for high-side switching with 3.3 V microcontroller GPIO?

Yes. With V_GS(th) between −1.0 V and −2.0 V and full enhancement at −4.5 V, it can be driven directly using a 3.3 V GPIO through an inverting level shifter or open-drain buffer. A 10 kΩ pull-up to −12 V and 10 kΩ gate resistor ensure reliable turn-on while limiting capacitive current surge.

What is the maximum allowable PCB copper area for Pin 4 to achieve R_thJA = 70 K/W?

The datasheet specifies R_thJA = 70 K/W is achieved with a 40 mm × 40 mm × 1.5 mm FR4 PCB featuring exactly 6 cm² of 70 µm-thick copper on one layer connected to Pin 4. Reducing copper area increases R_thJA linearly; doubling copper to 12 cm² improves it to ~55 K/W under identical test conditions.

Does the body diode support continuous conduction in buck converter applications?

No. The body diode is rated for −1.17 A continuous forward current (I_S) only at T_A = 25 °C. In buck converters, it conducts only during dead time; sustained conduction causes junction overheating. For continuous freewheeling, use external Schottky diodes or synchronous gate timing that avoids body diode conduction.

Can BSP315PL6327HTSA1 replace BSP315P in existing designs?

Yes-BSP315PL6327HTSA1 is the tape-and-reel packaged variant of BSP315P, sharing identical electrical, thermal, and mechanical specifications. The "L6327" suffix denotes reel packaging per JEDEC standard, and "HTSA1" indicates Infineon's standard RoHS-compliant SOT-223 assembly. No layout or firmware changes are required.