Infineon Technologies BSP316PL6327HTSA1
- Part No.:
- BSP316PL6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP316PL6327HTSA1.pdf
- Description:
- MOSFET P-CH 100V 680MA SOT223-4
- Quantity:
- Payment:

- Shipping:

Inventory:7,451
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Product details
Overview
BSP316PL6327HTSA1 from Infineon Technologies is a P-channel enhancement-mode logic-level SIPMOS™ small-signal MOSFET rated for -100 V drain-source voltage, 1.8 Ω RDS(on) at -10 V VGS, and -0.68 A continuous drain current. It features dv/dt ruggedness up to 6 kV/µs and operates across -55 °C to +150 °C, commonly used in low-power DC-DC load switching and reverse polarity protection circuits.
For engineers reviewing the BSP316PL6327HTSA1 datasheet, BSP316PL6327HTSA1 pinout, BSP316PL6327HTSA1 application, or BSP316PL6327HTSA1 equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = -1.0 to -2.0 V), thermal resistance (RthJA = 48–115 K/W depending on PCB layout), and integrated body diode performance (VSD ≤ 1.2 V at -0.68 A).
Technical Context
This device implements a planar SIPMOS structure optimized for low-voltage gate drive and robust transient immunity. Its -1.5 V typical gate threshold enables direct interfacing with 3.3 V and 5 V microcontroller outputs without level-shifting, while the dv/dt rating of 6 kV/µs ensures reliable operation in inductive load switching environments.
The SOT-223-4 package integrates dual drain pins (pins 2 and 4) for enhanced thermal conduction and current handling, with the source (pin 3) and gate (pin 1) configured for standard high-side or low-side switching topologies. Dynamic parameters-including 117 pF input capacitance and 4.7 ns turn-on delay-support stable operation up to several hundred kHz in PWM-controlled power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -100 V - supports industrial 24 V and 48 V bus systems with margin against transients |
| RDS(on) @ VGS = -10 V | 1.4–1.8 Ω - enables <1.2 W conduction loss at -0.68 A, suitable for thermally constrained PCBs |
| ID (continuous) | -0.68 A @ TA = 25 °C - defines maximum steady-state load current under natural convection |
| VGS(th) | -1.0 to -2.0 V - ensures full enhancement with 3.3 V logic-level drivers |
| dv/dt rating | 6 kV/µs - prevents false turn-on during fast voltage transients in motor or relay drive circuits |
| Ptot | 1.8 W @ TA = 25 °C - sets thermal design boundary for SOT-223 footprint with 6 cm² copper area |
| Ciss | 117–146 pF - determines gate drive strength requirement and switching speed trade-off |
Pinout & Package
Packaged in P-SOT223-4-1 (SOT-223 variant with 4 terminals), this MOSFET uses a surface-mount plastic package with exposed drain pad for thermal dissipation. Pin 1 is Gate, Pins 2 & 4 are Drain (internally connected), and Pin 3 is Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Logic-level control input; requires no external level shifter for 3.3 V/5 V MCU output |
| Pins 2 & 4 | Drain | Internally tied drain terminals; both must be soldered to PCB copper pour for optimal thermal and current performance |
| Pin 3 | Source | Reference node for gate drive; connects to system ground or load return path in low-side configuration |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) down to -1.0 V enables direct interface with 3.3 V microcontrollers without gate driver ICs |
| dv/dt ruggedness | 6 kV/µs rating eliminates need for external snubbers in inductive load switching applications |
| Dual drain terminals | Pins 2 and 4 reduce effective thermal resistance by ~30% versus single-drain SOT-223 variants |
| Integrated body diode | VSD ≤ 1.2 V at -0.68 A supports freewheeling in buck or reverse-battery protection circuits |
Applications
| Reverse Polarity Protection | Low-Voltage Load Switch |
|---|---|
Use Scenario: Protects 12 V automotive ECUs from damage due to incorrect battery connection. IC Role / Device Role / Timing Role: High-side P-channel switch controlling power rail entry; activated only when VIN polarity is correct. Use Value: Eliminates need for series Schottky diode, reducing voltage drop from ~0.4 V to <0.1 V at rated current. | Use Scenario: Enables/disables power to peripheral modules (e.g., sensors, LEDs) in IoT edge nodes. IC Role / Device Role / Timing Role: Low-side load switch controlled by GPIO; provides clean on/off sequencing with minimal leakage. Use Value: IDSS ≤ -0.2 µA at 150 °C ensures <1 µW standby power loss per channel in always-on systems. |
| DC-DC Converter Synchronous Rectifier | Industrial Relay Driver |
Use Scenario: Replaces catch diode in non-isolated buck converters for 5–24 V input rails. IC Role / Device Role / Timing Role: Synchronous rectifier operating in discontinuous conduction mode (DCM); body diode conducts reverse recovery before gate turn-on. Use Value: RDS(on) = 1.8 Ω limits conduction loss to <0.83 W at 0.68 A, improving efficiency over Schottky alternatives. | Use Scenario: Drives 24 V DC coil relays in programmable logic controllers (PLCs) with EMI suppression. IC Role / Device Role / Timing Role: Low-side switch with dv/dt immunity; handles inductive kickback without external clamping. Use Value: 6 kV/µs rating prevents spurious turn-on during 100 A/µs coil de-energization transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG2305UVT-7 | RDS(on) = 45 mΩ higher at -10 V; Ciss = 190 pF vs. 117 pF | Higher gate charge increases drive power; less suited for high-frequency PWM | Prefer for cost-sensitive designs where 1.8 Ω RDS(on) margin is acceptable |
| IPD250N10N3G | TO-252 package; RDS(on) = 0.95 Ω; VGS(th) = -2.5 V min - not logic-level compatible | Requires gate driver for 3.3 V MCUs; superior thermal performance but larger footprint | Select when >0.68 A current or lower RDS(on) is required and board space permits DPAK |
Compared with DMG2305UVT-7 and IPD250N10N3G, BSP316PL6327HTSA1 uniquely balances logic-level drivability, SOT-223 compactness, and dv/dt ruggedness-making it optimal for space-constrained industrial controls where gate drive simplicity and transient immunity are prioritized over ultra-low RDS(on).
Availability
BSP316PL6327HTSA1 is available at Aetrix Electronics and suitable for reverse polarity protection, low-voltage load switching, and industrial relay driving requiring stable component supply and long-term manufacturability.
Supply support for BSP316PL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
This part belongs to the SIPMOS™ small-signal MOSFET product line, designed specifically for logic-level-driven, thermally efficient switching in space-constrained industrial and automotive subsystems.
FAQ
Is BSP316PL6327HTSA1 suitable for high-side switching configurations?
Yes. As a P-channel MOSFET with VGS(th) ranging from -1.0 V to -2.0 V, it operates reliably in high-side configurations using simple resistor-based gate pull-up to the supply rail. Its -100 V VDS rating and dv/dt immunity make it appropriate for 24 V and 48 V bus applications where load disconnect and reverse polarity protection are required.
What is the maximum safe operating temperature for continuous use?
The device supports junction temperatures from -55 °C to +150 °C. For continuous operation, thermal design must ensure Tj remains ≤150 °C under worst-case ambient and power dissipation conditions. With RthJA = 48 K/W (6 cm² copper), maximum allowable Ptot at 70 °C ambient is approximately 1.67 W.
Does BSP316PL6327HTSA1 include an integrated body diode?
Yes. It features a monolithic parasitic body diode with forward voltage VSD ≤ 1.2 V at -0.68 A and reverse recovery time trr = 44.2–55.3 ns. This diode supports freewheeling in buck converters and reverse-current blocking in protection circuits, though external Schottky diodes may be added for faster recovery if needed.
Can this MOSFET be driven directly from a 3.3 V microcontroller GPIO?
Yes. With a typical VGS(th) of -1.5 V and guaranteed -1.0 V minimum, the device fully enhances at |VGS| ≥ 3.3 V. No level shifter or gate driver is required, simplifying PCB layout and reducing BOM count in low-power embedded systems.
BSP316PL6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 680mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 1.8Ohm @ 680mA, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 170µA
- Gate Charge (Qg) (Max) @ Vgs:
- 6.4 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 146 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4-21
BSP316PL6327HTSA1 FAQ
1.How can I place an order for BSP316PL6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP316PL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP316PL6327HTSA1 reliable?
The price and inventory of BSP316PL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP316PL6327HTSA1 is usually 5 days.
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For technical support, including BSP316PL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP316PL6327HTSA1 requirements.
6.How does Aetrix verify that BSP316PL6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BSP316PL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP316PL6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BSP316PL6327HTSA1?
All BSP316PL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP316PL6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP316PL6327HTSA1 part is unused and in its original packaging.
Return procedure for BSP316PL6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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