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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSP318SH6327XTSA1

Name: BSP318SH6327XTSA1
Brand: Infineon Technologies
SKU: BSP318SH6327XTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSP318SH6327XTSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: BSP318SH6327XTSA1.pdf

Description:: MOSFET N-CH 60V 2.6A SOT223-4

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Product details

Overview

BSP318SH6327XTSA1 from Infineon Technologies is an N-channel enhancement-mode SIPMOS™ logic-level power MOSFET in PG-SOT223 package, rated for 60 V V_DS, 2.6 A continuous drain current, and 0.09 Ω R_DS(on) at V_GS = 10 V. It features avalanche rating (60 mJ single-pulse), dv/dt ruggedness (6 kV/µs), and AEC-Q101 qualification for automotive use in load switching and motor control circuits.

For engineers reviewing the BSP318SH6327XTSA1 datasheet, BSP318SH6327XTSA1 pinout, BSP318SH6327XTSA1 application, or BSP318SH6327XTSA1 equivalent, key selection criteria include logic-level gate drive compatibility (V_GS(th) = 1.2–1.6 V), low R_DS(on) at 4.5 V (0.12 Ω max), thermal resistance (R_thJA = 70 K/W with 6 cm² copper), and integrated body diode recovery (t_rr = 50–75 ns).

Technical Context

This MOSFET employs a trench-based SIPMOS process optimized for fast switching and robust unclamped inductive switching (UIS) performance. Its gate threshold voltage range (1.2–1.6 V) ensures reliable turn-on with 3.3 V or 5 V microcontroller outputs, while the 0.09 Ω R_DS(on) at 10 V supports efficient low-voltage DC-DC and load-switching applications up to 2.6 A continuous.

The device integrates a fast-recovery body diode (Q_rr = 0.1–0.15 µC, t_rr = 50–75 ns) and exhibits high dv/dt immunity (6 kV/µs), enabling stable operation in noisy automotive environments without external snubbers. Thermal design is supported by validated R_thJS = 17 K/W (junction-to-soldering point) and R_thJA = 70 K/W on standard FR4 PCBs.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	60 V - Maximum blocking voltage for 12 V/24 V automotive and industrial supply rails
R_DS(on) @ V_GS = 10 V	0.09 Ω - Enables ≤0.6 W conduction loss at 2.6 A, suitable for thermally constrained SMT layouts
I_D continuous	2.6 A - Rated for sustained current in fan drivers, LED arrays, and solenoid interfaces
E_AS	60 mJ - Supports unclamped inductive switching in relay and motor coil driving without external clamping
t_r/t_f	15–25 ns - Enables >1 MHz PWM operation in synchronous buck converters and Class-D amplifiers
Q_g total	14 nC - Low gate charge reduces driver power and enables direct MCU GPIO drive with minimal buffering
V_GS(th)	1.2–1.6 V - Guaranteed turn-on with 3.3 V logic, eliminating need for level-shifting circuitry

Pinout & Package

PG-SOT223 package with exposed drain pad (Pin 4) for thermal dissipation. Pin 1 = Gate, Pins 2 & 4 = Drain (internally connected), Pin 3 = Source.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1	Gate	Control terminal; accepts logic-level input (1.2–1.6 V threshold); requires <14 nC charge for full turn-on
Pins 2 & 4	Drain	High-side or low-side switch node; electrically tied; exposed pad provides primary thermal path to PCB
Pin 3	Source	Reference node for gate drive; connects to load return or ground; carries full switched current (2.6 A)

Key Features

Feature	Design Value
Avalanche-rated operation	60 mJ single-pulse energy handling enables robustness against inductive kickback in motor and relay loads
Logic-level gate drive	V_GS(th) ≤1.6 V ensures full enhancement with 3.3 V microcontrollers, reducing BOM count
dv/dt ruggedness	6 kV/µs rating prevents false triggering in high-noise automotive ECU and powertrain modules
Integrated fast body diode	50–75 ns reverse recovery time supports freewheeling in half-bridge and H-bridge topologies
AEC-Q101 qualified	Validated for automotive temperature range (−55 °C to +150 °C) and reliability stress testing

Applications

Automotive Body Control Module (BCM)

Industrial PLC Output Stage

Use Scenario: Driving 12 V incandescent lamps, solenoids, and small fans in vehicle door modules and lighting controllers.

IC Role / Device Role / Timing Role: Low-side load switch with integrated body diode for inductive load flyback suppression.

Use Value: Eliminates external flyback diode; 0.09 Ω R_DS(on) limits self-heating to <0.6 W at 2.6 A, enabling compact SMT layout.

Use Scenario: Solid-state replacement for electromechanical relays in programmable logic controller digital output cards.

IC Role / Device Role / Timing Role: High-speed, high-reliability switching element controlling 24 V DC actuators and indicator LEDs.

Use Value: 15–25 ns switching times support >10 kHz PWM modulation; AEC-Q101 qualification ensures field longevity beyond industrial spec.

USB-C Power Delivery Load Switch

Brushed DC Motor Driver (Low-Power)

Use Scenario: Inrush current limiting and fault isolation in USB-C PD sink applications with 5–20 V input rails.

IC Role / Device Role / Timing Role: Controlled high-side or low-side power switch activated via system MCU GPIO.

Use Value: Logic-level gate enables direct 3.3 V MCU control; 60 V rating accommodates transient surges up to ±20 V per USB-C spec.

Use Scenario: Bidirectional drive of small brushed DC motors (e.g., HVAC dampers, camera gimbals) in battery-powered devices.

IC Role / Device Role / Timing Role: Half-bridge low-side switch paired with complementary high-side FET or driver IC.

Use Value: Fast t_rr (50–75 ns) and low Q_rr minimize shoot-through risk and switching losses during direction reversal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN3028LSD-13	R_DS(on) = 0.028 Ω @ 10 V (lower), but V_DS = 30 V only; SOT-23-6 package	Not suitable for 48 V or automotive 60 V bus systems due to lower breakdown rating	Select when 30 V max and ultra-low R_DS(on) are prioritized over voltage margin and thermal mass
IPB180N04S4-02	V_DS = 40 V, I_D = 180 A, TO-263 package; higher current, larger footprint	Designed for high-power motor drives, not space-constrained SMT load switching	Choose for >10 A applications requiring parallel devices or heatsink mounting

Compared with DMN3028LSD-13 and IPB180N04S4-02, BSP318SH6327XTSA1 uniquely balances 60 V rating, logic-level drive, SOT223 thermal capability, and AEC-Q101 compliance-making it optimal for mid-power automotive and industrial switching where voltage margin, board space, and qualification matter.

Availability

BSP318SH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC output stages, and USB-C power delivery load switching requiring stable component supply and long-term lifecycle assurance.

Supply support for BSP318SH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.

This part belongs to Infineon's SIPMOS™ Small-Signal Transistor product line, engineered for high-reliability, logic-compatible switching in automotive and industrial environments where avalanche robustness and thermal efficiency are critical.

FAQ

Is BSP318SH6327XTSA1 suitable for 3.3 V microcontroller gate drive?

Yes. With a guaranteed gate threshold voltage of 1.2–1.6 V and full enhancement at V_GS = 4.5 V, this MOSFET reliably switches on using standard 3.3 V GPIO outputs. Its 14 nC total gate charge ensures minimal driver loading, and no external level shifter is required for typical MCU interface scenarios.

What is the maximum continuous drain current at 85 °C ambient?

At T_A = 85 °C with standard PCB layout (6 cm² copper), the derated continuous drain current is approximately 1.8 A, based on the published P_tot vs. T_A curve and R_thJA = 70 K/W. This assumes adequate copper area and natural convection cooling without forced airflow.

Does BSP318SH6327XTSA1 include a built-in body diode?

Yes. It integrates a monolithic fast-recovery body diode with forward voltage V_SD = 0.95–1.2 V at 5.2 A and reverse recovery time t_rr = 50–75 ns. This diode supports freewheeling in inductive loads and eliminates the need for discrete external diodes in many half-bridge and flyback configurations.

How does the avalanche rating impact real-world reliability?

The 60 mJ single-pulse avalanche energy rating allows the device to safely absorb inductive energy spikes-such as those from relay coils or motor windings-without failure. This capability is validated per AEC-Q101, making it suitable for automotive applications where transient overvoltage events are common and external protection is cost-sensitive.

BSP318SH6327XTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: SIPMOS®

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 60 V

Current - Continuous Drain (Id) @ 25°C:: 2.6A (Tj)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 90mOhm @ 2.6A, 10V

Vgs(th) (Max) @ Id:: 2V @ 20µA

Gate Charge (Qg) (Max) @ Vgs:: 20 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 380 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.8W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4

BSP318SH6327XTSA1 FAQ

1.How can I place an order for BSP318SH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP318SH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP318SH6327XTSA1 reliable?

The price and inventory of BSP318SH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP318SH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSP318SH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP318SH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP318SH6327XTSA1?

BSP318SH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP318SH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP318SH6327XTSA1?

For technical support, including BSP318SH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP318SH6327XTSA1 requirements.

6.How does Aetrix verify that BSP318SH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSP318SH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP318SH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSP318SH6327XTSA1?

All BSP318SH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP318SH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP318SH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSP318SH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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